DE3485005D1 - Abhebeverfahren und zusammensetzung dafuer. - Google Patents

Abhebeverfahren und zusammensetzung dafuer.

Info

Publication number
DE3485005D1
DE3485005D1 DE8484107042T DE3485005T DE3485005D1 DE 3485005 D1 DE3485005 D1 DE 3485005D1 DE 8484107042 T DE8484107042 T DE 8484107042T DE 3485005 T DE3485005 T DE 3485005T DE 3485005 D1 DE3485005 D1 DE 3485005D1
Authority
DE
Germany
Prior art keywords
lift
procedure
composition therefor
therefor
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484107042T
Other languages
English (en)
Inventor
Beverly Louise Olsen
Augustus Ceniza Ouano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3485005D1 publication Critical patent/DE3485005D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/118—Initiator containing with inhibitor or stabilizer

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE8484107042T 1983-06-27 1984-06-20 Abhebeverfahren und zusammensetzung dafuer. Expired - Fee Related DE3485005D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/508,210 US4606931A (en) 1983-06-27 1983-06-27 Lift-off masking method

Publications (1)

Publication Number Publication Date
DE3485005D1 true DE3485005D1 (de) 1991-10-10

Family

ID=24021812

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484107042T Expired - Fee Related DE3485005D1 (de) 1983-06-27 1984-06-20 Abhebeverfahren und zusammensetzung dafuer.

Country Status (4)

Country Link
US (1) US4606931A (de)
EP (1) EP0132585B1 (de)
JP (1) JPS608360A (de)
DE (1) DE3485005D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778739A (en) * 1986-08-25 1988-10-18 International Business Machines Corporation Photoresist process for reactive ion etching of metal patterns for semiconductor devices
US5258264A (en) * 1989-07-06 1993-11-02 International Business Machines Corporation Process of forming a dual overhang collimated lift-off stencil with subsequent metal deposition
JPH06204162A (ja) * 1992-12-28 1994-07-22 Mitsubishi Electric Corp 半導体装置の製造方法および該方法に用いられるレジスト組成物
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5883011A (en) * 1997-06-18 1999-03-16 Vlsi Technology, Inc. Method of removing an inorganic antireflective coating from a semiconductor substrate
US6712845B2 (en) * 2001-04-24 2004-03-30 Advanced Cardiovascular Systems, Inc. Coating for a stent and a method of forming the same
GB2395365B8 (en) * 2002-11-13 2006-11-02 Peter Leslie Moran Electrical circuit board
DE102004024461A1 (de) * 2004-05-14 2005-12-01 Konarka Technologies, Inc., Lowell Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauelements mit zumindest einer aktiven organischen Schicht
US20090133908A1 (en) * 2007-11-28 2009-05-28 Goodner Michael D Interconnect structure for a microelectronic device, method of manfacturing same, and microelectronic structure containing same
US8734659B2 (en) * 2008-10-09 2014-05-27 Bandgap Engineering Inc. Process for structuring silicon
US20110117387A1 (en) * 2009-11-17 2011-05-19 Shivaraman Ramaswamy Method for producing metal nanodots

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644482A (en) * 1961-10-30 1972-02-22 Geigy Ag J R (4-hydroxy-5-alkylphenyl) alkanoic acid esters of polyols
US3285855A (en) * 1965-03-11 1966-11-15 Geigy Chem Corp Stabilization of organic material with esters containing an alkylhydroxy-phenyl group
US3873361A (en) * 1973-11-29 1975-03-25 Ibm Method of depositing thin film utilizing a lift-off mask
US4004044A (en) * 1975-05-09 1977-01-18 International Business Machines Corporation Method for forming patterned films utilizing a transparent lift-off mask
US4035276A (en) * 1976-04-29 1977-07-12 Ibm Corporation Making coplanar layers of thin films
US4279986A (en) * 1977-06-01 1981-07-21 Nippon Electric Co., Ltd. Negative resist and radical scavenger composition with capability of preventing post-irradiation polymerization
US4202914A (en) * 1978-12-29 1980-05-13 International Business Machines Corporation Method of depositing thin films of small dimensions utilizing silicon nitride lift-off mask
US4346125A (en) * 1980-12-08 1982-08-24 Bell Telephone Laboratories, Incorporated Removing hardened organic materials during fabrication of integrated circuits using anhydrous hydrazine solvent

Also Published As

Publication number Publication date
EP0132585A2 (de) 1985-02-13
EP0132585B1 (de) 1991-09-04
JPS608360A (ja) 1985-01-17
EP0132585A3 (en) 1987-09-30
US4606931A (en) 1986-08-19
JPH0368904B2 (de) 1991-10-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee