DE3635801A1 - Verfahren zum herstellen von leiterplatten mit abgeschirmten koaxialen signalleiterzuegen und danach hergestellte leiterplatten - Google Patents
Verfahren zum herstellen von leiterplatten mit abgeschirmten koaxialen signalleiterzuegen und danach hergestellte leiterplattenInfo
- Publication number
- DE3635801A1 DE3635801A1 DE19863635801 DE3635801A DE3635801A1 DE 3635801 A1 DE3635801 A1 DE 3635801A1 DE 19863635801 DE19863635801 DE 19863635801 DE 3635801 A DE3635801 A DE 3635801A DE 3635801 A1 DE3635801 A1 DE 3635801A1
- Authority
- DE
- Germany
- Prior art keywords
- conductive layer
- signal conductor
- conductor
- signal
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004020 conductor Substances 0.000 claims description 74
- 239000010410 layer Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000002318 adhesion promoter Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000212 poly(isobutyl acrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000001850 reproductive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/005—Manufacturing coaxial lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/788,961 US4646436A (en) | 1985-10-18 | 1985-10-18 | Shielded interconnection boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3635801A1 true DE3635801A1 (de) | 1987-04-23 |
| DE3635801C2 DE3635801C2 (OSRAM) | 1990-06-21 |
Family
ID=25146133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19863635801 Granted DE3635801A1 (de) | 1985-10-18 | 1986-10-17 | Verfahren zum herstellen von leiterplatten mit abgeschirmten koaxialen signalleiterzuegen und danach hergestellte leiterplatten |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4646436A (OSRAM) |
| EP (1) | EP0219817B1 (OSRAM) |
| DE (1) | DE3635801A1 (OSRAM) |
| GB (1) | GB2181901B (OSRAM) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4908939A (en) * | 1985-10-18 | 1990-03-20 | Kollmorgen Corporation | Method of making coaxial interconnection boards |
| US5334962A (en) * | 1987-09-18 | 1994-08-02 | Q-Dot Inc. | High-speed data supply pathway systems |
| US4845311A (en) * | 1988-07-21 | 1989-07-04 | Hughes Aircraft Company | Flexible coaxial cable apparatus and method |
| GB2232822A (en) * | 1989-06-05 | 1990-12-19 | Marconi Co Ltd | Signal carrier support |
| US4972050A (en) * | 1989-06-30 | 1990-11-20 | Kollmorgen Corporation | Wire scribed circuit boards and methods of their manufacture |
| DE69122570T2 (de) * | 1990-07-25 | 1997-02-13 | Hitachi Chemical Co Ltd | Leiterplatte mit Verbindung von Koaxialleitern untereinander |
| US5227588A (en) * | 1991-03-25 | 1993-07-13 | Hughes Aircraft Company | Interconnection of opposite sides of a circuit board |
| US5196087A (en) * | 1991-06-18 | 1993-03-23 | Multimedia Design, Inc. | Method for making multi-layer printed circuit board |
| US5403869A (en) * | 1992-08-17 | 1995-04-04 | Hitachi Chemical Company, Ltd. | Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator |
| US5402088A (en) * | 1992-12-03 | 1995-03-28 | Ail Systems, Inc. | Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits |
| US5378857A (en) * | 1993-01-15 | 1995-01-03 | Advanced Interconnection Technology, Inc. | Directly bondable termination for a fixed discrete wire |
| US6137054A (en) * | 1994-01-25 | 2000-10-24 | Yazaki Corporation | Wire-circuit sheet and electric junction box thereof |
| JP2568052B2 (ja) * | 1994-09-29 | 1996-12-25 | 日本電気データ機器株式会社 | 汎用回路基板における電子回路用配線パターンの形成方法 |
| US5705104A (en) * | 1996-05-10 | 1998-01-06 | Ford Motor Company | Method for embedding conductors in a structure |
| US6584602B2 (en) * | 2001-02-09 | 2003-06-24 | Sun Microsystems, Inc. | Parallelism and crosstalk check on a printed circuit board (PCB) |
| US20080029298A1 (en) * | 2006-08-07 | 2008-02-07 | Roger Allen Booth | Method and Structures for Implementing EMI Shielding for Rigid Cards and Flexible Circuits |
| JP4340700B2 (ja) * | 2007-07-27 | 2009-10-07 | シャープ株式会社 | 電線複合プリント配線基板、電線複合プリント配線基板製造方法、電線部品、電線部品製造方法、および電子機器 |
| KR101613388B1 (ko) * | 2012-03-30 | 2016-04-18 | 히타치가세이가부시끼가이샤 | 다층 배선판 |
| US10187981B2 (en) * | 2014-02-27 | 2019-01-22 | Hitachi Chemical Company, Ltd. | Multi-wire wiring board |
| WO2021020914A1 (ko) * | 2019-07-31 | 2021-02-04 | 주식회사 아이테드 | 투명 발열 필름 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3305622A (en) * | 1964-03-23 | 1967-02-21 | Gen Electric | Shielded and interconnected circuit conductors |
| US3671914A (en) * | 1969-11-10 | 1972-06-20 | Markite Corp | Rotary potentiometer |
| US3969816A (en) * | 1972-12-11 | 1976-07-20 | Amp Incorporated | Bonded wire interconnection system |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1248726B (de) * | 1964-02-18 | 1967-08-31 | Nippon Electric Company Limited Tokio | Magnetdrahtspeichermatrix |
| US3293353A (en) * | 1964-03-30 | 1966-12-20 | Gen Electric | Shielded interconnecting wiring medium |
| US3281627A (en) * | 1964-04-08 | 1966-10-25 | Gen Electric | Circuit board connecting and mounting arrangement |
| US3499215A (en) * | 1964-09-03 | 1970-03-10 | Gen Electric | Capacitive fixed memory system |
| US3469016A (en) * | 1967-11-30 | 1969-09-23 | Hughes Aircraft Co | Interconnection between external shield and internal conductor |
| US3663739A (en) * | 1970-10-26 | 1972-05-16 | Du Pont | Uniform flat cables |
| US3996416A (en) * | 1975-03-18 | 1976-12-07 | Amp Incorporated | Interconnection system and method of assembly |
-
1985
- 1985-10-18 US US06/788,961 patent/US4646436A/en not_active Expired - Lifetime
-
1986
- 1986-10-15 GB GB8624778A patent/GB2181901B/en not_active Expired
- 1986-10-16 EP EP86114328A patent/EP0219817B1/en not_active Expired - Lifetime
- 1986-10-17 DE DE19863635801 patent/DE3635801A1/de active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3305622A (en) * | 1964-03-23 | 1967-02-21 | Gen Electric | Shielded and interconnected circuit conductors |
| US3671914A (en) * | 1969-11-10 | 1972-06-20 | Markite Corp | Rotary potentiometer |
| US3969816A (en) * | 1972-12-11 | 1976-07-20 | Amp Incorporated | Bonded wire interconnection system |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3635801C2 (OSRAM) | 1990-06-21 |
| EP0219817A3 (en) | 1989-10-11 |
| GB2181901B (en) | 1989-09-27 |
| GB2181901A (en) | 1987-04-29 |
| EP0219817A2 (en) | 1987-04-29 |
| US4646436A (en) | 1987-03-03 |
| GB8624778D0 (en) | 1986-11-19 |
| EP0219817B1 (en) | 1993-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: KOLLMORGEN CORP., SIMSBURY, CONN., US |
|
| 8328 | Change in the person/name/address of the agent |
Free format text: PFENNING, J., DIPL.-ING., 1000 BERLIN MEINIG, K., DIPL.-PHYS. BUTENSCHOEN, A., DIPL.-ING. DR.-ING.,PAT.-ANWAELTE, 8000 MUENCHEN BERGMANN, J., DIPL.-ING., PAT.- U. RECHTSANW., 1000 BERLIN NOETH, H., DIPL.-PHYS., PAT.-ANW., 8000 MUENCHEN |
|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: ADVANCED INTERCONNECTION TECHNOLOGY, INC. (N.D.GES |
|
| 8339 | Ceased/non-payment of the annual fee |