DE3678812D1 - Verfahren und mittel zum greifen und befoerdern von siliziumplaettchen. - Google Patents

Verfahren und mittel zum greifen und befoerdern von siliziumplaettchen.

Info

Publication number
DE3678812D1
DE3678812D1 DE8686420002T DE3678812T DE3678812D1 DE 3678812 D1 DE3678812 D1 DE 3678812D1 DE 8686420002 T DE8686420002 T DE 8686420002T DE 3678812 T DE3678812 T DE 3678812T DE 3678812 D1 DE3678812 D1 DE 3678812D1
Authority
DE
Germany
Prior art keywords
grapping
silicon plates
transporting silicon
transporting
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686420002T
Other languages
English (en)
Inventor
Henry Rey-Herme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre Stephanois de Recherches Mecaniques Hydromecanique et Frottement SA
Original Assignee
Centre Stephanois de Recherches Mecaniques Hydromecanique et Frottement SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Stephanois de Recherches Mecaniques Hydromecanique et Frottement SA filed Critical Centre Stephanois de Recherches Mecaniques Hydromecanique et Frottement SA
Application granted granted Critical
Publication of DE3678812D1 publication Critical patent/DE3678812D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE8686420002T 1986-01-06 1986-01-06 Verfahren und mittel zum greifen und befoerdern von siliziumplaettchen. Expired - Lifetime DE3678812D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19860420002 EP0228973B1 (de) 1986-01-06 1986-01-06 Verfahren und Mittel zum Greifen und Befördern von Siliziumplättchen

Publications (1)

Publication Number Publication Date
DE3678812D1 true DE3678812D1 (de) 1991-05-23

Family

ID=8196378

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686420002T Expired - Lifetime DE3678812D1 (de) 1986-01-06 1986-01-06 Verfahren und mittel zum greifen und befoerdern von siliziumplaettchen.

Country Status (2)

Country Link
EP (1) EP0228973B1 (de)
DE (1) DE3678812D1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2627760B1 (fr) * 1988-02-26 1993-01-22 Stephanois Rech Mec Dispositif pour le transfert d'articles d'au moins un organe support a au moins un autre organe support
DE3915038A1 (de) * 1989-05-08 1990-11-22 Balzers Hochvakuum Halte- und transportvorrichtung fuer eine scheibe
US6474712B1 (en) 1999-05-15 2002-11-05 Applied Materials, Inc. Gripper for supporting substrate in a vertical orientation
US7290813B2 (en) 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
CN105470350A (zh) * 2015-12-30 2016-04-06 无锡赛晶太阳能有限公司 一种点接触式花篮筐
CN112820678B (zh) * 2019-11-18 2022-12-09 至微半导体(上海)有限公司 一种湿法工艺设备的晶圆顶片导片装置
CN112676705B (zh) * 2020-12-09 2022-09-13 内蒙古兴固科技有限公司 一种硅晶片蚀刻方法
CN112497114B (zh) * 2020-12-17 2022-07-19 苏州博莱特石英有限公司 一种石英承载装置
CN113097104B (zh) * 2021-03-25 2022-08-02 青岛天仁微纳科技有限责任公司 一种方形基片的生产设备及其生产方法
CN115148639B (zh) * 2022-07-12 2023-04-07 上海申和投资有限公司 一种免交叉污染的晶圆槽式清洗机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4306731A (en) * 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
US4436474A (en) * 1982-01-04 1984-03-13 Western Electric Co., Inc. Selecting articles from an array thereof
US4493606A (en) * 1982-05-24 1985-01-15 Proconics International, Inc. Wafer transfer apparatus
FR2567160B1 (fr) * 1984-07-09 1994-04-01 Recif Procede et moyens de prehension et de transport de plaquettes de sillicium

Also Published As

Publication number Publication date
EP0228973B1 (de) 1991-04-17
EP0228973A1 (de) 1987-07-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee