DE3576634D1 - Verfahren und werkzeug zum ersetzen individueller endkontakte in einer dichter kontaktsteckermatrix einer elektronischen verpackungsstruktur. - Google Patents

Verfahren und werkzeug zum ersetzen individueller endkontakte in einer dichter kontaktsteckermatrix einer elektronischen verpackungsstruktur.

Info

Publication number
DE3576634D1
DE3576634D1 DE8585115904T DE3576634T DE3576634D1 DE 3576634 D1 DE3576634 D1 DE 3576634D1 DE 8585115904 T DE8585115904 T DE 8585115904T DE 3576634 T DE3576634 T DE 3576634T DE 3576634 D1 DE3576634 D1 DE 3576634D1
Authority
DE
Germany
Prior art keywords
tool
contact plug
end contacts
packing structure
sealed contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585115904T
Other languages
German (de)
English (en)
Inventor
William O Druschel
Alexander Kostenko
Rolf Gerd Meinert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3576634D1 publication Critical patent/DE3576634D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DE8585115904T 1984-12-20 1985-12-13 Verfahren und werkzeug zum ersetzen individueller endkontakte in einer dichter kontaktsteckermatrix einer elektronischen verpackungsstruktur. Expired - Fee Related DE3576634D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/684,823 US4632294A (en) 1984-12-20 1984-12-20 Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure

Publications (1)

Publication Number Publication Date
DE3576634D1 true DE3576634D1 (de) 1990-04-19

Family

ID=24749727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585115904T Expired - Fee Related DE3576634D1 (de) 1984-12-20 1985-12-13 Verfahren und werkzeug zum ersetzen individueller endkontakte in einer dichter kontaktsteckermatrix einer elektronischen verpackungsstruktur.

Country Status (4)

Country Link
US (1) US4632294A (fr)
EP (1) EP0185326B1 (fr)
JP (1) JPS61150258A (fr)
DE (1) DE3576634D1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4979664A (en) * 1989-11-15 1990-12-25 At&T Bell Laboratories Method for manufacturing a soldered article
US5192843A (en) * 1991-03-14 1993-03-09 Aluminum Company Of America Pin attachment tool and method of capacitive brazing
US5722579A (en) * 1996-04-26 1998-03-03 International Business Machines Corporation Bottom-surface-metallurgy rework process in ceramic modules
KR100283744B1 (ko) * 1997-08-01 2001-04-02 윤종용 집적회로실장방법
US6488405B1 (en) * 2000-03-08 2002-12-03 Advanced Micro Devices, Inc. Flip chip defect analysis using liquid crystal
US6550668B2 (en) * 2001-05-07 2003-04-22 Larry J. Costa Method and means for rapid heat-sink soldering
US20030115502A1 (en) * 2001-12-14 2003-06-19 Smiths Industries Aerospace & Defense Systems, Inc. Method of restoring encapsulated integrated circuit devices
CN1317753C (zh) * 2002-11-25 2007-05-23 宇东电浆科技股份有限公司 封装晶片的夹持装置
US7353983B2 (en) * 2003-10-28 2008-04-08 Temic Automotive Of North America, Inc. Vertical removal of excess solder from a circuit substrate
JP4589392B2 (ja) * 2005-06-30 2010-12-01 富士通株式会社 超微細部品の取り外し方法、及び装置
JP4825545B2 (ja) * 2006-02-27 2011-11-30 富士重工業株式会社 車両用ウォッシャ装置
EP1936683A1 (fr) * 2006-12-22 2008-06-25 ABB Technology AG Plaque de base pour dissipateur thermique et dispositif électronique avec plaque de base
DE102008035730B4 (de) * 2007-12-23 2009-10-15 Paul Wild Ohg Verfahren zur Anbringung eines Bearbeitungsstifts an einen zu schleifenden Edelstein sowie Handhabungs- oder Bearbeitungsstift und Messstift zum Durchführen des Verfahrens
DE102009000256A1 (de) * 2009-01-15 2010-07-22 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Lötdampfabsaugvorrichtung für ein Mikroskop
EP2308628A1 (fr) * 2009-10-06 2011-04-13 Siemens Aktiengesellschaft Méthode d'enlévement d'un composant brasé avec chauffage local du lieu de brasage
US11224927B2 (en) 2015-11-25 2022-01-18 International Business Machines Corporation Circuit card attachment for enhanced robustness of thermal performance
US10868401B1 (en) * 2020-03-04 2020-12-15 Onanon, Inc. Robotic wire termination system

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3230338A (en) * 1962-07-02 1966-01-18 Ibm Selective heating apparatus
NL134969C (fr) * 1965-04-21
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3469061A (en) * 1966-06-28 1969-09-23 Argus Eng Co Soldering apparatus
US3586813A (en) * 1967-08-31 1971-06-22 Western Electric Co Simultaneous multiple lead bonding
US3517278A (en) * 1967-10-02 1970-06-23 Teledyne Inc Flip chip structure
US3653572A (en) * 1969-09-05 1972-04-04 Ibm Hot gas solder removal
US3710069A (en) * 1970-07-06 1973-01-09 Ibm Method of and apparatus for selective solder reflow
US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
US3895214A (en) * 1972-02-15 1975-07-15 Robin L Winter Component removal tool
US3751799A (en) * 1972-04-26 1973-08-14 Ibm Solder terminal rework technique
US3912153A (en) * 1974-11-18 1975-10-14 Gen Motors Corp Method and apparatus for bonding semiconductor pill-type components to a circuit board
DE2529554A1 (de) * 1975-07-02 1977-01-20 Siemens Ag Verfahren und vorrichtung zum abloeten von halbleiterbausteinen in flip- chip-technik
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4160893A (en) * 1977-12-29 1979-07-10 International Business Machines Corporation Individual chip joining machine
US4205221A (en) * 1978-05-26 1980-05-27 Meyer Hugo G Electrically heated soldering tool having work gripping jaws
US4270260A (en) * 1978-10-10 1981-06-02 Krueger Ellison F Method for the salvage and restoration of integrated circuits from a substrate
DE2910066C2 (de) * 1979-03-14 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Reflow-Löten von vielpoligen Steckverbindungen
FR2458977A1 (fr) * 1979-06-13 1981-01-02 Cii Honeywell Bull Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat
DE2925347A1 (de) * 1979-06-22 1981-01-15 Siemens Ag Verfahren und vorrichtung zum ausloeten von bauteilen aus gedruckten leiterplatten
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
SU918090A1 (ru) * 1979-10-03 1982-04-07 Научно-исследовательский институт механики Московского государственного университета им.М.В.Ломоносова Электромагнитный захват
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
US4302625A (en) * 1980-06-30 1981-11-24 International Business Machines Corp. Multi-layer ceramic substrate
US4418857A (en) * 1980-12-31 1983-12-06 International Business Machines Corp. High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
US4444559A (en) * 1982-06-28 1984-04-24 International Business Machines Corporation Process and apparatus for unsoldering solder bonded semiconductor devices

Also Published As

Publication number Publication date
EP0185326B1 (fr) 1990-03-14
JPH0145231B2 (fr) 1989-10-03
EP0185326A2 (fr) 1986-06-25
JPS61150258A (ja) 1986-07-08
US4632294A (en) 1986-12-30
EP0185326A3 (en) 1987-05-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee