DE3562278D1 - Medium for the electroless deposition of tin and/or lead - Google Patents

Medium for the electroless deposition of tin and/or lead

Info

Publication number
DE3562278D1
DE3562278D1 DE8585108089T DE3562278T DE3562278D1 DE 3562278 D1 DE3562278 D1 DE 3562278D1 DE 8585108089 T DE8585108089 T DE 8585108089T DE 3562278 T DE3562278 T DE 3562278T DE 3562278 D1 DE3562278 D1 DE 3562278D1
Authority
DE
Germany
Prior art keywords
tin
lead
medium
electroless deposition
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585108089T
Other languages
English (en)
Inventor
Eugen Dr Scholz
Hans-Jurgen Luttmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Riedel de Haen AG
Original Assignee
Riedel de Haen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riedel de Haen AG filed Critical Riedel de Haen AG
Priority to DE8585108089T priority Critical patent/DE3562278D1/de
Application granted granted Critical
Publication of DE3562278D1 publication Critical patent/DE3562278D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8585108089T 1984-07-09 1985-06-29 Medium for the electroless deposition of tin and/or lead Expired DE3562278D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8585108089T DE3562278D1 (en) 1984-07-09 1985-06-29 Medium for the electroless deposition of tin and/or lead

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843425214 DE3425214A1 (de) 1984-07-09 1984-07-09 Mittel fuer die stromlose abscheidung von zinn und/oder blei
DE8585108089T DE3562278D1 (en) 1984-07-09 1985-06-29 Medium for the electroless deposition of tin and/or lead

Publications (1)

Publication Number Publication Date
DE3562278D1 true DE3562278D1 (en) 1988-05-26

Family

ID=6240176

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19843425214 Withdrawn DE3425214A1 (de) 1984-07-09 1984-07-09 Mittel fuer die stromlose abscheidung von zinn und/oder blei
DE8585108089T Expired DE3562278D1 (en) 1984-07-09 1985-06-29 Medium for the electroless deposition of tin and/or lead

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19843425214 Withdrawn DE3425214A1 (de) 1984-07-09 1984-07-09 Mittel fuer die stromlose abscheidung von zinn und/oder blei

Country Status (2)

Country Link
EP (1) EP0167949B1 (de)
DE (2) DE3425214A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL81530A0 (en) * 1987-02-10 1987-09-16 Techno Chemica Ltd Tin coating immersion solution and coating process using the same
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
JPH04363093A (ja) * 1990-11-27 1992-12-15 Mitsubishi Electric Corp プリント基板の製造方法
EP0524422A2 (de) * 1991-07-22 1993-01-27 Shipley Company Inc. Zinn-Bleibehandlung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027055A (en) * 1973-07-24 1977-05-31 Photocircuits Division Of Kollmorgan Corporation Process of tin plating by immersion
US4170525A (en) * 1978-04-28 1979-10-09 Gould Inc. Process for plating a composite structure

Also Published As

Publication number Publication date
DE3425214A1 (de) 1986-02-06
EP0167949A1 (de) 1986-01-15
EP0167949B1 (de) 1988-04-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee