DE3581203D1 - Montierung einer waermesenke und verfahren zu deren herstellung. - Google Patents
Montierung einer waermesenke und verfahren zu deren herstellung.Info
- Publication number
- DE3581203D1 DE3581203D1 DE8585307735T DE3581203T DE3581203D1 DE 3581203 D1 DE3581203 D1 DE 3581203D1 DE 8585307735 T DE8585307735 T DE 8585307735T DE 3581203 T DE3581203 T DE 3581203T DE 3581203 D1 DE3581203 D1 DE 3581203D1
- Authority
- DE
- Germany
- Prior art keywords
- assembly
- production
- heat sink
- sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/728,303 US4624303A (en) | 1985-04-29 | 1985-04-29 | Heat sink mounting and method of making |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3581203D1 true DE3581203D1 (de) | 1991-02-07 |
Family
ID=24926295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585307735T Expired - Fee Related DE3581203D1 (de) | 1985-04-29 | 1985-10-25 | Montierung einer waermesenke und verfahren zu deren herstellung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4624303A (de) |
EP (1) | EP0199873B1 (de) |
JP (1) | JPS61251060A (de) |
CA (1) | CA1224575A (de) |
DE (1) | DE3581203D1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4885126A (en) * | 1986-10-17 | 1989-12-05 | Polonio John D | Interconnection mechanisms for electronic components |
WO1988002980A1 (en) * | 1986-10-17 | 1988-04-21 | Polonio John D | Interconnection mechanisms for electronic components |
JPH0521670A (ja) * | 1991-07-12 | 1993-01-29 | Sumitomo Electric Ind Ltd | ヒートシンク、ヒートシンクの製造方法および製造装置 |
US5184281A (en) * | 1992-03-03 | 1993-02-02 | Digital Equipment Corporation | Heat dissipation apparatus |
CN100349687C (zh) * | 2004-08-08 | 2007-11-21 | 湖北汽车工业学院 | 点焊电极表面电火花熔敷涂层用的熔敷棒及其制备方法 |
WO2006120627A2 (en) * | 2005-05-13 | 2006-11-16 | Koninklijke Philips Electronics N.V. | An electronic device, a housing part, an assembly and a method for manufacturing an electronic device |
US7538294B2 (en) * | 2005-05-17 | 2009-05-26 | Huys Industries Limited | Welding electrode and method |
US20090103342A1 (en) * | 2007-10-17 | 2009-04-23 | Saul Lin | Silicon-controlled rectifier with a heat-dissipating structure |
WO2013054416A1 (ja) * | 2011-10-13 | 2013-04-18 | トヨタ自動車株式会社 | 半導体モジュール |
JP6011206B2 (ja) * | 2012-09-27 | 2016-10-19 | 三菱電機株式会社 | 圧接型半導体装置、圧接型半導体装置の製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3204327A (en) * | 1957-10-28 | 1965-09-07 | Motorola Inc | Method for making semiconductor devices employing a hollow, slotted cylindrical jig and vertical mounting posts |
US3025435A (en) * | 1959-05-15 | 1962-03-13 | Tung Sol Electric Inc | Casing for semiconductor diode |
NL260951A (de) * | 1960-03-07 | |||
US3198874A (en) * | 1961-01-23 | 1965-08-03 | Standard Pressed Steel Co | Semi-conductor housings and method of making the same |
BE637603A (de) * | 1962-09-21 | |||
BE638960A (de) * | 1962-10-23 | |||
GB1070092A (en) * | 1965-01-14 | 1967-05-24 | Westinghouse Brake & Signal | Semi-conductor device and manufacture thereof |
US3374014A (en) * | 1965-07-27 | 1968-03-19 | Standard Pressed Steel Co | Swaged seals |
US3408451A (en) * | 1965-09-01 | 1968-10-29 | Texas Instruments Inc | Electrical device package |
DE2202054A1 (de) * | 1972-01-17 | 1973-07-26 | Siemens Ag | Halbleiterbauelement |
US3918625A (en) * | 1974-10-03 | 1975-11-11 | Nippert Co | Method of making a double extruded semiconductor joint |
US4049185A (en) * | 1977-03-11 | 1977-09-20 | The Nippert Company | Method of forming double extruded mount |
US4149310A (en) * | 1978-03-27 | 1979-04-17 | The Nippert Company | Method of making a heat sink mounting |
-
1985
- 1985-04-29 US US06/728,303 patent/US4624303A/en not_active Expired - Fee Related
- 1985-10-22 CA CA000493523A patent/CA1224575A/en not_active Expired
- 1985-10-25 EP EP85307735A patent/EP0199873B1/de not_active Expired - Lifetime
- 1985-10-25 DE DE8585307735T patent/DE3581203D1/de not_active Expired - Fee Related
- 1985-11-22 JP JP60263629A patent/JPS61251060A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61251060A (ja) | 1986-11-08 |
EP0199873B1 (de) | 1990-12-27 |
CA1224575A (en) | 1987-07-21 |
EP0199873A2 (de) | 1986-11-05 |
JPH0334226B2 (de) | 1991-05-21 |
EP0199873A3 (en) | 1987-06-03 |
US4624303A (en) | 1986-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |