DE3641679C2 - - Google Patents

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Publication number
DE3641679C2
DE3641679C2 DE19863641679 DE3641679A DE3641679C2 DE 3641679 C2 DE3641679 C2 DE 3641679C2 DE 19863641679 DE19863641679 DE 19863641679 DE 3641679 A DE3641679 A DE 3641679A DE 3641679 C2 DE3641679 C2 DE 3641679C2
Authority
DE
Germany
Prior art keywords
titanium
copper
lead
soft solder
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19863641679
Other languages
German (de)
Other versions
DE3641679A1 (en
Inventor
Wolfgang Dr.-Ing. 8755 Alzenau De Boehm
Juergen Dr.-Ing. 6456 Langenselbold De Hausselt
Wolfgang Dipl.-Ing. Dr. 6000 Frankfurt De Weise
Willi 8750 Aschaffenburg De Malikowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Priority to DE19863641679 priority Critical patent/DE3641679A1/en
Publication of DE3641679A1 publication Critical patent/DE3641679A1/en
Application granted granted Critical
Publication of DE3641679C2 publication Critical patent/DE3641679C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/403—Refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube

Description

Die Erfindung betrifft die Verwendung einer Weichlotlegierung zum Verbinden von Keramikteilen untereinander oder mit Teilen aus Metallen, insbesondere zum Verbinden von Aluminiumoxidteilen mit Teilen aus Kupfer.The invention relates to the use of a soft solder alloy for connecting ceramic parts to each other or with parts made of metal, especially for joining of aluminum oxide parts with parts made of copper.

Der Einsatz keramischer Bauteile in der modernen Werkstofftechnik ist weitgehend von geeigneten Fügeverfahren abhängig.The use of ceramic components in modern materials technology is largely of suitable joining processes dependent.

Von den Verfahren zur Verbindung von Keramikteilen untereinander oder mit Metallen wird derzeit meist das Metallisieren der Keramik nach der Mangan-Molybdän-Methode mit anschließendem Verbinden über die Metallschichten durch Löten angewendet. Dabei wird eine etwa 25-50 µm starke Suspensionsschicht bestehend aus 10-20% Manganpulver und 80-90% Molybdänpulver auf die Keramik aufgetragen. Beim anschließenden Einbrennen unter Wasserstoff mit entsprechendem Taupunkt erfolgt eine teilweise Oxidation der Pulver. Die Oxide bilden eine Verbindung (Spinelle) mit der Keramik. Zur besseren Benetzung durch die Lote wird noch eine Nickelschicht aufgebracht. Dieses Verfahren ist aufgrund der notwendigen Arbeitsschritte aufwendig und teuer.Of the processes for connecting ceramic parts to one another or metallization is currently mostly used with metals the ceramic using the manganese-molybdenum method then connecting through the metal layers Soldering applied. This is about 25-50 microns thick Suspension layer consisting of 10-20% manganese powder and 80-90% molybdenum powder applied to the ceramic. Subsequent baking under hydrogen with the corresponding A partial oxidation of the dew point occurs Powder. The oxides form a compound (spinels) with of ceramics. For better wetting by the solders another layer of nickel applied. This procedure is complex and due to the necessary work steps expensive.

In letzter Zeit kommen immer mehr Aktivlote auf Silber-Kupfer-Basis mit Titan-, Zirkon- oder Hafnium-Zusätzen zum Direktverbinden von Keramik mit Metallen zum Einsatz. In recent times, more and more active solders based on silver-copper have been coming with titanium, zirconium or hafnium additives for the direct connection of ceramics with metals for Commitment.  

Damit lassen sich Ausdehnungslegierungen (FeNi- und FeNiCo-Legierungen) und z. B. Al₂O₃ vakuumdicht mit guten Festigkeiten unter Schutzgas oder im Vakuum verbinden.Expansion alloys (FeNi and FeNiCo alloys) and z. B. Al₂O₃ vacuum-tight with good Combine strengths under protective gas or in a vacuum.

Versuche, mit diesen Hartloten beispielsweise Kupfer- und Aluminiumoxid-Bauteile zu verbinden, erwiesen sich als recht schwierig. Einmal löst die AgCu-Lotschmelze bei Temperaturen über dem eutektischen Punkt je nach Zusammensetzung sehr stark das Kupfer des Bauteils auf. Das kann zur vollständigen Auflösung sehr dünner Kupfer-Bauteile (z. B. Membranen) führen. Andererseits ist die Differenz der thermischen Ausdehnungskoeffizienten zwischen Kupfer und Aluminiumoxid sehr groß. Das führt beim Abkühlen nach dem Löten zu Spannungen in den Grenzzonen der Verbindungsschicht. Die Festigkeitswerte werden durch die dabei entstehenden Mikrorisse herabgesetzt. Ein großer Anteil der gelöteten Proben weist daher Vakuumlecks auf.Attempts to use these hard solders, for example, copper and aluminum oxide components proved to be as quite difficult. Once the AgCu solder melts at temperatures above the eutectic point depending on Composition very strongly the copper of the component. This can lead to the complete dissolution of very thin copper components (e.g. membranes). On the other hand, it is Difference in the coefficient of thermal expansion very large between copper and aluminum oxide. Leading when cooling after soldering to tension in the border zones the connection layer. The strength values are reduced by the resulting micro cracks. A large proportion of the soldered samples exhibit hence vacuum leaks.

Aus der US-PS 30 01 269 sind Lote zum Direktlöten von Keramik beschrieben, die neben 4 bis 10 Gew.-% Titan und/oder Zirkonium 10 bis 85 Gew.-% Blei, Rest Kupfer, Silber oder Nickel enthalten. In der Praxis enthalten diese Lote 15 bis 35 Gew.-% Blei und 60 bis 80% Kupfer, Silber und Nickel. Diese Lote eignen sich nicht zum Verlöten von z. B. Kupfer mit Aluminiumoxid. Zum Verbinden von Quarzglas mit Metallteilen aus Molybdän, Wolfram oder Tantal kann man gemäß der DE-AS 15 33 542 Lote aus Zinn mit 2 bis 3% Titan verwenden. From US-PS 30 01 269 are solders for direct soldering Ceramic described, in addition to 4 to 10 wt .-% titanium and / or zirconium 10 to 85% by weight lead, balance copper, Contain silver or nickel. Included in practice these solders 15 to 35% by weight lead and 60 to 80% Copper, silver and nickel. These solders are not suitable for soldering z. B. copper with alumina. To the Connecting quartz glass with metal parts made of molybdenum, Tungsten or tantalum can be used according to DE-AS 15 33 542 Use tin solders with 2 to 3% titanium.  

Es war Aufgabe der vorliegenden Erfindung, Weichlotlegierungen zum Verbinden von Keramikteilen untereinander oder mit Teilen aus Metallen zu entwickeln, insbesondere zum Verbinden von Aluminiumoxidteilen mit Teilen aus Kupfer, die ohne vorheriges Metallisieren der Keramikoberflächen anwendbar sind, Kupfer und andere Metallegierungen nicht auflösen und auch größere Unterschiede im Ausdehnungsverhalten der zu verlötenden Teile kompensieren können.It was an object of the present invention, soft solder alloys for connecting ceramic parts to each other or to develop with parts made of metals, in particular for connecting aluminum oxide parts with parts Copper, without the previous metallization of the ceramic surfaces are applicable, copper and other metal alloys do not resolve and also major differences compensate for the expansion behavior of the parts to be soldered can.

Diese Aufgabe wird erfindungsgemäß durch die Verwendung einer Weichlotlegierung gelöst, die 86 bis 99% Blei oder Zinn, 0 bis 13% Silber und/oder Kupfer, 0 bis 10% Indium und 1 bis 10% Titan und/oder Zirkonium und/oder Hafnium enthält.This object is achieved by the use a soft solder alloy, the 86 to 99% lead or tin, 0 to 13% silver and / or copper, 0 to 10% Indium and 1 to 10% titanium and / or zirconium and / or Contains hafnium.

Vorzugsweise verwendet man Weichlotlegierungen folgender Zusammensetzung:Preferably, soft solder alloys are used as follows Composition:

a)86-93% Blei, 1-6% Silber und 1-10% Titan b)86-92% Blei, 4-10% Indium und 1-10% Titan c)88-94% Blei, 2-6% Kupfer und 1-10% Titan d)90-99% Blei und 1-10% Titan e)86-95% Zinn, 1-13% Silber und 1-10% Titan f)86-95% Zinn, 1-12% Silber, 1-5% Kupfer und 1-10% Titana) 86-93% lead, 1-6% silver and 1-10% titanium b) 86-92% lead, 4-10% indium and 1-10% titanium c) 88-94% lead, 2-6% copper and 1-10% titanium d) 90-99% lead and 1-10% titanium e) 86-95% tin, 1-13% silver and 1-10% titanium f) 86-95% tin, 1-12% silver, 1-5% copper and 1-10% titanium

Diese Legierungen lassen sich leicht erschmelzen und zu Formteilen verarbeiten, beispielsweise zu Folien bis 100 µm Stärke und Drähten bis 500 µm Stärke. Sie besitzen Arbeitstemperaturen im Bereich von 700 bis 950°C. These alloys are easy to melt and to Process molded parts, for example into foils up to 100 µm thick and wires up to 500 µm thick. You own Working temperatures in the range from 700 to 950 ° C.  

In Lötversuchen wurden Aluminiumoxidröhrchen ⌀ 5,5 × Ø 8 × 4,5 mm³ und Kupferelektroden mit einem Lot aus 96% Blei und 4% Titan unter Schutzgas (Argon) direktgelötet. Bei den nachfolgenden Tests wurden Festigkeitswerte von 500 bis 800 N ermittelt. Bei Lötungen mit Loten der Zusammensetzung 86% Pb 10%. In 4% Ti wurden Festigkeitswerte von 640-1050 N erreicht. Die gemessenen Leckraten lagen bei 10-8 mbar 1 s-1.In soldering tests, aluminum oxide tubes ⌀ 5.5 × Ø 8 × 4.5 mm³ and copper electrodes were soldered directly with a solder made of 96% lead and 4% titanium under protective gas (argon). In the subsequent tests, strength values of 500 to 800 N were determined. For soldering with solders with the composition 86% Pb 10%. Strength values of 640-1050 N were achieved in 4% Ti. The measured leak rates were 10 -8 mbar 1 s -1 .

Mit diesen Loten konnte auch Stahl auf Oxid- und Nichtoxidkeramiken aufgelötet werden, ohne daß Spannungsrisse in der Keramik erkennbar waren. Die Festigkeiten der Verbindungen lagen bei 35 N/mm².With these solders, steel could also be used on oxide and non-oxide ceramics be soldered on without cracks were recognizable in the ceramics. The strengths of the connections were 35 N / mm².

Claims (7)

1. Verwendung einer Weichlotlegierung zum Verbinden von Keramikteilen untereinander oder mit Teilen aus Metallen, insbesondere zum Verbinden von Aluminiumoxidteilen mit Teilen aus Kupfer, dadurch gekennzeichnet, daß sie 86 bis 99% Blei oder Zinn, 0 bis 13% Silber und/oder Kupfer, 0 bis 10% Indium und 1 bis 10% Titan und/oder Zirkonium und/oder Hafnium enthält.1. Use of a soft solder alloy for connecting ceramic parts to one another or to parts made of metals, in particular for connecting aluminum oxide parts to parts made of copper, characterized in that they contain 86 to 99% lead or tin, 0 to 13% silver and / or copper, 0 contains up to 10% indium and 1 to 10% titanium and / or zirconium and / or hafnium. 2. Verwendung einer Weichlotlegierung nach Anspruch 1, dadurch gekennzeichnet, daß sie 86 bis 93% Blei, 1 bis 6% Silber und 1 bis 10% Titan enthält.2. Use of a soft solder alloy according to claim 1, characterized, that they contain 86 to 93% lead, 1 to 6% silver and 1 to Contains 10% titanium. 3. Verwendung einer Weichlotlegierung nach Anspruch 1, dadurch gekennzeichnet, daß sie 86 bis 92% Blei, 4 bis 10% Indium und 1 bis 10% Titan enthält.3. Use of a soft solder alloy according to claim 1, characterized, that they contain 86 to 92% lead, 4 to 10% indium and 1 to Contains 10% titanium. 4. Verwendung einer Weichlotlegierung nach Anspruch 1, dadurch gekennzeichnet, daß sie 88 bis 94% Blei, 2 bis 6% Kupfer und 1 bis 10% Titan enthält. 4. Use of a soft solder alloy according to claim 1, characterized, that they have 88 to 94% lead, 2 to 6% copper and 1 to Contains 10% titanium.   5. Verwendung einer Weichlotlegierung nach Anspruch 1, dadurch gekennzeichnet, daß sie 90 bis 99% Blei und 1 bis 10% Titan enthält.5. Use of a soft solder alloy according to claim 1, characterized, that they are 90 to 99% lead and 1 to 10% titanium contains. 6. Verwendung einer Weichlotlegierung nach Anspruch 1, dadurch gekennzeichnet, daß sie 86 bis 95% Zinn, 1 bis 13% Silber und 1 bis 10% Titan enthält.6. Use of a soft solder alloy according to claim 1, characterized, that they are 86 to 95% tin, 1 to 13% silver and 1 to Contains 10% titanium. 7. Verwendung einer Weichlotlegierung nach Anspruch 1, dadurch gekennzeichnet, daß sie 86 bis 95% Zinn, 1 bis 12% Silber, 1 bis 5% Kupfer und 1 bis 10% Titan enthält.7. Use of a soft solder alloy according to claim 1, characterized, that they are 86 to 95% tin, 1 to 12% silver, 1 to Contains 5% copper and 1 to 10% titanium.
DE19863641679 1986-02-19 1986-12-05 Use of a soft solder alloy for bonding (connecting) ceramic parts Granted DE3641679A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863641679 DE3641679A1 (en) 1986-02-19 1986-12-05 Use of a soft solder alloy for bonding (connecting) ceramic parts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3605170 1986-02-19
DE19863641679 DE3641679A1 (en) 1986-02-19 1986-12-05 Use of a soft solder alloy for bonding (connecting) ceramic parts

Publications (2)

Publication Number Publication Date
DE3641679A1 DE3641679A1 (en) 1987-08-20
DE3641679C2 true DE3641679C2 (en) 1987-11-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102319962A (en) * 2011-08-24 2012-01-18 哈尔滨工业大学 Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C and preparation method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3001269A (en) * 1954-09-20 1961-09-26 Gen Electric Composite material, brazing alloys and process of manufacture
DE1533542B1 (en) * 1967-02-15 1970-12-17 Inst Materialovedenija Solder connection of optical quartz glass with metals and process for their production

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102319962A (en) * 2011-08-24 2012-01-18 哈尔滨工业大学 Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C and preparation method thereof
CN102319962B (en) * 2011-08-24 2013-04-24 哈尔滨工业大学 Preparation method of Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C

Also Published As

Publication number Publication date
DE3641679A1 (en) 1987-08-20

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