JPH0679722A - Glass cloth, resin-impregnated medium and wiring substrate - Google Patents

Abstract

PURPOSE:To provide glass cloth which enables void free impregnation of resin and improve resistance of a substrate to temperatures. CONSTITUTION:The device is integrally composed of a glass cloth of which whole area is impregnated with 0.01-20wt.% of resin and dried, a resin impregnated medium which consists of glass cloth impregnated with resin and dried, as require, and specified number of sheets of the medium of which top sides and the bottom sides or only the bottom sides are applied with metal foil.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board used for electronic equipment, electric equipment, calculators, communication equipment, etc., a resin-impregnated base material, and a glass cloth used therefor.

[0002]

2. Description of the Related Art In recent years, wiring boards such as glass cloth-based electrical laminates, printed wiring boards, and multilayer printed wiring boards have been widely used as a measure for increasing the reliability and density of electrical and electronic equipment. As for the glass cloth, 50 to 800 filaments of micron order are bundled into a strand, which is twisted to form a yarn (single yarn), which is 25 m.
Since about 15 to 60 vertical and horizontal lines are driven into the glass cloth to form a glass cloth, it is not easy to even impregnate the resin evenly to the end of the glass cloth, and voids remain and heat resistance of the wiring board Was hindering.

[0003]

As described in the prior art, it is not easy to impregnate a glass cloth with a resin without voids. The present invention has been made in view of the above problems in the prior art, the object is to provide a glass cloth that can be resin-impregnated without voids,
It is intended to improve the heat resistance of the wiring board by using the glass cloth for the resin-impregnated base material and the wiring board.

[0004]

The present invention has a 0.01
To 20% by weight (hereinafter simply referred to as "%") of a resin, and a glass cloth characterized by being dried, and a resin impregnated group characterized by impregnating the glass cloth with a resin and drying if necessary. Since the wiring board is characterized in that a metal foil is provided on the upper surface and / or the lower surface of the material and the required number of the resin-impregnated base materials, the resin can be uniformly impregnated to the end of the glass cloth. Since the heat resistance of the wiring board can be improved, the present invention will be described in detail below.

The glass cloth used in the present invention includes E glass (non-alkali glass) and C glass (alkali-containing glass).
Although they are used together, it is preferable to use E-glass (non-alkali glass), and the filaments, yarns, the number of threads, the thickness, etc. are not particularly limited, and they can be used in the shape of woven cloth, non-woven cloth, mat, or the like. Examples of the resin include phenol resin, unsaturated polyester resin, epoxy resin, polyimide resin, vinyl ester resin, polyphenylene oxide resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene sulfide resin, fluororesin, etc. However, a resin having a low resin concentration of about 0.1 to 10% is preferable because the wettability is good, and the resin adhesion amount is 0.01 to
20%. That is, if it is less than 0.01%, the resin impregnation property to the glass cloth is poor, and if it exceeds 20%, the resin impregnation property also deteriorates. Resin-impregnated resin for resin-treated glass cloth is phenol resin, unsaturated polyester resin, epoxy resin, polyimide resin, vinyl ester resin, polyphenylene oxide resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene sulfide resin, fluorine. Resin alone,
Modified products, mixtures, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, fiber fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers, A curing agent, a curing accelerator, a coloring agent, a solvent and the like can be added. Furthermore, the resin may be impregnated only with the same resin,
It is desirable to make a plurality of impregnations such as primary impregnation and secondary impregnation with the same type of resin or different type of resin so that the impregnation becomes more uniform. Thus, the base material is impregnated with the resin and then dried by heating if necessary to obtain a resin-impregnated base material.
As metal foil, copper, aluminum, brass, nickel,
A single material such as iron, an alloy, or a composite foil can be used. In this way, the wiring board is obtained by arranging and integrating the metal foil on the required number of upper and / or lower surfaces of the resin-impregnated base material. The present invention will be described below based on examples.

[0006]

EXAMPLE A plain woven glass cloth having a thickness of 0.18 mm, a weight of 210 g / m ² , and a number of hammered-in of 42 lengthwise and 32 widthwise was impregnated with a 1% solution of an epoxy resin and dried to obtain a resin-treated glass cloth. A glass cloth was impregnated with a 60% solution of a curing agent-containing epoxy resin so that a resin adhesion amount was 45%, and dried to obtain a resin-impregnated base material. Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on the upper and lower surfaces of the eight resin-impregnated base materials stacked on each other is heated and pressure-molded at 160 ° C. for 90 minutes at a molding pressure of 40 Kg / cm ² , and a thickness of 1 is obtained. A 0.6 mm double-sided copper-clad wiring board was obtained.

[0007]

Comparative Example A 60% solution of a curing agent-containing epoxy resin was impregnated in the same plain woven glass cloth as in the example so that the amount of resin adhered was 45%, and dried to obtain a resin-impregnated base material. Then, the resin-impregnated base material was treated in the same manner as in the example to obtain a double-sided copper-clad wiring board having a thickness of 1.6 mm.

Table 1 shows the performance of the resin-impregnated base material and the wiring board of Examples and Comparative Examples. The number of voids in the resin-impregnated base material was examined by using a microscope. The heat resistance after the moisture absorption treatment is the time taken for the sample to boil for 4 hours and then placed on the molten solder at 260 ° C. until an abnormality occurs.

[0009]

[Table 1]

[0010]

The present invention is constructed as described above.
It was confirmed that the resin-impregnated base material and the wiring board using the glass cloth having the structure described in the claims have less voids, the heat resistance is improved, and the present invention is excellent.

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Claims (3)

[Claims] 1. A glass cloth, which is obtained by impregnating the entire surface with 0.01 to 20% by weight of a resin and drying. 2. A resin-impregnated base material, which is obtained by impregnating the entire surface with 0.01 to 20% by weight of a resin, impregnating a dried glass cloth with the resin, and, if necessary, drying. 3. A glass cloth which has been impregnated with 0.01 to 20% by weight of resin on the entire surface, and has been impregnated with resin on a dried glass cloth.
A wiring board comprising a metal foil arranged and integrated.