DE3664343D1 - Process for producing on an insulator substrate an oriented single silicon crystal film with localized faults - Google Patents
Process for producing on an insulator substrate an oriented single silicon crystal film with localized faultsInfo
- Publication number
- DE3664343D1 DE3664343D1 DE8686400800T DE3664343T DE3664343D1 DE 3664343 D1 DE3664343 D1 DE 3664343D1 DE 8686400800 T DE8686400800 T DE 8686400800T DE 3664343 T DE3664343 T DE 3664343T DE 3664343 D1 DE3664343 D1 DE 3664343D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- crystal film
- silicon crystal
- insulator substrate
- single silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 239000013078 crystal Substances 0.000 title 1
- 239000012212 insulator Substances 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/34—Single-crystal growth by zone-melting; Refining by zone-melting characterised by the seed, e.g. by its crystallographic orientation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8506000A FR2580672B1 (fr) | 1985-04-19 | 1985-04-19 | Procede de fabrication sur un support isolant d'un film de silicium monocristallin oriente et a defauts localises |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3664343D1 true DE3664343D1 (en) | 1989-08-17 |
Family
ID=9318452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686400800T Expired DE3664343D1 (en) | 1985-04-19 | 1986-04-15 | Process for producing on an insulator substrate an oriented single silicon crystal film with localized faults |
Country Status (5)
Country | Link |
---|---|
US (1) | US4678538A (de) |
EP (1) | EP0202977B1 (de) |
JP (1) | JPS621220A (de) |
DE (1) | DE3664343D1 (de) |
FR (1) | FR2580672B1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2580673B1 (fr) * | 1985-04-19 | 1987-09-25 | Haond Michel | Procede de fabrication sur un support isolant d'un film de silicium monocristallin oriente et a defauts localises |
JPS6265317A (ja) * | 1985-09-17 | 1987-03-24 | Mitsubishi Electric Corp | 半導体単結晶膜形成のためのウエハ構造 |
EP0227076B1 (de) * | 1985-12-20 | 1992-06-17 | Agency Of Industrial Science And Technology | Verfahren zur Herstellung einer monokristallinen dünnen Schicht |
EP0286855A1 (de) * | 1987-04-15 | 1988-10-19 | BBC Brown Boveri AG | Verfahren zum Aetzen von Vertiefungen in ein Siliziumsubstrat |
US4888302A (en) * | 1987-11-25 | 1989-12-19 | North American Philips Corporation | Method of reduced stress recrystallization |
FR2628444A1 (fr) * | 1988-03-11 | 1989-09-15 | Dutartre Didier | Procede de fabrication d'une couche de silicium sur isolant |
JP3470623B2 (ja) * | 1998-11-26 | 2003-11-25 | ソニー株式会社 | 窒化物系iii−v族化合物半導体の成長方法、半導体装置の製造方法および半導体装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4350561A (en) * | 1980-05-16 | 1982-09-21 | Spire Corporation | Single crystal processes and products |
US4536251A (en) * | 1984-06-04 | 1985-08-20 | Xerox Corporation | Method for eliminating laser-induced substrate fissures associated with crystallized silicon areas |
-
1985
- 1985-04-19 FR FR8506000A patent/FR2580672B1/fr not_active Expired
-
1986
- 1986-04-15 EP EP86400800A patent/EP0202977B1/de not_active Expired
- 1986-04-15 DE DE8686400800T patent/DE3664343D1/de not_active Expired
- 1986-04-19 JP JP61091161A patent/JPS621220A/ja active Pending
- 1986-04-21 US US06/853,906 patent/US4678538A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS621220A (ja) | 1987-01-07 |
FR2580672A1 (fr) | 1986-10-24 |
EP0202977A1 (de) | 1986-11-26 |
EP0202977B1 (de) | 1989-07-12 |
FR2580672B1 (fr) | 1987-05-15 |
US4678538A (en) | 1987-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |