DE3661844D1 - Improvement in depositing metal powders on a substrate using laser - Google Patents

Improvement in depositing metal powders on a substrate using laser

Info

Publication number
DE3661844D1
DE3661844D1 DE8686303045T DE3661844T DE3661844D1 DE 3661844 D1 DE3661844 D1 DE 3661844D1 DE 8686303045 T DE8686303045 T DE 8686303045T DE 3661844 T DE3661844 T DE 3661844T DE 3661844 D1 DE3661844 D1 DE 3661844D1
Authority
DE
Germany
Prior art keywords
laser
improvement
substrate
metal powders
depositing metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8686303045T
Other languages
English (en)
Inventor
William Junior Reichenbecker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEG Westinghouse Industrial Automation Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Application granted granted Critical
Publication of DE3661844D1 publication Critical patent/DE3661844D1/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/32—Process control of the atmosphere, e.g. composition or pressure in a building chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/70—Recycling
    • B22F10/73—Recycling of powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • B22F2003/1052—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding assisted by energy absorption enhanced by the coating or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8686303045T 1985-04-22 1986-04-22 Improvement in depositing metal powders on a substrate using laser Expired DE3661844D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/725,449 US4612208A (en) 1985-04-22 1985-04-22 Coupling aid for laser fusion of metal powders

Publications (1)

Publication Number Publication Date
DE3661844D1 true DE3661844D1 (en) 1989-02-23

Family

ID=24914607

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686303045T Expired DE3661844D1 (en) 1985-04-22 1986-04-22 Improvement in depositing metal powders on a substrate using laser

Country Status (5)

Country Link
US (1) US4612208A (de)
EP (1) EP0199589B1 (de)
JP (1) JPS61245988A (de)
CA (1) CA1283005C (de)
DE (1) DE3661844D1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068493B2 (ja) * 1986-04-22 1994-02-02 三菱電機株式会社 貴金属被覆方法
SE463213B (sv) * 1988-05-06 1990-10-22 Ibm Svenska Ab Anordning och foerfarande foer att foerse ett metallsubstrat med en stoetbestaendig yta
JP4077888B2 (ja) * 1995-07-21 2008-04-23 株式会社東芝 セラミックス回路基板
ES2140340B1 (es) * 1998-03-13 2000-10-16 Mecanismos Aux Es Ind S A M A Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos.
JP2006332220A (ja) * 2005-05-25 2006-12-07 Nagoya Institute Of Technology 金属薄膜形成方法
JP5531179B2 (ja) 2011-03-24 2014-06-25 日本碍子株式会社 Ｃｕ薄板処理方法
US8674230B2 (en) 2011-09-15 2014-03-18 Hubbell Incorporated Wave gripping core sleeve
CN102864453B (zh) * 2012-09-12 2015-09-02 常州大学 激光熔覆原位合成硼化物陶瓷涂层及其制备方法
US9028353B1 (en) * 2014-03-14 2015-05-12 ZPE Licensing Inc. Super charger components
US9421637B2 (en) * 2014-03-14 2016-08-23 ZPE Licensing Inc. Super charger components
US11041558B2 (en) * 2014-03-14 2021-06-22 ZPE Licensing Inc. Super charger components
US10655723B2 (en) * 2014-03-14 2020-05-19 ZPE Licensing Inc. Super charger components
US10851884B2 (en) * 2014-03-14 2020-12-01 ZPE Licensing Inc. Super charger components
CN104209516B (zh) * 2014-08-13 2016-06-22 东莞劲胜精密组件股份有限公司 一种在塑胶壳体上成型天线或电路的方法
EP3204223A4 (de) * 2014-10-05 2018-12-19 EOS GmbH Electro Optical Systems 3d-drucker und einsatzstoffe für 3d-drucker
US10794663B2 (en) 2017-05-11 2020-10-06 ZPE Licensing Inc. Laser induced friction surface on firearm
CN111036911B (zh) * 2019-12-31 2021-10-19 西安交通大学 一种基于在线监测的金属增材制造构件孔隙缺陷清除方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2196128A (en) * 1936-03-27 1940-04-02 Acheson Colloids Corp Coating and impregnating composition and method of coating surfaces
US2866057A (en) * 1952-05-16 1958-12-23 Sprague Electric Co Printed electrical resistor
US3716406A (en) * 1971-05-04 1973-02-13 Hughes Aircraft Co Method for making a cadmium sulfide thin film sustained conductivity device
CA1035675A (en) * 1974-01-07 1978-08-01 Avco Everett Research Laboratory Formation of surface layer casings on articles
US4117302A (en) * 1974-03-04 1978-09-26 Caterpillar Tractor Co. Method for fusibly bonding a coating material to a metal article
DE2446634B1 (de) * 1974-09-30 1976-02-12 Siemens Ag Zweischichten-sinterkontaktstueck fuer elektrische schaltgeraete
US4048459A (en) * 1975-10-17 1977-09-13 Caterpillar Tractor Co. Method of and means for making a metalic bond to powdered metal parts
CH593757A5 (en) * 1975-11-10 1977-12-15 Hoffmann Ag Geb Welding coated metal sheets using laser beam - so coating need not be removed before welding, esp. in mfg. cans for foodstuffs
JPS54113850A (en) * 1978-02-24 1979-09-05 Japan Synthetic Rubber Co Ltd Pressureesensitive resistance body
DD146873A1 (de) * 1979-11-20 1981-03-04 Guenter Schieferdecker Kontaktschicht fuer elektrische kontaktflaechen auf leiterplatten
IN159370B (de) * 1982-01-15 1987-05-09 Ciba Geigy Ag
US4532191A (en) * 1982-09-22 1985-07-30 Exxon Research And Engineering Co. MCrAlY cladding layers and method for making same

Also Published As

Publication number Publication date
CA1283005C (en) 1991-04-16
US4612208A (en) 1986-09-16
JPS61245988A (ja) 1986-11-01
EP0199589A1 (de) 1986-10-29
EP0199589B1 (de) 1989-01-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AEG WESTINGHOUSE INDUSTRIAL AUTOMATION CORP., SOME

8328 Change in the person/name/address of the agent

Free format text: SCHROETER, H., DIPL.-PHYS. FLEUCHAUS, L., DIPL.-ING. LEHMANN, K., DIPL.-ING., 8000 MUENCHEN WEHSER, W., DIPL.-ING., 3000 HANNOVER GALLO, W., DIPL.-ING. (FH), PAT.-ANWAELTE, 8900 AUGSBURG

8339 Ceased/non-payment of the annual fee