CN102319962B - Preparation method of Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C - Google Patents
Preparation method of Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C Download PDFInfo
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- CN102319962B CN102319962B CN 201110243599 CN201110243599A CN102319962B CN 102319962 B CN102319962 B CN 102319962B CN 201110243599 CN201110243599 CN 201110243599 CN 201110243599 A CN201110243599 A CN 201110243599A CN 102319962 B CN102319962 B CN 102319962B
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Abstract
The invention discloses a preparation method of an Sn-Zn-Ti activated brazing filler metal with a melting point lower than 600 DEG C, which relates to a preparation method of an activated brazing filler metal. The purpose of the invention is to solve the problem on how to realize the good wetting of composite by the brazing filler metal and the good connection between the brazing filler metal and reinforcing phase under 600 DEG C. According to percentage in atomicity, the Sn-Zn-Ti activated brazing filler metal with the melting point lower than 600 DEG C comprises the specific operation steps are as follows: (1) the preparation of an Sn-Ti alloy ingot; and (2) formation. The melting point of the Sn-Zn-Ti activated brazing filler metal with the melting point lower than 600 DEG C prepared by the invention is 400 DEG C to 500 DEG C, the wetting angle is 43.89 to 84.16 degrees, and the strength is 10.56MPa to 42.68MPa. The invention is mainly used for preparing the Sn-Zn-Ti activated brazing filler metal with the melting point lower than 600 DEG C.
Description
Technical field
The present invention relates to a kind of preparation method of active solder.
Background technology
Composite is to answer the Development of Modern Science demand and the material with powerful vitality that emerges.The characteristics such as aluminum matrix composite is little because of its density, fusion temperature is low, high-termal conductivity and cost are low obtain worldwide broad research and increasingly industrialization, have become one of the most frequently used in the metal-base composites, most important material at present.But, the introducing of wild phase, the difficult so that its welding procedure becomes.At present, the connection of aluminum matrix composite mainly comprises melting, Solid-State Welding, soldering three major types, and soldering is short owing to heat time heating time, welding temperature is low, can not cause large damage to strengthening body, butt-welding fitting size, shape etc. have the larger free degree and simple, and are considered to most possibly be used for the method for metal-base composites welding.But the braze ability of aluminium own is bad, and behind the adding wild phase, the wetability of mother metal becomes the topmost problem of brazed aluminum based composites.When adopting the Al-Si brazing filler metal of normal welding aluminium alloy and Zn-Al brazing filler metal to weld, be connected to weak connection between solder-wild phase, linkage interface reacts hardly.So after the wild phase volume fraction increased, conventional Al-Si brazing filler metal or Zn-Al brazing filler metal all can not meet the demands at wetability and the bonding strength of composite material surface.But, because matrices of composite material materials of aluminum fusing point only is 660 ℃, at 600 ℃ burn-off phenomenon will occur, so, brazing temperature realizes that solder be connected to composite good wet, solder and wild phase that to connect be the difficult problem of aluminum matrix composite connection below 600 ℃ the time.
Summary of the invention
The objective of the invention is realizing below 600 ℃ that in order to solve solder to composite good wet and solder and the problem that wild phase well is connected, provides a kind of fusing point to be lower than the preparation method of 600 ℃ Sn-Zn-Ti active solder.
A kind of fusing point of the present invention is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 36% ~ 97%Sn, 2.5% ~ 60%Zn and 0.5% ~ 4%Ti.
A kind of fusing point is lower than that 600 ℃ Sn-Zn-Ti active solder specifically finishes according to the following steps:
One, preparation Sn-Ti alloy pig: melting 20 ~ 50min under 500 ℃ ~ 600 ℃ vacuum condition at first, then casting ingot-forming obtains the Sn-Ti alloy pig; Two, moulding: with Sn-Ti alloy pig fully fusing under 550 ℃ ~ 650 ℃ of step 1 preparation, then add the Zn piece, at 550 ℃ ~ 650 ℃ lower melting 10 ~ 50min, the final Sn-Zn-Ti alloy that forms of cast obtains being comprised of 36% ~ 97%Sn, 2.5% ~ 60%Zn and 0.5% ~ 4%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
A kind of fusing point of the present invention is lower than 600 ℃ Sn-Zn-Ti active solder fusing point about 400 ℃ ~ 500 ℃, and angle of wetting is 43.89 ° ~ 84.16 °, and intensity is 10.56 ~ 42.68MPa; The present invention has not only improved the wetability to composite, and has improved the joint pattern that composite connects, and strength of joint is increased.
Description of drawings
Fig. 1 is the scanning electron microscope (SEM) photograph of the Sn-Zn-Ti solder of the specific embodiment 28, A p-block element p mass fraction is 88.14%Sn, 11.86%Zn among the figure, B p-block element p mass fraction is 3.3%Sn, 96.7%Zn, and C p-block element p mass fraction is 66.73%Sn, 33.27%Ti.Fig. 2 is that the Sn-Zn-Ti solder welding volume fraction of the employing specific embodiment 28 is 45% Si
3N
4The soldered fitting metallographic structure figure of reinforced aluminum matrix composites, the I district is the solder district among the figure, II position diffusion layer, the mother metal of III district for not being diffused.
The specific embodiment
The specific embodiment one: a kind of fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 36% ~ 97%Sn, 2.5% ~ 60%Zn and 0.5% ~ 4%Ti in the present embodiment.
The Sn-Zn-Ti active solder fusing point of present embodiment is about 400 ℃ ~ 500 ℃, and angle of wetting is 43.89 ° ~ 84.16 °, and intensity is 10.56 ~ 42.68MPa.The active element Ti of the welding ceramics that the Sn-Zn-Ti active solder of present embodiment contains can with mother metal in ceramic enhancement phase react, realize the connection between solder-wild phase, can improve solder in the mother metal wettability of the surface; In welding process, interdiffusion phenomenon also occurs in solder and mother metal, Sn Elements Diffusion in the middle of the solder is in the middle of mother metal, thickness of diffusion layer can reach at most 400 μ m, Al element in the middle of the mother metal forms the TiAl compound with the Ti element in the middle of then being diffused into solder, improved the joint pattern that composite connects, strength of joint is increased.
The specific embodiment two: the difference of present embodiment and the specific embodiment one is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 40% ~ 94%Sn, 3% ~ 59%Zn and 1% ~ 3%Ti.
The specific embodiment three: present embodiment and one of the specific embodiment one or two difference are: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 45% ~ 90%Sn, 6% ~ 54.5%Zn and 0.5% ~ 4%Ti.
The specific embodiment four: one of present embodiment and specific embodiment one to three difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 76% ~ 79.5%Sn, 16.5% ~ 23.5%Zn and 0.5% ~ 4%Ti.
The specific embodiment five: one of present embodiment and specific embodiment one to four difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 95%Sn, 4.5%Zn and 0.5%Ti.
The specific embodiment six: one of present embodiment and specific embodiment one to five difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 94%Sn, 4.5%Zn and 1.5%Ti.
The specific embodiment seven: one of present embodiment and specific embodiment one to six difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 93%Sn, 4.5%Zn and 2.5%Ti.
The specific embodiment eight: one of present embodiment and specific embodiment one to seven difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 79.5%Sn, 20%Zn and 0.5%Ti.
The specific embodiment nine: one of present embodiment and specific embodiment one to eight difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 78.5%Sn, 20%Zn and 1.5%Ti.
The specific embodiment ten: one of present embodiment and specific embodiment one to nine difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 77.5%Sn, 20%Zn and 2.5%Ti.
The specific embodiment 11: one of present embodiment and specific embodiment one to ten difference is that described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 58.5%Sn, 40%Zn and 1.5%Ti.
The specific embodiment 12: one of present embodiment and specific embodiment one to 11 difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 57.5%Sn, 40%Zn and 2.5%Ti.
The specific embodiment 13: one of present embodiment and specific embodiment one to 12 difference is: described fusing point is lower than 600 ℃ Sn-Zn-Ti active solder and adopts method of smelting to make by atomicity percentage by 57%Sn, 40%Zn and 3%Ti.
The specific embodiment 14: present embodiment provides a kind of fusing point to be lower than 600 ℃ Sn-Zn-Ti active solder, specifically finishes according to the following steps:
One, preparation Sn-Ti alloy pig: melting 20 ~ 50min under 500 ℃ ~ 600 ℃ vacuum condition at first, then casting ingot-forming obtains the Sn-Ti alloy pig; Two, moulding: with Sn-Ti alloy pig fully fusing under 550 ℃ ~ 650 ℃ of step 1 preparation, then add the Zn piece, at 550 ℃ ~ 650 ℃ lower melting 10 ~ 50min, the final Sn-Zn-Ti alloy that forms of cast obtains being comprised of 36% ~ 97%Sn, 2.5% ~ 60%Zn and 0.5% ~ 4%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The Sn-Zn-Ti active solder fusing point of present embodiment is about 400 ℃ ~ 500 ℃, and angle of wetting is 43.89 ° ~ 84.16 °, and intensity is 10.56 ~ 42.68MPa.The active element Ti of the welding ceramics that the Sn-Zn-Ti active solder of present embodiment contains can with mother metal in ceramic enhancement phase react, realize the connection between solder-wild phase, can improve solder in the mother metal wettability of the surface; In welding process, interdiffusion phenomenon also occurs in solder and mother metal, Sn Elements Diffusion in the middle of the solder is in the middle of mother metal, thickness of diffusion layer can reach at most 400 μ m, Al element in the middle of the mother metal forms the TiAl compound with the Ti element in the middle of then being diffused into solder, improved the joint pattern that composite connects, strength of joint is increased.
The specific embodiment 15: the difference of present embodiment and the specific embodiment 14 is: in the step 1 under 550 ℃ vacuum condition melting 30min, then casting ingot-forming obtains the Sn-Ti alloy pig.
The specific embodiment 16: present embodiment and one of the specific embodiment 14 or 15 difference are: the Sn-Ti alloy pig with the step 1 preparation in the step 2 fully melts under 600 ℃, then add the Zn piece, at 600 ℃ of lower melting 20min, the final Sn-Zn-Ti alloy that forms of cast.
The specific embodiment 17: one of present embodiment and specific embodiment 14 to 16 difference is: obtain in the step 2 being comprised of 40% ~ 94%Sn, 3% ~ 59%Zn and 1% ~ 3%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 18: one of present embodiment and specific embodiment 14 to 17 difference is: obtain in the step 2 being comprised of 45% ~ 90%Sn, 6% ~ 54.5%Zn and 0.5% ~ 4%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 19: one of present embodiment and specific embodiment 14 to 18 difference is: obtain in the step 2 being comprised of 76% ~ 79.5%Sn, 16.5% ~ 23.5%Zn and 0.5% ~ 4%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 20: one of present embodiment and specific embodiment 14 to 19 difference is: obtain in the step 2 being comprised of 95%Sn, 4.5%Zn and 0.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 21: one of present embodiment and specific embodiment 14 to 20 difference is: obtain in the step 2 being comprised of 94%Sn, 4.5%Zn and 1.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 22: one of present embodiment and specific embodiment 14 to 21 difference is: obtain in the step 2 being comprised of 93%Sn, 4.5%Zn and 2.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 23: one of present embodiment and specific embodiment 14 to 22 difference is: obtain in the step 2 being comprised of 79.5%Sn, 20%Zn and 0.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 24: one of present embodiment and specific embodiment 14 to 23 difference is: obtain in the step 2 being comprised of 78.5%Sn, 20%Zn and 1.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 25: one of present embodiment and specific embodiment 14 to 24 difference is: obtain in the step 2 being comprised of 77.5%Sn, 20%Zn and 2.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 26: one of present embodiment and specific embodiment 14 to 25 difference is: obtain in the step 2 being comprised of 58.5%Sn, 40%Zn and 1.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 27: one of present embodiment and specific embodiment 14 to 26 difference is: obtain in the step 2 being comprised of 57.5%Sn, 40%Zn and 2.5%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The specific embodiment 28: one of present embodiment and specific embodiment 14 to 27 difference is: obtain in the step 2 being comprised of 57%Sn, 40%Zn and 3% by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
The Sn-Zn-Ti active solder fusing point of present embodiment is about 400 ℃ ~ 500 ℃, and angle of wetting is 43.89 °, and intensity is 42.68MPa.
In the present embodiment a kind of fusing point be lower than 600 ℃ the Sn-Zn-Ti active solder scanning electron microscope (SEM) photograph as shown in Figure 1, can observe the micro nano structure of Sn-Zn-Ti active solder from Fig. 1.
The Sn-Zn-Ti active solder welding volume fraction that adopts a kind of fusing point in the present embodiment to be lower than 600 ℃ is 45% Si
3N
4Reinforced aluminum matrix composites, 450 ℃ of welding temperatures, weld interval 10min, soldered fitting metallographic structure figure after the welding as shown in Figure 2, as can be seen from Figure 2, interdiffusion phenomenon has occured with mother metal in the Sn-Zn-Ti active solder in welding process, reaches 400 μ m when thickness of diffusion layer is maximum.
Claims (4)
1. a fusing point is lower than the preparation method of 600 ℃ Sn-Zn-Ti active solder: it is characterized in that fusing point is lower than that 600 ℃ Sn-Zn-Ti active solder specifically finishes according to the following steps:
One, preparation Sn-Ti alloy pig: melting 20 ~ 50min under 500 ℃ ~ 600 ℃ vacuum condition at first, then casting ingot-forming obtains the Sn-Ti alloy pig; Two, moulding: with Sn-Ti alloy pig fully fusing under 550 ℃ ~ 650 ℃ of step 1 preparation, then add the Zn piece, at 550 ℃ ~ 650 ℃ lower melting 10 ~ 50min, the final Sn-Zn-Ti alloy that forms of cast obtains being comprised of 36% ~ 97%Sn, 2.5% ~ 60%Zn and 0.5% ~ 4%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
2. a kind of fusing point according to claim 1 is lower than the preparation method of 600 ℃ Sn-Zn-Ti active solder, it is characterized in that obtaining in the step 2 being comprised of 40% ~ 94%Sn, 3% ~ 59%Zn and 1% ~ 3%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
3. a kind of fusing point according to claim 1 is lower than the preparation method of 600 ℃ Sn-Zn-Ti active solder, it is characterized in that obtaining in the step 2 being comprised of 45% ~ 90%Sn, 6% ~ 54.5%Zn and 0.5% ~ 4%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
4. a kind of fusing point according to claim 1 is lower than the preparation method of 600 ℃ Sn-Zn-Ti active solder, it is characterized in that obtaining in the step 2 being comprised of 76% ~ 79.5%Sn, 16.5% ~ 23.5%Zn and 0.5% ~ 4%Ti by atomicity percentage in the Sn-Zn-Ti active solder that fusing point is lower than 600 ℃.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3641679C2 (en) * | 1986-02-19 | 1987-11-12 | Degussa Ag, 6000 Frankfurt, De | |
| CN1146390A (en) * | 1995-09-27 | 1997-04-02 | 中国科学院金属研究所 | Tin-base active flux for soldering ceramic under coarse vacuum condition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0195893A (en) * | 1987-10-08 | 1989-04-13 | Seiko Instr & Electron Ltd | Brazing filler metal |
| JP3803780B2 (en) * | 1996-09-24 | 2006-08-02 | 大日本インキ化学工業株式会社 | Moisture-proof resin composition |
| EP1749616A1 (en) * | 2005-08-05 | 2007-02-07 | Grillo-Werke AG | Process for arc or beam soldering or welding of workpieces from same or different metal or metallic aloys using a Sn-Basis alloy filler; Wire of Tin-basis alloy |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3641679C2 (en) * | 1986-02-19 | 1987-11-12 | Degussa Ag, 6000 Frankfurt, De | |
| CN1146390A (en) * | 1995-09-27 | 1997-04-02 | 中国科学院金属研究所 | Tin-base active flux for soldering ceramic under coarse vacuum condition |
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Application publication date: 20120118 Assignee: Sichuan Langfeng Electronic Material Co., Ltd. Assignor: Harbin Institute of Technology Contract record no.: 2014510000069 Denomination of invention: Preparation method of Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C Granted publication date: 20130424 License type: Exclusive License Record date: 20140702 |
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Effective date of registration: 20170111 Address after: 150001 Harbin, Nangang, West District, large straight street, No. 92 Patentee after: Harbin Polytechnic Univ. Patentee after: Shaoxing Tianlong Tin Materials Co., Ltd. Address before: 150001 Harbin, Nangang, West District, large straight street, No. 92 Patentee before: Harbin Polytechnic Univ. |