DE3687208D1 - Montage eines hybriden schaltkreises auf einer leiterplatte. - Google Patents
Montage eines hybriden schaltkreises auf einer leiterplatte.Info
- Publication number
- DE3687208D1 DE3687208D1 DE8686304915T DE3687208T DE3687208D1 DE 3687208 D1 DE3687208 D1 DE 3687208D1 DE 8686304915 T DE8686304915 T DE 8686304915T DE 3687208 T DE3687208 T DE 3687208T DE 3687208 D1 DE3687208 D1 DE 3687208D1
- Authority
- DE
- Germany
- Prior art keywords
- pcb
- assembly
- hybrid circuit
- hybrid
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Connecting Device With Holders (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/773,756 US4658330A (en) | 1985-09-09 | 1985-09-09 | Mounting a hybrid circuit to a circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3687208D1 true DE3687208D1 (de) | 1993-01-14 |
DE3687208T2 DE3687208T2 (de) | 1993-07-01 |
Family
ID=25099219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686304915T Expired - Fee Related DE3687208T2 (de) | 1985-09-09 | 1986-06-25 | Montage eines hybriden schaltkreises auf einer leiterplatte. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4658330A (de) |
EP (1) | EP0216447B1 (de) |
JP (1) | JPS6261338A (de) |
DE (1) | DE3687208T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4760335A (en) * | 1985-07-30 | 1988-07-26 | Westinghouse Electric Corp. | Large scale integrated circuit test system |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
US4758927A (en) * | 1987-01-21 | 1988-07-19 | Tektronix, Inc. | Method of mounting a substrate structure to a circuit board |
US4950981A (en) * | 1989-04-14 | 1990-08-21 | Tektronix, Inc. | Apparatus for testing a circuit board |
DE4102265A1 (de) * | 1991-01-26 | 1992-07-30 | Telefunken Electronic Gmbh | Gehaeuse kfz-elektronik |
DE4417586A1 (de) * | 1993-08-03 | 1995-02-09 | Hewlett Packard Co | Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern |
US5410451A (en) * | 1993-12-20 | 1995-04-25 | Lsi Logic Corporation | Location and standoff pins for chip on tape |
US6008991A (en) * | 1993-12-20 | 1999-12-28 | Lsi Logic Corporation | Electronic system including packaged integrated circuits with heat spreading standoff support members |
US5923538A (en) * | 1994-10-17 | 1999-07-13 | Lsi Logic Corporation | Support member for mounting a microelectronic circuit package |
US5731542A (en) * | 1996-05-23 | 1998-03-24 | Motorola, Inc. | Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate |
US10206288B2 (en) * | 2015-08-13 | 2019-02-12 | Palo Alto Research Center Incorporated | Bare die integration with printed components on flexible substrate |
US10165677B2 (en) | 2015-12-10 | 2018-12-25 | Palo Alto Research Center Incorporated | Bare die integration with printed components on flexible substrate without laser cut |
US10847384B2 (en) | 2017-05-31 | 2020-11-24 | Palo Alto Research Center Incorporated | Method and fixture for chip attachment to physical objects |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4042861A (en) * | 1973-11-08 | 1977-08-16 | Citizen Watch Company Limited | Mounting arrangement for an integrated circuit unit in an electronic digital watch |
US4255003A (en) * | 1975-11-13 | 1981-03-10 | Tektronix, Inc. | Electrical connector |
US4251852A (en) * | 1979-06-18 | 1981-02-17 | International Business Machines Corporation | Integrated circuit package |
BE893780A (nl) * | 1982-07-07 | 1983-01-07 | Bell Telephone Mfg | Samenstel van elektronische componenten |
EP0103067B1 (de) * | 1982-09-09 | 1989-01-04 | Siemens Aktiengesellschaft | Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen |
JPS59502003A (ja) * | 1982-11-09 | 1984-11-29 | シリコン コネクシヨン,インコ−ポレ−テツド | 電子回路チツプ接続アツセンブリおよび方法 |
EP0148820B1 (de) * | 1983-07-11 | 1988-10-12 | Silicon Connection, Inc. | Chipverbindungsanordnung und methode |
-
1985
- 1985-09-09 US US06/773,756 patent/US4658330A/en not_active Expired - Fee Related
-
1986
- 1986-06-25 DE DE8686304915T patent/DE3687208T2/de not_active Expired - Fee Related
- 1986-06-25 EP EP86304915A patent/EP0216447B1/de not_active Expired - Lifetime
- 1986-09-09 JP JP61212509A patent/JPS6261338A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
DE3687208T2 (de) | 1993-07-01 |
JPS6261338A (ja) | 1987-03-18 |
US4658330A (en) | 1987-04-14 |
JPH0453101B2 (de) | 1992-08-25 |
EP0216447A3 (en) | 1989-07-19 |
EP0216447B1 (de) | 1992-12-02 |
EP0216447A2 (de) | 1987-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |