DE3729532A1 - Method for wiring small domestic electrical apparatuses - Google Patents

Method for wiring small domestic electrical apparatuses

Info

Publication number
DE3729532A1
DE3729532A1 DE19873729532 DE3729532A DE3729532A1 DE 3729532 A1 DE3729532 A1 DE 3729532A1 DE 19873729532 DE19873729532 DE 19873729532 DE 3729532 A DE3729532 A DE 3729532A DE 3729532 A1 DE3729532 A1 DE 3729532A1
Authority
DE
Germany
Prior art keywords
electrical apparatuses
domestic electrical
small domestic
contacts
substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873729532
Other languages
German (de)
Other versions
DE3729532C2 (en
Inventor
Willi J Schmidt
Rolf Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHMIDT, WILLI J., 5431 NIEDERAHR, DE
Original Assignee
Rowenta Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE3725802A external-priority patent/DE3725802C2/en
Application filed by Rowenta Werke GmbH filed Critical Rowenta Werke GmbH
Priority to DE19873729532 priority Critical patent/DE3729532A1/en
Priority to FR8810411A priority patent/FR2619277B1/en
Priority to GB8818566A priority patent/GB2208568A/en
Publication of DE3729532A1 publication Critical patent/DE3729532A1/en
Application granted granted Critical
Publication of DE3729532C2 publication Critical patent/DE3729532C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatus For Making Beverages (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The connecting contacts of electrical components in the interior of small domestic electrical apparatuses can be connected only in a very time-consuming and costly manner. A method for connecting the contacts by means of electrically conductive materials which can be poured on and whose subsequent reduction in surface area indicates a means for mechanising the connection of the contacts.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung von elektrischen Haushaltskleingeräten, beispielsweise elektrischen Kaffeemaschinen oder dergleichen, gemäß P 37 25 803.6, wobei innerhalb des der Aufnahme der elektrischen Anschlüsse verschiedener Baugruppen dienenden Gerätehohlraumes die elektrische Verschaltung der Baugruppen untereinander ausgeführt sind.The invention relates to a method for producing small electrical household appliances, for example electric coffee machines or the like, according to P 37 25 803.6, being within the the inclusion of the electrical connections of various assemblies serving device cavity the electrical circuit of the assemblies are executed with each other.

Im Hauptpatent sind Maßnahmen angegeben, mit deren Hilfe die Verdrahtung der einzelnen Baugruppen und deren elektrische Anschlüsse in einem elektrischen Haushaltskleingerät bei geringem Kostenaufwand weitestgehend automatisiert werden kann.The main patent specifies measures with whose help the wiring of the individual modules and their electrical connections in an electrical Small household appliance at low cost can be largely automated.

Der vorliegenden Erfindung liegt demgegenüber die Aufgabe zugrunde, verbesserte Möglichkeiten zur praktischen Anwendung des Verfahrens bei elektrischen Haushaltskleingeräten oder ähnlichen zu bringen. The present invention is in contrast Task based, improved opportunities for practical application of the method in electrical Bring small household appliances or similar.  

Diese Aufgabe wird durch die kennzeichnenden Merkmale des Hauptanspruches gelöst. Der sich hieran anschließende Unteranspruch 2 beinhaltet eine weitere Ausgestaltung des Hauptanspruches.This task is characterized by the characteristics of the main claim solved. The subsequent one Sub-claim 2 contains a further embodiment of the main claim.

Hierdurch wird erreicht, daß die Verschaltung der in einer Ebene angeordneten Kontakte vorgenommen werden kann. Eine aus nicht brennbarem oder schwer entflammbarem Material gefertigte Scheibe wird über die Kontaktstifte der zu verbindenden Teile geschoben. Die Verbindungsleiter zwischen den Kontaktstiften bestehen zunächst aus einem rieselfähigen, pulverförmigen Gut, das dem Verlauf der gewünschten Verbindungsbahnen entsprechend auf die Oberfläche der Scheibe geschüttet wird. Um ein sauberes Aufbringen des Gutes zu ermöglichen, kann zum Aufschütten eine Schüttmaske verwendet werden. Die leitenden Stoffe können granulat- bis pulverförmig gestaltet sein und eine unterschiedliche Raumform aufweisen. Es ist denkbar, daß die Stoffe aus homogenen Bestandteilen, wie z.B. Kupfer, Zinn, Messing, Aluminium, Silber o. ä. bestehen; sie können aber auch aus heterogenen Materialien, wie z.B. einer Mischung aus Kupfer und Zinn, Aluminium und Zinn o. ä. zusammengesetzt sein.This ensures that the interconnection of the in contacts arranged on one level can. One made from non-flammable or flame-retardant Material made disc is over the contact pins of the parts to be connected. The There is a connecting conductor between the contact pins first of all from a free-flowing, powdery material, that the course of the desired connecting tracks accordingly poured onto the surface of the disc becomes. To ensure a clean application of the goods can make a pouring mask be used. The conductive substances can to be powdery and a different one Have spatial shape. It is conceivable that the fabrics are made of homogeneous components, e.g. Copper, tin, brass, Aluminum, silver or the like exist; but you can too from heterogeneous materials, e.g. a mixture of Composed of copper and tin, aluminum and tin or similar be.

Nach Aufschütten der Leiterbahnen auf die Oberfläche der Scheibe werden die lose aufgeschütteten Leiterbahnmaterialien einer Oberflächenverkleinerung unterzogen. Die Oberfläche wird durch Wärmeeinwirkung verkleinert; es ist aber auch eine Oberflächenverkleinerung durch Sintern, Eingießen eines flüssigen nach dem Eingießen erstarrenden elektrisch leitenden Stoffes, wie z.B. Lötzinn o. ä. denkbar.After pouring the conductor tracks onto the surface of the The loosely piled up disc Surface reduction conductor track materials subjected. The surface is affected by heat downsized; but it is also one  Surface reduction by sintering, pouring one liquid electrically solidifying after pouring conductive substance, e.g. Soldering tin or the like is conceivable.

Entscheidend bei der Oberflächenverkleinerung ist, daß die aufgetragenen Stoffe durch die Oberflächenverkleinerung strukturstützend und oberflächenverfestigend wirksam werden, so daß eine gute elektrische Leitfähigkeit der aufgetragenen pulverförmigen Stoffe gewährleistet ist.The decisive factor in reducing the surface area is that the applied substances by the Surface reduction and structural support surface hardening effect, so that a good electrical conductivity of the applied powdery substances is guaranteed.

Um einen sauberen Verlauf der pulverförmigen Leiterbahnen zu erzielen, kann die scheibenartige Trägerplatte eine Oberflächenstruktur aufweisen, die den Verlauf der Leiterbahn vorgibt. In diese strukturierte Oberfläche werden die leitfähigen Stoffe eingegeben, bevor sie einer Oberflächenverkleinerung unterzogen werden. Um eine Beschädigung der scheibenförmigen Trägerplatte zu verhindern, kann die Oberfläche der scheibenartigen Trägerplatte durch eine Maske während der Oberflächenverkleinerung abgedeckt werden. Durch die Maske werden nur die vorgegebenen Leiterbahnen aus leitfähigen Stoffen den Oberflächenverkleinerungsmaßnahmen ausgesetzt, so daß eine Beschädigung der Trägerplatte nicht eintreten kann. Auf diese Weise ist es möglich, die scheibenförmige Trägerplatte aus thermoplastischem Material zu fertigen und beim Kunststoffspritzen der Trägerplatte die gewünschten Leiterbahnen durch rinnenartige Vertiefungen in der Platte vorzusehen und bereits die Durchtrittslöcher der zu verbindenden elektrischen Kontaktstifte auszusparen.To ensure a clean course of the powdery Achieving conductor tracks can be disc-like Carrier plate have a surface structure that specifies the course of the conductor track. In these structured surfaces become the conductive substances entered before making a surface reduction be subjected. To damage the to prevent disc-shaped carrier plate Surface of the disk-like carrier plate by a Mask covered during surface reduction will. Through the mask, only the specified ones Conductors made of conductive materials Surface reduction measures exposed so that the carrier plate cannot be damaged. In this way it is possible to make the disc-shaped To manufacture carrier plate from thermoplastic material and when plastic injection molding the carrier plate desired conductor tracks through groove-like depressions to be provided in the plate and already the Through holes of the electrical to be connected Cut out contact pins.

Claims (2)

1. Verfahren zur Herstellung von elektrischen Haushaltskleingeräten gemäß P 37 25 803.6, dadurch gekennzeichnet, daß die elektrischen Verbindungsleitungen aus elektrisch leitenden Stoffen großer Oberfläche homogener oder heterogener Zusammensetzung pulverförmig der gewünschten Leiterbahn folgend aufgetragen werden und anschließend diese Stoffe einer Oberflächenverkleinerung unterzogen werden.1. A process for the production of small electrical household appliances according to P 37 25 803.6, characterized in that the electrical connecting lines made of electrically conductive substances having a large surface area of homogeneous or heterogeneous composition are applied in powder form to the desired conductor track and then these substances are subjected to a surface reduction. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß mehrere unterschiedliche Stoffe voneinander getrennt aufgetragen werden.2. The method according to claim 1, characterized in that several different substances separated from each other be applied.
DE19873729532 1987-08-04 1987-09-04 Method for wiring small domestic electrical apparatuses Granted DE3729532A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19873729532 DE3729532A1 (en) 1987-08-04 1987-09-04 Method for wiring small domestic electrical apparatuses
FR8810411A FR2619277B1 (en) 1987-08-04 1988-08-02 METHOD FOR ELECTRICALLY CONNECTING SMALL ELECTRIC HOUSEHOLD APPLIANCES AND DEVICE FOR CARRYING OUT SAID METHOD
GB8818566A GB2208568A (en) 1987-08-04 1988-08-04 Method of manufacturing electrical circuits in small domestic electrical appliances

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3725802A DE3725802C2 (en) 1986-08-16 1987-08-04 Fuel delivery device
DE19873729532 DE3729532A1 (en) 1987-08-04 1987-09-04 Method for wiring small domestic electrical apparatuses

Publications (2)

Publication Number Publication Date
DE3729532A1 true DE3729532A1 (en) 1989-05-24
DE3729532C2 DE3729532C2 (en) 1993-08-26

Family

ID=25858262

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873729532 Granted DE3729532A1 (en) 1987-08-04 1987-09-04 Method for wiring small domestic electrical apparatuses

Country Status (1)

Country Link
DE (1) DE3729532A1 (en)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS ERMITTELT *

Also Published As

Publication number Publication date
DE3729532C2 (en) 1993-08-26

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