DE3718267A1 - Electrical composite material - Google Patents
Electrical composite materialInfo
- Publication number
- DE3718267A1 DE3718267A1 DE19873718267 DE3718267A DE3718267A1 DE 3718267 A1 DE3718267 A1 DE 3718267A1 DE 19873718267 DE19873718267 DE 19873718267 DE 3718267 A DE3718267 A DE 3718267A DE 3718267 A1 DE3718267 A1 DE 3718267A1
- Authority
- DE
- Germany
- Prior art keywords
- fibers
- electrical composite
- composite material
- silica
- composite materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Die Erfindung betrifft elektrische Verbundwerkstoffe, sogenannte Laminate für bzw. wie Leiterplatten, Printed Wiring Boards, Platinen, Rigid Borards und dergleichen. Derartige Verbund werkstoffe, auch Composites genannt, bestehen hauptsächlich aus einem aus Fasern bestehenden Flächengebilde, das z. B. mit (Kunst-)Harz imprägniert ist.The invention relates to electrical composite materials, so-called laminates for or like printed circuit boards, printed wiring Boards, boards, rigid borards and the like. Such composite materials, also called composites, mainly exist from a fabric consisting of fibers, the z. B. is impregnated with (synthetic) resin.
Der Erfindung liegt die Aufgabe zugrunde, derartige elektrische Verbundwerkstoffe zu verbessern.The invention is based, such to improve electrical composite materials.
Diese Aufgabe wird durch den Gegenstand des Anspruchs 1 gelöst.This object is solved by the subject matter of claim 1.
Die Erfindung ist besonders geeignet für sogenannte gedruckte elektrische und elektronische Schaltungen.The invention is particularly suitable for so-called printed ones electrical and electronic circuits.
Bevorzugte Ausführungsformen werden durch folgende Maßnahmen erreicht:Preferred embodiments are by the following measures reached:
1) Verwendung von Silica-Fasern (Kieselsäurefasern):
hergestellt entsprechend Deutschem Patent 29 00 991.
2) Verwendung von Silica-Fasern (entsprechend 1) die folgende
Eigenschaften aufweisen:1) Use of silica fibers (silica fibers): produced in accordance with German Patent 29 00 991.
2) Use of silica fibers (corresponding to 1) which have the following properties:
Zugfestigkeit:200-1000 MPa E-Modul:10-100 GPa Dielektrizitätszahl:3,6-4,0 (20%, 1 MHz) Spezif. elektr. Widerstand:<10¹⁵ Ω · cm (10₁₈) Therm. Ausdehnungskoeffizient:<0,8 × 10-6 K-1 (0,6 × 10-6) SiO₂:99,6 Gew.-% Dichte:1,6 - 2,2 g/cm³ (<2,0 g/cm³)Tensile strength: 200-1000 MPa modulus of elasticity: 10-100 GPa dielectric constant: 3.6-4.0 (20%, 1 MHz) spec. electr. Resistance: <10¹⁵ Ω · cm (10₁₈) therm. Expansion coefficient: <0.8 × 10 -6 K -1 (0.6 × 10 -6 ) SiO₂: 99.6 wt .-% density: 1.6 - 2.2 g / cm³ (<2.0 g / cm³)
3) Verwendung dadurch, daß3) Use in that
- a) Silica-Stapelfasern (Länge 3-30 mm, insbesondere 8-15 mm) nach bekannten Verfahren auf z. B. Papier vliesmaschinen zu Vliesen verarbeitet werden mit einem Flächengewicht von 10-200 g/m², bevorzugt unter 100 g/m², und diese Vliese der Laminierung zugeführt werden.a) Silica staple fibers (length 3-30 mm, in particular 8-15 mm) by known methods on z. B. paper Nonwovens machines are processed with a nonwoven Weight per unit area of 10-200 g / m², preferably below 100 g / m², and these nonwovens fed to the lamination will.
- b) Silica-Filamentgarne (Titer z. B. 68 tex) nach bekannten Verfahren zu Geweben verarbeitet werden mit einem Flächengewicht im Bereich 50 g/m² bis 400 g/m², bevorzugt unter 200 g/m² und diese Gewebe der Laminierung (Harz-Imprägnierung) zugeführt werden.b) silica filament yarns (titer e.g. 68 tex) according to known Processes to be processed with a fabric Basis weight in the range from 50 g / m² to 400 g / m², preferably less than 200 g / m² and these fabrics of Lamination (resin impregnation) are supplied.
4) Silica-Stapelfasern oder Filamentgarne (entsprechend 1-3)
werden vor ihrer Weiterverarbeitung zu Vliesen oder
Geweben mit geeigneten Avivagen (spin finish) imprägniert,
die die Verarbeitungseigenschaften günstig beeinflussen.
5) Um die Haftung der Stapelfasern im Vlies zu einem
organischen Binder bzw. zum Harz und die Haftung des
Gewebes zum Harz zu verbessern, werden vor der Laminierung
geeignete Haftvermittler (z. B. Aminosilan) aufgebracht.
6) Die Laminierung erfolgt nach bekannten Verfahren, ver
wendbar sind alle bekannten Harze (z. B. Epoxy, Phenol).4) Silica staple fibers or filament yarns (corresponding to 1-3) are impregnated with suitable finishing agents (spin finish) before they are further processed into nonwovens or fabrics, which have a favorable effect on the processing properties.
5) In order to improve the adhesion of the staple fibers in the fleece to an organic binder or to the resin and the adhesion of the fabric to the resin, suitable adhesion promoters (e.g. aminosilane) are applied before lamination.
6) The lamination is carried out according to known methods, all known resins can be used (e.g. epoxy, phenol).
Um in den Laminaten (Leiterplatten, printed wiring boards)
besondere thermische, elektrische Eigenschaften
(Dielektrizitätszahl/Feuchtigkeitsaufnahme) zu verwirk
lichen, werden bevorzugt Harze mit hoher Glasumwandlungs
temperatur und niedriger Dielektrizitätszahl bzw. hohem
Flammpunkt (FR-4 Epoxy) angewandt.
7) Die nach 1) bis 6) hergestellten Verbundwerkstoffe
(Leiterplatten) zeichnen sich aus durch gute Form
stabilität (thermischer Ausdehnungskoeffizient kleiner
13 ppm/°C in x-y-Richtung, insbesondere kleiner 8 ppm/°C),
niedrige Dielektrizitätszahl (kleiner 4,2 bei 1 MHz,
20°C, insbesondere kleiner 4,0) und eigenen sich insbe
sondere für "surface mounting technology" (SMT) für
Einheiten mit hoher Packungsdichte und hoher Übertragungs
geschwindigkeit bei hohen Frequenzen (Mikrowellen im
GHz-Bereich) mit niedriger kapazitiver Kopplung.
8) Verwendung von Fasermischungen aus Silica-Fasern und
Kohlenstoff-Fasern (Carbon Fibers), Aramid-Fasern,
Quarz-Fasern und/oder Glas-Fasern.In order to achieve special thermal, electrical properties (dielectric constant / moisture absorption) in the laminates (printed circuit boards, printed circuit boards), resins with a high glass transition temperature and low dielectric constant or high flash point (FR-4 epoxy) are preferably used.
7) The composite materials (printed circuit boards) manufactured according to 1) to 6) are characterized by good shape stability (thermal expansion coefficient less than 13 ppm / ° C in the xy direction, in particular less than 8 ppm / ° C), low dielectric constant (less than 4, 2 at 1 MHz, 20 ° C, especially less than 4.0) and are particularly suitable for "surface mounting technology" (SMT) for units with a high packing density and high transmission speed at high frequencies (microwaves in the GHz range) with low capacitive coupling.
8) Use of fiber mixtures made of silica fibers and carbon fibers (carbon fibers), aramid fibers, quartz fibers and / or glass fibers.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873718267 DE3718267A1 (en) | 1987-05-30 | 1987-05-30 | Electrical composite material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873718267 DE3718267A1 (en) | 1987-05-30 | 1987-05-30 | Electrical composite material |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3718267A1 true DE3718267A1 (en) | 1988-12-08 |
Family
ID=6328770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873718267 Withdrawn DE3718267A1 (en) | 1987-05-30 | 1987-05-30 | Electrical composite material |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3718267A1 (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1074123A (en) * | 1963-07-26 | 1967-06-28 | Ass Elect Ind | Improvements relating to insulating/conductive composite refractory bodies |
DE2900990A1 (en) * | 1979-01-12 | 1980-07-24 | Akzo Gmbh | Silica fibres for friction linings in clutches or brakes - made by extruding sodium silicate into fibres which are treated with acid to form silica |
US4375493A (en) * | 1981-08-20 | 1983-03-01 | Subtex, Inc. | Refractory coated and conductive layer coated flame resistant insulating fabric composition |
US4396661A (en) * | 1981-08-20 | 1983-08-02 | Subtex, Inc. | Refractory coated and dielectric coated flame resistant insulating fabric composition |
DE3510753A1 (en) * | 1984-05-04 | 1985-11-07 | Akzo Gmbh, 5600 Wuppertal | HIGH TEMPERATURE RESISTANT SILICON DIOXIDE FIBER MATERIAL |
GB2159290A (en) * | 1984-05-22 | 1985-11-27 | Stc Plc | Cables containing amorphous metals |
DE2900991C2 (en) * | 1979-01-12 | 1986-08-28 | Akzo Gmbh, 5600 Wuppertal | Silica fibers |
DE3534944A1 (en) * | 1985-10-01 | 1987-04-09 | Bayer Ag | CATALYTIC HYDRATION PROCESS |
DE3536883A1 (en) * | 1985-10-16 | 1987-04-16 | Isola Werke Ag | BASIC MATERIAL FOR PRINTED CIRCUITS |
-
1987
- 1987-05-30 DE DE19873718267 patent/DE3718267A1/en not_active Withdrawn
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1074123A (en) * | 1963-07-26 | 1967-06-28 | Ass Elect Ind | Improvements relating to insulating/conductive composite refractory bodies |
DE2900990A1 (en) * | 1979-01-12 | 1980-07-24 | Akzo Gmbh | Silica fibres for friction linings in clutches or brakes - made by extruding sodium silicate into fibres which are treated with acid to form silica |
DE2900991C2 (en) * | 1979-01-12 | 1986-08-28 | Akzo Gmbh, 5600 Wuppertal | Silica fibers |
US4375493A (en) * | 1981-08-20 | 1983-03-01 | Subtex, Inc. | Refractory coated and conductive layer coated flame resistant insulating fabric composition |
US4396661A (en) * | 1981-08-20 | 1983-08-02 | Subtex, Inc. | Refractory coated and dielectric coated flame resistant insulating fabric composition |
DE3510753A1 (en) * | 1984-05-04 | 1985-11-07 | Akzo Gmbh, 5600 Wuppertal | HIGH TEMPERATURE RESISTANT SILICON DIOXIDE FIBER MATERIAL |
GB2159290A (en) * | 1984-05-22 | 1985-11-27 | Stc Plc | Cables containing amorphous metals |
DE3534944A1 (en) * | 1985-10-01 | 1987-04-09 | Bayer Ag | CATALYTIC HYDRATION PROCESS |
DE3536883A1 (en) * | 1985-10-16 | 1987-04-16 | Isola Werke Ag | BASIC MATERIAL FOR PRINTED CIRCUITS |
Non-Patent Citations (2)
Title |
---|
DE-Z: Elektronik Produktion & Prüftechnik, Nov. 1985, S.990-992 * |
DE-Z: Galvanotechnik, 78, 1987,Nr.3, S.807/808 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20010041546A (en) | Glass fiber strands coated with thermally conductive inorganic particles and products including the same | |
KR20010041521A (en) | Inorganic particle-coated glass fiber strands and products including the same | |
US3878316A (en) | Laminate comprising non-woven fibrous backing | |
CN112813684A (en) | Low-dielectric electronic-grade glass fiber cloth and production method thereof | |
US3052583A (en) | Method for manufacturing resinbonded products made from inorganic fibers | |
DE3718267A1 (en) | Electrical composite material | |
JP7115853B2 (en) | Prepregs and laminates with uniform dielectric properties | |
KR100362304B1 (en) | Composite Laminates for Printed Circuit Boards | |
KR930019920A (en) | Fabric prepreg and preparation method thereof | |
JP6684095B2 (en) | Glass cloth, prepreg, and printed wiring board | |
US11116078B2 (en) | Prepregs and laminates having homogeneous dielectric properties | |
JPH0261131A (en) | Fabric for printed wiring board | |
JP7235705B2 (en) | Prepregs and laminates with uniform dielectric properties | |
RU2032949C1 (en) | Process of manufacture of electric insulation material | |
JPH11200218A (en) | Heat-resistant nonwoven fabric | |
JP2551249B2 (en) | Composite laminate | |
JPH0679722A (en) | Glass cloth, resin-impregnated medium and wiring substrate | |
JPS6225505B2 (en) | ||
JPH07115444B2 (en) | Copper clad laminate | |
JPH05140873A (en) | Production of glass cloth for reinforcing resin | |
Egusa et al. | Effects of Fabric Type, Specimen Size, and Irradiation Atmosphere on the Radiation Resistance of Polymer Composites at 77 K | |
JPS6336943B2 (en) | ||
JPH0226733A (en) | Printed circuit board | |
JPH07226571A (en) | Glass fiber woven cloth for printed wiring board and its manufacture | |
JPH0681273A (en) | Glass cloth, resin impregnated substrate and wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: AKZO PATENTE GMBH, 5600 WUPPERTAL, DE |
|
8130 | Withdrawal |