DE3520945A1 - Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungen - Google Patents
Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungenInfo
- Publication number
- DE3520945A1 DE3520945A1 DE19853520945 DE3520945A DE3520945A1 DE 3520945 A1 DE3520945 A1 DE 3520945A1 DE 19853520945 DE19853520945 DE 19853520945 DE 3520945 A DE3520945 A DE 3520945A DE 3520945 A1 DE3520945 A1 DE 3520945A1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- carrier element
- conductor tracks
- element according
- enamel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000005284 oxidic glass Substances 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 73
- 210000003298 dental enamel Anatomy 0.000 claims description 61
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 2
- 239000007921 spray Substances 0.000 claims 2
- 239000003595 mist Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 7
- 239000002585 base Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000002320 enamel (paints) Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853520945 DE3520945A1 (de) | 1985-06-12 | 1985-06-12 | Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853520945 DE3520945A1 (de) | 1985-06-12 | 1985-06-12 | Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3520945A1 true DE3520945A1 (de) | 1986-12-18 |
| DE3520945C2 DE3520945C2 (enrdf_load_stackoverflow) | 1987-09-17 |
Family
ID=6273001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19853520945 Granted DE3520945A1 (de) | 1985-06-12 | 1985-06-12 | Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungen |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3520945A1 (enrdf_load_stackoverflow) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0416898A3 (en) * | 1989-09-05 | 1992-02-12 | Xerox Corporation | Thick film substrate with highly thermally conductive metal base |
| WO1992017994A1 (en) * | 1991-04-01 | 1992-10-15 | Filial Vsesojuznogo Nauchno-Issledovatelskogo Instituta Elektromekhaniki | Multilayer printed circuit board and method of manufacture |
| WO1998005067A1 (en) * | 1996-07-29 | 1998-02-05 | Rjr Polymers, Inc. | Electronic packages containing microsphere spacers |
| DE10148751A1 (de) * | 2001-10-02 | 2003-04-17 | Siemens Ag | Verfahren zur Herstellung einer Elektronikeinheit sowie Elektronikeinheit |
| EP1515595A3 (de) * | 2003-09-09 | 2007-03-14 | Robert Bosch Gmbh | Schaltungsträger |
| WO2008021269A3 (en) * | 2006-08-11 | 2008-04-10 | Du Pont | Device chip carriers, modules, and methods of forming thereof |
| EP2648217A4 (en) * | 2010-11-30 | 2017-11-22 | Toyoda Iron Works Co., Ltd. | Cooling apparatus for electronic components and method for manufacturing same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10331208A1 (de) * | 2003-07-10 | 2005-02-10 | Newspray Gmbh | Verfahren und Anordnung zur Isolierung eines Kühlkörpers |
| DE102004032368B4 (de) * | 2004-06-30 | 2015-04-09 | Robert Bosch Gmbh | Kühlungsaufbau für eine Schaltung |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1766144C (de) * | 1971-08-05 | Telefunken Patentverwertungsge Seilschaft mbH, 7900 Ulm | Gehäuse mit einer Tragerplatte zur Aufnahme integrierter Schaltungen | |
| DE6608942U (de) * | 1967-08-19 | 1971-12-23 | Sanyo Electric Co | Integrierte hybridschaltung. |
| DE1766528B1 (de) * | 1967-06-07 | 1971-12-23 | Beckman Instruments Inc | Elektrischer modulbauteil |
| US4227036A (en) * | 1978-09-18 | 1980-10-07 | Microwave Semiconductor Corp. | Composite flanged ceramic package for electronic devices |
| DE3032744A1 (de) * | 1979-08-30 | 1981-03-19 | Showa Denko K.K., Tokyo | Elektrisch isolierende unterlage mit hoher waermeleitfaehigkeit |
| DD153308A1 (de) * | 1980-09-12 | 1981-12-30 | Helmut G Prof Dr Rer Schneider | Verfahren zur herstellung beschichteter substrate fuer dickschichtschaltkreise |
| US4367523A (en) * | 1981-02-17 | 1983-01-04 | Electronic Devices, Inc. | Rectifier bridge unit |
-
1985
- 1985-06-12 DE DE19853520945 patent/DE3520945A1/de active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1766144C (de) * | 1971-08-05 | Telefunken Patentverwertungsge Seilschaft mbH, 7900 Ulm | Gehäuse mit einer Tragerplatte zur Aufnahme integrierter Schaltungen | |
| DE1766528B1 (de) * | 1967-06-07 | 1971-12-23 | Beckman Instruments Inc | Elektrischer modulbauteil |
| DE6608942U (de) * | 1967-08-19 | 1971-12-23 | Sanyo Electric Co | Integrierte hybridschaltung. |
| US4227036A (en) * | 1978-09-18 | 1980-10-07 | Microwave Semiconductor Corp. | Composite flanged ceramic package for electronic devices |
| DE3032744A1 (de) * | 1979-08-30 | 1981-03-19 | Showa Denko K.K., Tokyo | Elektrisch isolierende unterlage mit hoher waermeleitfaehigkeit |
| DD153308A1 (de) * | 1980-09-12 | 1981-12-30 | Helmut G Prof Dr Rer Schneider | Verfahren zur herstellung beschichteter substrate fuer dickschichtschaltkreise |
| US4367523A (en) * | 1981-02-17 | 1983-01-04 | Electronic Devices, Inc. | Rectifier bridge unit |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0416898A3 (en) * | 1989-09-05 | 1992-02-12 | Xerox Corporation | Thick film substrate with highly thermally conductive metal base |
| WO1992017994A1 (en) * | 1991-04-01 | 1992-10-15 | Filial Vsesojuznogo Nauchno-Issledovatelskogo Instituta Elektromekhaniki | Multilayer printed circuit board and method of manufacture |
| US5414224A (en) * | 1991-04-01 | 1995-05-09 | Filial Vsesojuznogo Nauchno Issledovatelskogo Instituta | Multilayer printed circuit board and method of manufacturing same |
| WO1998005067A1 (en) * | 1996-07-29 | 1998-02-05 | Rjr Polymers, Inc. | Electronic packages containing microsphere spacers |
| DE10148751A1 (de) * | 2001-10-02 | 2003-04-17 | Siemens Ag | Verfahren zur Herstellung einer Elektronikeinheit sowie Elektronikeinheit |
| EP1515595A3 (de) * | 2003-09-09 | 2007-03-14 | Robert Bosch Gmbh | Schaltungsträger |
| WO2008021269A3 (en) * | 2006-08-11 | 2008-04-10 | Du Pont | Device chip carriers, modules, and methods of forming thereof |
| US8710523B2 (en) | 2006-08-11 | 2014-04-29 | E I Du Pont De Nemours And Company | Device chip carriers, modules, and methods of forming thereof |
| EP2648217A4 (en) * | 2010-11-30 | 2017-11-22 | Toyoda Iron Works Co., Ltd. | Cooling apparatus for electronic components and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3520945C2 (enrdf_load_stackoverflow) | 1987-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |