DE3578267D1 - Elektronischer modul mit einem substrat, einem deckel und dichtungsmitteln. - Google Patents

Elektronischer modul mit einem substrat, einem deckel und dichtungsmitteln.

Info

Publication number
DE3578267D1
DE3578267D1 DE8585101040T DE3578267T DE3578267D1 DE 3578267 D1 DE3578267 D1 DE 3578267D1 DE 8585101040 T DE8585101040 T DE 8585101040T DE 3578267 T DE3578267 T DE 3578267T DE 3578267 D1 DE3578267 D1 DE 3578267D1
Authority
DE
Germany
Prior art keywords
sealants
lid
substrate
electronic module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585101040T
Other languages
German (de)
English (en)
Inventor
Peter A Engel
Douglas H Strope
Thomas E Wray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3578267D1 publication Critical patent/DE3578267D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
DE8585101040T 1984-04-10 1985-02-01 Elektronischer modul mit einem substrat, einem deckel und dichtungsmitteln. Expired - Lifetime DE3578267D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/598,631 US4514752A (en) 1984-04-10 1984-04-10 Displacement compensating module

Publications (1)

Publication Number Publication Date
DE3578267D1 true DE3578267D1 (de) 1990-07-19

Family

ID=24396340

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585101040T Expired - Lifetime DE3578267D1 (de) 1984-04-10 1985-02-01 Elektronischer modul mit einem substrat, einem deckel und dichtungsmitteln.

Country Status (4)

Country Link
US (1) US4514752A (https=)
EP (1) EP0159472B1 (https=)
JP (1) JPS60214545A (https=)
DE (1) DE3578267D1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62194693A (ja) * 1986-02-12 1987-08-27 信越ポリマ−株式会社 基板付き電気電子部品
US4935581A (en) * 1986-04-17 1990-06-19 Citizen Watch Co., Ltd. Pin grid array package
JPS62244139A (ja) * 1986-04-17 1987-10-24 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
JPH079953B2 (ja) * 1988-04-13 1995-02-01 株式会社東芝 半導体装置の製造方法
US4910867A (en) * 1988-05-27 1990-03-27 Amp Incorporated Method of forming a sealed electrical connector
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
JPH07109867B2 (ja) * 1991-04-15 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チツプの冷却構造
CH683212A5 (de) * 1992-03-10 1994-01-31 Frama Ag Elektronischer Festspeicher.
US5268814A (en) * 1992-05-20 1993-12-07 International Business Machines Corporation Module packaging
US5285559A (en) * 1992-09-10 1994-02-15 Sundstrand Corporation Method and apparatus for isolating electronic boards from shock and thermal environments
US6262477B1 (en) 1993-03-19 2001-07-17 Advanced Interconnect Technologies Ball grid array electronic package
US5410806A (en) * 1993-09-15 1995-05-02 Lsi Logic Corporation Method for fabricating conductive epoxy grid array semiconductors packages
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks
US5734201A (en) * 1993-11-09 1998-03-31 Motorola, Inc. Low profile semiconductor device with like-sized chip and mounting substrate
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
JP3004578B2 (ja) * 1995-05-12 2000-01-31 財団法人工業技術研究院 熱放散増強のための多熱導伝路とパッケージ統合性及び信頼性向上のための縁の周りを囲むキャップからなる集積回路パッケージ
US5985697A (en) * 1996-05-06 1999-11-16 Sun Microsystems, Inc. Method and apparatus for mounting an integrated circuit to a printed circuit board
US6016006A (en) * 1996-06-24 2000-01-18 Intel Corporation Thermal grease insertion and retention
US5990418A (en) * 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
US6448106B1 (en) * 1999-11-09 2002-09-10 Fujitsu Limited Modules with pins and methods for making modules with pins
US6559537B1 (en) * 2000-08-31 2003-05-06 Micron Technology, Inc. Ball grid array packages with thermally conductive containers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE26899E (en) * 1963-08-08 1970-05-26 Encapsulation op electronic modules
GB1514595A (en) * 1975-03-03 1978-06-14 Hughes Aircraft Co Package for hermetically sealing electronic circuits
US4233620A (en) * 1979-02-27 1980-11-11 International Business Machines Corporation Sealing of integrated circuit modules
US4312116A (en) * 1980-04-14 1982-01-26 International Business Machines Corporation Method of sealing an electronic module in a cap
US4374080A (en) * 1981-01-13 1983-02-15 Indy Electronics, Inc. Method and apparatus for encapsulation casting

Also Published As

Publication number Publication date
EP0159472A3 (en) 1987-04-29
EP0159472A2 (en) 1985-10-30
US4514752A (en) 1985-04-30
EP0159472B1 (en) 1990-06-13
JPS60214545A (ja) 1985-10-26
JPH0326541B2 (https=) 1991-04-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee