DE3564590D1 - Process for manufacturing a composite material - Google Patents

Process for manufacturing a composite material

Info

Publication number
DE3564590D1
DE3564590D1 DE8585108013T DE3564590T DE3564590D1 DE 3564590 D1 DE3564590 D1 DE 3564590D1 DE 8585108013 T DE8585108013 T DE 8585108013T DE 3564590 T DE3564590 T DE 3564590T DE 3564590 D1 DE3564590 D1 DE 3564590D1
Authority
DE
Germany
Prior art keywords
manufacturing
composite material
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585108013T
Other languages
German (de)
Inventor
Georg Werner Dipl Phys Reppel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vacuumschmelze GmbH and Co KG
Original Assignee
Vacuumschmelze GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacuumschmelze GmbH and Co KG filed Critical Vacuumschmelze GmbH and Co KG
Priority to DE8585108013T priority Critical patent/DE3564590D1/en
Application granted granted Critical
Publication of DE3564590D1 publication Critical patent/DE3564590D1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
DE8585108013T 1984-07-21 1985-06-28 Process for manufacturing a composite material Expired DE3564590D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8585108013T DE3564590D1 (en) 1984-07-21 1985-06-28 Process for manufacturing a composite material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843426916 DE3426916A1 (en) 1984-07-21 1984-07-21 METHOD FOR PRODUCING A COMPOSITE
DE8585108013T DE3564590D1 (en) 1984-07-21 1985-06-28 Process for manufacturing a composite material

Publications (1)

Publication Number Publication Date
DE3564590D1 true DE3564590D1 (en) 1988-09-29

Family

ID=6241213

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19843426916 Withdrawn DE3426916A1 (en) 1984-07-21 1984-07-21 METHOD FOR PRODUCING A COMPOSITE
DE8585108013T Expired DE3564590D1 (en) 1984-07-21 1985-06-28 Process for manufacturing a composite material

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19843426916 Withdrawn DE3426916A1 (en) 1984-07-21 1984-07-21 METHOD FOR PRODUCING A COMPOSITE

Country Status (2)

Country Link
EP (1) EP0170867B1 (en)
DE (2) DE3426916A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3731624A1 (en) * 1987-09-19 1989-03-30 Asea Brown Boveri Compensating circular lamination for power semiconductor modules
DE3881030T2 (en) * 1987-09-28 1993-12-02 Witec Cayman Patents Ltd COPPER TUNGSTEN METAL MIXTURE AND METHOD.
US5062025A (en) * 1990-05-25 1991-10-29 Iowa State University Research Foundation Electrolytic capacitor and large surface area electrode element therefor
US5043025A (en) * 1990-06-12 1991-08-27 Iowa State University Research Foundation, Inc. High strength-high conductivity Cu--Fe composites produced by powder compaction/mechanical reduction
DE19934554A1 (en) * 1999-07-22 2001-01-25 Michael Stollenwerk Heat exchanger has cooling body with channel structure for introducing the cooling medium
US7083759B2 (en) 2000-01-26 2006-08-01 A.L.M.T. Corp. Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
EP1553627A1 (en) * 2000-04-14 2005-07-13 A.L.M.T. Corp. Material for a heat dissipation substrate for mounting a semiconductor and a ceramic package using the same
CN104308151B (en) * 2014-10-31 2016-04-20 西安瑞福莱钨钼有限公司 The method of molybdenum-copper blank is prepared in a kind of continuous sintering

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE613878C (en) * 1932-03-06 1935-05-25
GB732029A (en) * 1952-10-28 1955-06-15 Mallory Metallurg Prod Ltd Improvements in and relating to the production of high density metal bodies such as electrical contact bodies
GB810678A (en) * 1955-07-30 1959-03-18 Heck Friedrich A method of producing copper strip from the powdered metal
US2983996A (en) * 1958-07-30 1961-05-16 Mallory & Co Inc P R Copper-tungsten-molybdenum contact materials
GB883429A (en) * 1959-06-26 1961-11-29 Mallory Metallurg Prod Ltd Improvements in and relating to the manufacture of electrical contact or welding electrode materials
NL264799A (en) * 1960-06-21
FR1338779A (en) * 1961-11-08 1963-09-27 Texas Instruments Inc Improvements to electrical contacts
US3685134A (en) * 1970-05-15 1972-08-22 Mallory & Co Inc P R Method of making electrical contact materials
JPS5116302B2 (en) * 1973-10-22 1976-05-22

Also Published As

Publication number Publication date
EP0170867B1 (en) 1988-08-24
EP0170867A1 (en) 1986-02-12
DE3426916A1 (en) 1986-01-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee