DE3583705D1 - Verfahren und vorrichtung zum nachweis von thermischen wellen. - Google Patents

Verfahren und vorrichtung zum nachweis von thermischen wellen.

Info

Publication number
DE3583705D1
DE3583705D1 DE8585303511T DE3583705T DE3583705D1 DE 3583705 D1 DE3583705 D1 DE 3583705D1 DE 8585303511 T DE8585303511 T DE 8585303511T DE 3583705 T DE3583705 T DE 3583705T DE 3583705 D1 DE3583705 D1 DE 3583705D1
Authority
DE
Germany
Prior art keywords
detecting thermal
thermal waves
waves
detecting
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585303511T
Other languages
English (en)
Inventor
Allan Rosencwaig
Walter Lee Smith
Jon Opsal
David L Willenborg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Therma Wave Inc
Original Assignee
Therma Wave Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Therma Wave Inc filed Critical Therma Wave Inc
Application granted granted Critical
Publication of DE3583705D1 publication Critical patent/DE3583705D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws

Landscapes

  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Radiation Pyrometers (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
DE8585303511T 1984-05-21 1985-05-20 Verfahren und vorrichtung zum nachweis von thermischen wellen. Expired - Lifetime DE3583705D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/612,075 US4579463A (en) 1984-05-21 1984-05-21 Detecting thermal waves to evaluate thermal parameters

Publications (1)

Publication Number Publication Date
DE3583705D1 true DE3583705D1 (de) 1991-09-12

Family

ID=24451614

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585303511T Expired - Lifetime DE3583705D1 (de) 1984-05-21 1985-05-20 Verfahren und vorrichtung zum nachweis von thermischen wellen.

Country Status (4)

Country Link
US (1) US4579463A (de)
EP (1) EP0165711B1 (de)
JP (1) JPS612046A (de)
DE (1) DE3583705D1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113358697A (zh) * 2021-04-27 2021-09-07 东南大学 基于非线性调频的高分辨率光热脉冲压缩热成像检测方法

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4589783A (en) * 1984-04-04 1986-05-20 Wayne State University Thermal wave imaging apparatus
US5042952A (en) * 1984-05-21 1991-08-27 Therma-Wave, Inc. Method and apparatus for evaluating surface and subsurface and subsurface features in a semiconductor
US4679946A (en) * 1984-05-21 1987-07-14 Therma-Wave, Inc. Evaluating both thickness and compositional variables in a thin film sample
US4636088A (en) * 1984-05-21 1987-01-13 Therma-Wave, Inc. Method and apparatus for evaluating surface conditions of a sample
US4682897A (en) * 1984-12-10 1987-07-28 Canon Kabushiki Kaisha Light scattering measuring apparatus
US4952063A (en) * 1985-03-01 1990-08-28 Therma-Wave, Inc. Method and apparatus for evaluating surface and subsurface features in a semiconductor
EP0200301A1 (de) * 1985-03-01 1986-11-05 Therma-Wave Inc. Verfahren und Vorrichtung zum Auswerten von Eigenschaften der Oberfläche und des Inneren eines Halbleiters
US4632561A (en) * 1985-04-30 1986-12-30 Therma-Wave, Inc. Evaluation of surface and subsurface characteristics of a sample
US4710030A (en) * 1985-05-17 1987-12-01 Bw Brown University Research Foundation Optical generator and detector of stress pulses
US4790664A (en) * 1985-08-16 1988-12-13 Canon Kabushiki Kaisha Device and method for measuring optical properties
GB2187551B (en) * 1986-03-04 1990-03-14 Gen Electric Plc Radiation detector
US4750822A (en) * 1986-03-28 1988-06-14 Therma-Wave, Inc. Method and apparatus for optically detecting surface states in materials
GB8613622D0 (en) * 1986-06-05 1986-07-09 Smiths Industries Plc Pyrometer systems
GB2197465B (en) * 1986-09-17 1990-05-30 Atomic Energy Authority Uk Crack sizing
US4874948A (en) * 1986-12-29 1989-10-17 Canadian Patents And Development Limited Method and apparatus for evaluating the degree of cure in polymeric composites
US4840496A (en) * 1988-02-23 1989-06-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Noncontact temperature pattern measuring device
EP0367407A3 (de) * 1988-10-14 1990-06-13 British Aerospace Public Limited Company Methode und Vorrichtung zur Steuerung der Ausrichtung eines gesendeten Laserstrahles bei einer Sende-/Empfangsstation mit optischer Nachrichtenübertragung vermittels kohärenter Detektion
US4921348A (en) * 1989-01-26 1990-05-01 Iowa State University Research Foundation, Inc. Method and means for a spatial and temporal probe for laser-generated plumes based on density gradients
DE3926540A1 (de) * 1989-08-11 1991-02-14 Fraunhofer Ges Forschung Verfahren einer laserbestrahlung beschichteter werkstuecke und vorrichtug zur durchfuehrung des verfahrens
US5020920A (en) * 1989-11-03 1991-06-04 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for millimeter-wave detection of thermal waves for materials evaluation
US5074669A (en) * 1989-12-12 1991-12-24 Therma-Wave, Inc. Method and apparatus for evaluating ion implant dosage levels in semiconductors
DD291157A5 (de) * 1989-12-28 1991-06-20 ����@�����@�����@����k�� Anordnung zur thermowellenanalyse von schichtsystemen
US5154512A (en) * 1990-04-10 1992-10-13 Luxtron Corporation Non-contact techniques for measuring temperature or radiation-heated objects
US5769540A (en) * 1990-04-10 1998-06-23 Luxtron Corporation Non-contact optical techniques for measuring surface conditions
US5310260A (en) * 1990-04-10 1994-05-10 Luxtron Corporation Non-contact optical techniques for measuring surface conditions
DE4035266C2 (de) * 1990-11-02 1995-11-16 Jenoptik Jena Gmbh Verfahren und Anordnung zur Thermowellenanalyse
DE4114671A1 (de) * 1991-05-06 1992-11-12 Hoechst Ag Verfahren und messanordnung zur beruehrungslosen on-line messung
DE4114672A1 (de) * 1991-05-06 1992-11-12 Hoechst Ag Verfahren und messanordnung zur beruehrungslosen on-line messung
US5344236A (en) * 1992-01-23 1994-09-06 Fishman Iiya M Method for evaluation of quality of the interface between layer and substrate
US5228776A (en) * 1992-05-06 1993-07-20 Therma-Wave, Inc. Apparatus for evaluating thermal and electrical characteristics in a sample
DE4223337C2 (de) * 1992-07-16 1996-02-22 Jenoptik Jena Gmbh Verfahren und Anordnung zur photothermischen Spektroskopie
US5263776A (en) * 1992-09-25 1993-11-23 International Business Machines Corporation Multi-wavelength optical thermometry
US5391001A (en) * 1993-11-10 1995-02-21 Infratemp, Inc. Thermometer for remote temperature measurements
US5574562A (en) * 1994-12-19 1996-11-12 The Board Of Trustees Of The Leland Stanford Junior University Method and apparatus for evaluation of high temperature superconductors
DE19511869B4 (de) * 1995-03-31 2004-02-26 Geiler, Hans-Dieter, Dr. Verfahren und Anordnung zur Responseanalyse von Halbleitermaterialien mit optischer Anregung
US5657754A (en) * 1995-07-10 1997-08-19 Rosencwaig; Allan Apparatus for non-invasive analyses of biological compounds
US6008906A (en) * 1995-08-25 1999-12-28 Brown University Research Foundation Optical method for the characterization of the electrical properties of semiconductors and insulating films
US5706094A (en) * 1995-08-25 1998-01-06 Brown University Research Foundation Ultrafast optical technique for the characterization of altered materials
US5748318A (en) * 1996-01-23 1998-05-05 Brown University Research Foundation Optical stress generator and detector
US6175416B1 (en) 1996-08-06 2001-01-16 Brown University Research Foundation Optical stress generator and detector
US6321601B1 (en) * 1996-08-06 2001-11-27 Brown University Research Foundation Optical method for the characterization of laterally-patterned samples in integrated circuits
US5844684A (en) * 1997-02-28 1998-12-01 Brown University Research Foundation Optical method for determining the mechanical properties of a material
DE19618045C2 (de) * 1996-05-06 1998-03-26 Fraunhofer Ges Forschung Verfahren zum Bearbeiten von Werkstücken mit Laserstrahlung
US5748317A (en) * 1997-01-21 1998-05-05 Brown University Research Foundation Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector
US5978074A (en) 1997-07-03 1999-11-02 Therma-Wave, Inc. Apparatus for evaluating metalized layers on semiconductors
US5864393A (en) * 1997-07-30 1999-01-26 Brown University Research Foundation Optical method for the determination of stress in thin films
US5861632A (en) * 1997-08-05 1999-01-19 Advanced Micro Devices, Inc. Method for monitoring the performance of an ion implanter using reusable wafers
US6108087A (en) * 1998-02-24 2000-08-22 Kla-Tencor Corporation Non-contact system for measuring film thickness
US6552803B1 (en) 1998-02-24 2003-04-22 Kla-Tencor Corporation Detection of film thickness through induced acoustic pulse-echos
US6885444B2 (en) 1998-06-10 2005-04-26 Boxer Cross Inc Evaluating a multi-layered structure for voids
US6049220A (en) 1998-06-10 2000-04-11 Boxer Cross Incorporated Apparatus and method for evaluating a wafer of semiconductor material
US6054868A (en) * 1998-06-10 2000-04-25 Boxer Cross Incorporated Apparatus and method for measuring a property of a layer in a multilayered structure
US6038026A (en) * 1998-07-07 2000-03-14 Brown University Research Foundation Apparatus and method for the determination of grain size in thin films
US6025918A (en) 1998-07-07 2000-02-15 Brown University Research Foundation Apparatus and method for measurement of the mechanical properties and electromigration of thin films
US6595685B2 (en) * 1998-10-13 2003-07-22 National Research Laboratory Of Metrology Method and apparatus for measuring thermophysical properties
US6323951B1 (en) * 1999-03-22 2001-11-27 Boxer Cross Incorporated Apparatus and method for determining the active dopant profile in a semiconductor wafer
US6317216B1 (en) 1999-12-13 2001-11-13 Brown University Research Foundation Optical method for the determination of grain orientation in films
US6812047B1 (en) * 2000-03-08 2004-11-02 Boxer Cross, Inc. Evaluating a geometric or material property of a multilayered structure
US7349090B2 (en) * 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US6806951B2 (en) 2000-09-20 2004-10-19 Kla-Tencor Technologies Corp. Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US6782337B2 (en) * 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6696692B1 (en) * 2000-11-06 2004-02-24 Hrl Laboratories, Llc Process control methods for use with e-beam fabrication technology
US6911349B2 (en) * 2001-02-16 2005-06-28 Boxer Cross Inc. Evaluating sidewall coverage in a semiconductor wafer
US6812717B2 (en) * 2001-03-05 2004-11-02 Boxer Cross, Inc Use of a coefficient of a power curve to evaluate a semiconductor wafer
US20030119060A1 (en) * 2001-08-10 2003-06-26 Desrosiers Peter J. Apparatuses and methods for creating and testing pre-formulations and systems for same
US6940592B2 (en) * 2001-10-09 2005-09-06 Applied Materials, Inc. Calibration as well as measurement on the same workpiece during fabrication
US6917039B2 (en) * 2002-02-13 2005-07-12 Therma-Wave, Inc. Method and system for combined photothermal modulated reflectance and photothermal IR radiometric system
US6971791B2 (en) * 2002-03-01 2005-12-06 Boxer Cross, Inc Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
US6958814B2 (en) * 2002-03-01 2005-10-25 Applied Materials, Inc. Apparatus and method for measuring a property of a layer in a multilayered structure
US6786637B2 (en) * 2002-09-13 2004-09-07 The University Of Bristol Temperature measurement of an electronic device
US6878559B2 (en) * 2002-09-23 2005-04-12 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
US6963393B2 (en) * 2002-09-23 2005-11-08 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
US6950190B2 (en) * 2003-01-09 2005-09-27 Therma-Wave, Inc. Scatterometry for junction metrology
US6888632B2 (en) * 2003-02-28 2005-05-03 Therma-Wave, Inc. Modulated scatterometry
US6952261B2 (en) * 2003-03-31 2005-10-04 Therma-Wave, Inc. System for performing ellipsometry using an auxiliary pump beam to reduce effective measurement spot size
US7248367B2 (en) * 2003-06-10 2007-07-24 Therma-Wave, Inc. Characterization of ultra shallow junctions in semiconductor wafers
US7045798B2 (en) * 2004-02-20 2006-05-16 Applied Materials, Inc. Characterizing an electron beam treatment apparatus
US7026175B2 (en) * 2004-03-29 2006-04-11 Applied Materials, Inc. High throughput measurement of via defects in interconnects
BRPI0402805A (pt) * 2004-05-25 2006-01-17 Jose Augusto Pedro Lima Sistema para medição de propriedades térmicas de fluidos
US7379185B2 (en) 2004-11-01 2008-05-27 Applied Materials, Inc. Evaluation of openings in a dielectric layer
DE102004053659B3 (de) * 2004-11-03 2006-04-13 My Optical Systems Gmbh Verfahren und Vorrichtung zur berührungslosen Erfassung von thermischen Eigenschaften einer Objektoberfläche
US20060114478A1 (en) * 2004-11-26 2006-06-01 Applied Materials, Inc. Evaluating effects of tilt angle in ion implantation
US8789791B2 (en) * 2008-06-10 2014-07-29 Lockheed Martin Corporation Electrical system and electrical accumulator for electrical actuation and related methods
US10173262B2 (en) * 2016-02-04 2019-01-08 The Aerospace Corporation Systems and methods for monitoring temperature using acoustic waves during processing of a material
DE102021127596A1 (de) 2021-10-22 2023-04-27 Linseis Messgeräte Gesellschaft mit beschränkter Haftung Temperaturleitfähigkeitsmessgerät

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3462602A (en) * 1967-08-16 1969-08-19 Automation Ind Inc Infra-red flaw detector
FR2198636A5 (de) * 1972-09-06 1974-03-29 France Etat
US4255971A (en) * 1978-11-01 1981-03-17 Allan Rosencwaig Thermoacoustic microscopy
US4243327A (en) * 1979-01-31 1981-01-06 Nasa Double-beam optical method and apparatus for measuring thermal diffusivity and other molecular dynamic processes in utilizing the transient thermal lens effect
US4283147A (en) * 1979-06-14 1981-08-11 Dreyfus-Pellman Electro-optical scanning system
US4284356A (en) * 1979-09-26 1981-08-18 Ppg Industries, Inc. Method of and apparatus for comparing surface reflectivity
GB2099990B (en) * 1981-06-05 1984-11-28 Philips Electronic Associated Temperature measurement using thermal imaging apparatus
US4468136A (en) * 1982-02-12 1984-08-28 The Johns Hopkins University Optical beam deflection thermal imaging
US4513384A (en) * 1982-06-18 1985-04-23 Therma-Wave, Inc. Thin film thickness measurements and depth profiling utilizing a thermal wave detection system
US4522510A (en) * 1982-07-26 1985-06-11 Therma-Wave, Inc. Thin film thickness measurement with thermal waves
US4521118A (en) * 1982-07-26 1985-06-04 Therma-Wave, Inc. Method for detection of thermal waves with a laser probe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113358697A (zh) * 2021-04-27 2021-09-07 东南大学 基于非线性调频的高分辨率光热脉冲压缩热成像检测方法
CN113358697B (zh) * 2021-04-27 2022-03-29 东南大学 基于非线性调频的高分辨率光热脉冲压缩热成像检测方法

Also Published As

Publication number Publication date
EP0165711A3 (en) 1987-10-28
JPH0347703B2 (de) 1991-07-22
EP0165711B1 (de) 1991-08-07
JPS612046A (ja) 1986-01-08
US4579463A (en) 1986-04-01
EP0165711A2 (de) 1985-12-27

Similar Documents

Publication Publication Date Title
DE3583705D1 (de) Verfahren und vorrichtung zum nachweis von thermischen wellen.
DE3581906D1 (de) Verfahren und vorrichtung zum detektieren von blaettern.
DE3676940D1 (de) Verfahren und vorrichtung zum selbsttaetigen abtasten von fingerabdruecken.
DE3687842D1 (de) Verfahren und geraet zum software-austesten.
DE3776844D1 (de) Verfahren und vorrichtung zum anlegen von unterwassersilos.
DE3575590D1 (de) Verfahren und vorrichtung zum dosieren von brennstoffen.
DE3764803D1 (de) Verfahren und vorrichtung zum feststellen der identitaet und stellung von gegenstaenden.
DE3580060D1 (de) Verfahren und vorrichtung zum auflegen von baendern.
DE3674656D1 (de) Verfahren und vorrichtung zum filtern.
DE3575621D1 (de) Verfahren und anordnung zum kennzeichnen und erkennen von gegenstaenden.
DE3582671D1 (de) Verfahren und vorrichtung zum festklemmen.
DE3777854D1 (de) Verfahren und vorrichtung zum nachweis von brennbaren gasen.
DE3485301D1 (de) Verfahren und vorrichtung zum kaltverformen von loechern.
DE3771110D1 (de) Verfahren und geraet zum gruppieren von gegenstaenden.
DE3689241D1 (de) Verfahren und Vorrichtung zum Protokollieren von Systemkonfigurationen.
DE3676977D1 (de) Vorrichtung und verfahren zum pruefen von explosivstoffen.
DE3673917D1 (de) Verfahren und vorrichtung zum absoluten wegmessen.
DE3773770D1 (de) Verfahren und vorrichtung zum behandeln von oberflaechen.
DE3672821D1 (de) Vorrichtung und verfahren zum nachweis mehrerer blaetter.
DE3672027D1 (de) Verfahren und vorrichtung zum ausrichten.
DE3481237D1 (de) Vorrichtung und verfahren zum messen von betriebszeiten.
DE3673041D1 (de) Verfahren und vorrichtung zum detektieren blatt- oder folienfoermiger gegenstaende.
DE3581545D1 (de) Verfahren und vorrichtung zum messen des ortes mehrerer messpunkte mit hilfe von ultraschallimpulsen.
DE3583365D1 (de) Strahlungssonde und verfahren zum gebrauch derselben.
DE3668305D1 (de) Verfahren und vorrichtung zum ausrichten von gegenstaenden.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: THERMA-WAVE, INC. (N.D.GES.D. STAATES DELAWARE), F

8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, P., DIPL.-ING., 65193 WIESBADEN WESER, W., DIPL.-PHYS. DR.RER.NAT. KRAMER, R., DIPL.-ING., 81245 MUENCHEN ZWIRNER, G., DIPL.-ING. DIPL.-WIRTSCH.-ING., 65193 WIESBADEN HOFFMANN, E., DIPL.-ING., PAT.-ANWAELTE, 82166 GRAEFELFING

8310 Action for declaration of annulment
8311 Complete invalidation