DE3565750D1 - Case sealed by cold-welding and withstanding high temperatures - Google Patents

Case sealed by cold-welding and withstanding high temperatures

Info

Publication number
DE3565750D1
DE3565750D1 DE8585401523T DE3565750T DE3565750D1 DE 3565750 D1 DE3565750 D1 DE 3565750D1 DE 8585401523 T DE8585401523 T DE 8585401523T DE 3565750 T DE3565750 T DE 3565750T DE 3565750 D1 DE3565750 D1 DE 3565750D1
Authority
DE
Germany
Prior art keywords
welding
cold
high temperatures
withstanding high
case sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585401523T
Other languages
English (en)
Inventor
Andre Debaisieux
Jean-Pierre Aubry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CEPE
Compagnie Electronique et de Piezoelectricite CEPE
Original Assignee
CEPE
Compagnie Electronique et de Piezoelectricite CEPE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CEPE, Compagnie Electronique et de Piezoelectricite CEPE filed Critical CEPE
Application granted granted Critical
Publication of DE3565750D1 publication Critical patent/DE3565750D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
DE8585401523T 1984-07-27 1985-07-23 Case sealed by cold-welding and withstanding high temperatures Expired DE3565750D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8411969A FR2568443B1 (fr) 1984-07-27 1984-07-27 Boitier a fermeture a froid supportant les hautes temperatures

Publications (1)

Publication Number Publication Date
DE3565750D1 true DE3565750D1 (en) 1988-11-24

Family

ID=9306571

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585401523T Expired DE3565750D1 (en) 1984-07-27 1985-07-23 Case sealed by cold-welding and withstanding high temperatures

Country Status (6)

Country Link
US (1) US4686324A (de)
EP (1) EP0172769B1 (de)
CA (1) CA1243392A (de)
DE (1) DE3565750D1 (de)
DK (1) DK341185A (de)
FR (1) FR2568443B1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2627875B1 (fr) * 1988-02-09 1991-08-16 Thomson Csf Boitier assurant la protection d'informations contenues dans un circuit electronique
FR2638587B1 (fr) * 1988-10-28 1991-02-01 Ecole Nale Sup Meca Microtechn Dispositif demontable de support d'un resonateur piezoelectrique a l'interieur d'un boitier
FR2668948B1 (fr) * 1990-11-13 1993-04-23 Cepe Procede de dissolution d'un materiau cristallin.
JP3178137B2 (ja) * 1993-01-08 2001-06-18 株式会社村田製作所 振動子の支持構造
US5965937A (en) * 1997-12-15 1999-10-12 Intel Corporation Thermal interface attach mechanism for electrical packages
US6099682A (en) * 1998-02-09 2000-08-08 3M Innovative Properties Company Corporation Of Delaware Cold seal package and method for making the same
US6028523A (en) * 1998-06-25 2000-02-22 Carrier Corporation Integral ground pin for sealed compressor
JP2005033390A (ja) * 2003-07-10 2005-02-03 Citizen Watch Co Ltd 圧電デバイスとその製造方法
US20060017516A1 (en) * 2004-05-25 2006-01-26 Broadcom Corporation Small crystal with grounded package
JP4555359B2 (ja) * 2008-04-02 2010-09-29 日本電波工業株式会社 水晶振動子
DE202011051125U1 (de) 2011-08-26 2012-11-30 Dom Sicherheitstechnik Gmbh & Co Kg Türbeschlag mit einer von einem Linksbetrieb auf einen Rechtsbetrieb umstellbaren Nuss
EP3064166B1 (de) * 2015-03-06 2018-07-04 Schott AG Hermetisch abgedichtete led-leuchte sowie verfahren zur herstellung einer hermetisch abgedichteten led-leuchte

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2301269A (en) * 1941-07-01 1942-11-10 Rca Corp Art of mounting piezoelectric elements
FR1113719A (fr) * 1954-11-24 1956-04-03 Collins Radio Co Filtre électromécanique
FR1347121A (fr) * 1962-11-12 1963-12-27 Lignes Telegraph Telephon Perfectionnements aux enveloppes étanches pour cristaux piézoélectriques
IL40032A0 (en) * 1971-08-12 1972-09-28 Motorola Inc Structure for mounting a crystal plate
DE2158188A1 (de) * 1971-11-24 1973-06-07 Jenaer Glaswerk Schott & Gen Kaltpresschweissbare und kaltpressloetbare druckglasdurchfuehrungen
US3828210A (en) * 1973-01-22 1974-08-06 Motorola Inc Temperature compensated mounting structure for coupled resonator crystals
DE2824426C2 (de) * 1978-06-03 1982-09-02 Schott Glaswerke, 6500 Mainz Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen
FR2454700A1 (fr) * 1979-04-18 1980-11-14 Cepe Boitier d'encapsulation pour composant electronique et composant comportant un tel boitier
US4453104A (en) * 1982-05-12 1984-06-05 Motorola, Inc. Low-profile crystal package with an improved crystal-mounting arrangement

Also Published As

Publication number Publication date
DK341185D0 (da) 1985-07-26
DK341185A (da) 1986-01-28
FR2568443A1 (fr) 1986-01-31
CA1243392A (en) 1988-10-18
US4686324A (en) 1987-08-11
EP0172769B1 (de) 1988-10-19
FR2568443B1 (fr) 1986-11-14
EP0172769A1 (de) 1986-02-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee