DE3473845D1 - Method for polishing titanium carbide containing surfaces - Google Patents

Method for polishing titanium carbide containing surfaces

Info

Publication number
DE3473845D1
DE3473845D1 DE8484101833T DE3473845T DE3473845D1 DE 3473845 D1 DE3473845 D1 DE 3473845D1 DE 8484101833 T DE8484101833 T DE 8484101833T DE 3473845 T DE3473845 T DE 3473845T DE 3473845 D1 DE3473845 D1 DE 3473845D1
Authority
DE
Germany
Prior art keywords
titanium carbide
carbide containing
containing surfaces
polishing titanium
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484101833T
Other languages
German (de)
English (en)
Inventor
Jagtar Singh Basi
Eric Mendel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3473845D1 publication Critical patent/DE3473845D1/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE8484101833T 1983-03-10 1984-02-22 Method for polishing titanium carbide containing surfaces Expired DE3473845D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/473,938 US4435247A (en) 1983-03-10 1983-03-10 Method for polishing titanium carbide

Publications (1)

Publication Number Publication Date
DE3473845D1 true DE3473845D1 (en) 1988-10-13

Family

ID=23881617

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484101833T Expired DE3473845D1 (en) 1983-03-10 1984-02-22 Method for polishing titanium carbide containing surfaces

Country Status (4)

Country Link
US (1) US4435247A (enExample)
EP (1) EP0121706B1 (enExample)
JP (1) JPS59170274A (enExample)
DE (1) DE3473845D1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4702792A (en) * 1985-10-28 1987-10-27 International Business Machines Corporation Method of forming fine conductive lines, patterns and connectors
JPH01187930A (ja) * 1988-01-22 1989-07-27 Nippon Telegr & Teleph Corp <Ntt> 研磨剤及び研磨方法
JPH02190258A (ja) * 1989-01-20 1990-07-26 Nkk Corp チタン板の両面研磨方法
US5891352A (en) 1993-09-16 1999-04-06 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
JP2738291B2 (ja) * 1994-02-14 1998-04-08 日本電気株式会社 機械・化学研磨方法および研磨装置
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US5562530A (en) * 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5607341A (en) * 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5695384A (en) * 1994-12-07 1997-12-09 Texas Instruments Incorporated Chemical-mechanical polishing salt slurry
US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5708506A (en) * 1995-07-03 1998-01-13 Applied Materials, Inc. Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5709593A (en) 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
FR2761629B1 (fr) * 1997-04-07 1999-06-18 Hoechst France Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope
US6019665A (en) * 1998-04-30 2000-02-01 Fujitsu Limited Controlled retention of slurry in chemical mechanical polishing
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
JP2001121407A (ja) * 1999-10-21 2001-05-08 Nec Corp 研磨装置
FR2819245B1 (fr) * 2001-01-09 2004-11-26 Clariant Nouvelles suspensions aqueuses de silice colloidale anionique de ph neutre et leur procede de preparation, et leurs applications
US6910948B2 (en) * 2001-09-27 2005-06-28 Nsk Ltd. Needle bearing and method for grinding bearing parts thereof
DE10229047A1 (de) * 2002-06-28 2004-01-29 Clariant International Limited Verwendung kolloidaler anionischer Kieselsole als Klärungsmittel
US11077536B2 (en) 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3053646A (en) * 1960-07-15 1962-09-11 Dow Chemical Co Grinding and polishing compositions and method of making same
US3615955A (en) 1969-02-28 1971-10-26 Ibm Method for polishing a silicon surface
US3906678A (en) * 1972-09-14 1975-09-23 Buehler Ltd Automatic specimen polishing machine and method
US3869323A (en) 1973-12-28 1975-03-04 Ibm Method of polishing zinc selenide
US3869324A (en) 1973-12-28 1975-03-04 Ibm Method of polishing cadmium telluride
US3931696A (en) * 1974-03-04 1976-01-13 Veb Rathenower Optische Werke Device for making sections for specimens and specimen supports therefor
US4011099A (en) 1975-11-07 1977-03-08 Monsanto Company Preparation of damage-free surface on alpha-alumina
US4057939A (en) 1975-12-05 1977-11-15 International Business Machines Corporation Silicon wafer polishing
US4130847A (en) 1977-03-31 1978-12-19 International Business Machines Corporation Corrosion resistant thin film head assembly and method for making
US4251841A (en) 1979-06-01 1981-02-17 International Business Machines Corporation Magnetic head slider assembly

Also Published As

Publication number Publication date
US4435247A (en) 1984-03-06
EP0121706A3 (en) 1985-09-18
EP0121706B1 (en) 1988-09-07
JPS6219512B2 (enExample) 1987-04-28
EP0121706A2 (en) 1984-10-17
JPS59170274A (ja) 1984-09-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee