DE3474885D1 - A semiconductor device comprising an alpha-rays shielding layer - Google Patents

A semiconductor device comprising an alpha-rays shielding layer

Info

Publication number
DE3474885D1
DE3474885D1 DE8484107471T DE3474885T DE3474885D1 DE 3474885 D1 DE3474885 D1 DE 3474885D1 DE 8484107471 T DE8484107471 T DE 8484107471T DE 3474885 T DE3474885 T DE 3474885T DE 3474885 D1 DE3474885 D1 DE 3474885D1
Authority
DE
Germany
Prior art keywords
alpha
semiconductor device
shielding layer
rays shielding
rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484107471T
Other languages
German (de)
English (en)
Inventor
Fusaji Shoji
Akihiro Kenmotsu
Isao Obara
Hitoshi Yokono
Takeshi Komaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3474885D1 publication Critical patent/DE3474885D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W76/17—
    • H10W74/137—
    • H10W42/25—
    • H10W74/47—
    • H10W70/682—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W90/754—
    • H10W90/756—
DE8484107471T 1983-07-01 1984-06-28 A semiconductor device comprising an alpha-rays shielding layer Expired DE3474885D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58118140A JPS6012744A (ja) 1983-07-01 1983-07-01 半導体装置

Publications (1)

Publication Number Publication Date
DE3474885D1 true DE3474885D1 (en) 1988-12-01

Family

ID=14729052

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484107471T Expired DE3474885D1 (en) 1983-07-01 1984-06-28 A semiconductor device comprising an alpha-rays shielding layer

Country Status (5)

Country Link
US (1) US4736012A (OSRAM)
EP (1) EP0130571B1 (OSRAM)
JP (1) JPS6012744A (OSRAM)
KR (1) KR890004547B1 (OSRAM)
DE (1) DE3474885D1 (OSRAM)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536841A (en) * 1976-07-09 1978-01-21 Matsushita Electric Industrial Co Ltd Battery
JPS60245150A (ja) * 1984-05-21 1985-12-04 Hitachi Ltd 半導体装置
JPH0680842B2 (ja) * 1986-06-27 1994-10-12 日東電工株式会社 光半導体装置
KR970007840B1 (ko) * 1987-06-26 1997-05-17 미다 가쓰시게 반도체 장치
JPH01110559A (ja) * 1987-10-23 1989-04-27 Hitachi Chem Co Ltd 半導体素子保護膜用組成物
US5260413A (en) * 1990-02-05 1993-11-09 E. I. Du Pont De Nemours And Company Coated, heat-sealable aromatic polyimide film having superior compressive strength
GB2279803B (en) * 1990-04-05 1995-05-24 Gen Electric A high density interconnect structure including a chamber
DE4115043A1 (de) * 1991-05-08 1997-07-17 Gen Electric Dichtgepackte Verbindungsstruktur, die eine Kammer enthält
US5153385A (en) * 1991-03-18 1992-10-06 Motorola, Inc. Transfer molded semiconductor package with improved adhesion
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
US5536584A (en) * 1992-01-31 1996-07-16 Hitachi, Ltd. Polyimide precursor, polyimide and metalization structure using said polyimide
US5659203A (en) * 1995-06-07 1997-08-19 International Business Machines Corporation Reworkable polymer chip encapsulant
KR100332666B1 (ko) * 1999-06-25 2002-04-17 홍영철 개별 착탈식 와이어 배선대
DE10229038B4 (de) * 2002-06-28 2013-08-14 Robert Bosch Gmbh Verkapptes Mikrostrukturbauelement mit Hochfrequenzdurchführung
US6956098B2 (en) 2002-09-20 2005-10-18 E. I. Du Pont De Nemours And Company High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US7348210B2 (en) * 2005-04-27 2008-03-25 International Business Machines Corporation Post bump passivation for soft error protection
US8288177B2 (en) * 2010-08-17 2012-10-16 International Business Machines Corporation SER testing for an IC chip using hot underfill
TWM409527U (en) * 2011-02-23 2011-08-11 Azurewave Technologies Inc Forming integrated circuit module
CN115023475A (zh) * 2020-01-30 2022-09-06 富士胶片株式会社 α射线屏蔽膜形成用组合物、α射线屏蔽膜、层叠体、半导体装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632433A (en) * 1967-03-29 1972-01-04 Hitachi Ltd Method for producing a semiconductor device
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
DE2326314C2 (de) * 1973-05-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Reliefstrukturen
JPS5421073B2 (OSRAM) * 1974-04-15 1979-07-27
US4091407A (en) * 1976-11-01 1978-05-23 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
DE3060913D1 (en) * 1979-05-12 1982-11-11 Fujitsu Ltd Improvement in method of manufacturing electronic device having multilayer wiring structure
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS56118204A (en) * 1980-02-25 1981-09-17 Ube Industries Polyimide insulating member
JPS56130318A (en) * 1980-03-19 1981-10-13 Ube Ind Ltd Preparation of polyimide film
JPS5715819A (en) * 1980-07-01 1982-01-27 Ube Ind Ltd Gas separating material
JPS57181146A (en) * 1981-04-30 1982-11-08 Hitachi Ltd Resin-sealed semiconductor device
JPS57188853A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Plastic molded type semiconductor device

Also Published As

Publication number Publication date
US4736012A (en) 1988-04-05
JPS6012744A (ja) 1985-01-23
KR850000790A (ko) 1985-03-09
EP0130571A2 (en) 1985-01-09
JPH0131699B2 (OSRAM) 1989-06-27
EP0130571B1 (en) 1988-10-26
KR890004547B1 (ko) 1989-11-13
EP0130571A3 (en) 1986-02-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee