DE3466136D1 - Rectifier device - Google Patents
Rectifier deviceInfo
- Publication number
- DE3466136D1 DE3466136D1 DE8484300146T DE3466136T DE3466136D1 DE 3466136 D1 DE3466136 D1 DE 3466136D1 DE 8484300146 T DE8484300146 T DE 8484300146T DE 3466136 T DE3466136 T DE 3466136T DE 3466136 D1 DE3466136 D1 DE 3466136D1
- Authority
- DE
- Germany
- Prior art keywords
- rectifier device
- rectifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Rectifiers (AREA)
- Synchronous Machinery (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1338883A JPS59138357A (ja) | 1983-01-28 | 1983-01-28 | 整流装置 |
JP58013387A JPS59138356A (ja) | 1983-01-28 | 1983-01-28 | 整流装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3466136D1 true DE3466136D1 (de) | 1987-10-15 |
Family
ID=26349171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484300146T Expired DE3466136D1 (de) | 1983-01-28 | 1984-01-10 | Rectifier device |
Country Status (3)
Country | Link |
---|---|
US (1) | US4646131A (de) |
EP (1) | EP0115386B1 (de) |
DE (1) | DE3466136D1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE34696E (en) * | 1985-11-29 | 1994-08-16 | Mitsubishi Denki Kabushiki | Semiconductor device housing with electrodes in press contact with the opposite sides of chip |
US4829364A (en) * | 1985-11-29 | 1989-05-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
DE3718598A1 (de) * | 1986-06-04 | 1987-12-10 | Mitsubishi Electric Corp | Halbleiteranordnung |
US4987476A (en) * | 1988-02-01 | 1991-01-22 | General Instrument Corporation | Brazed glass pre-passivated chip rectifier |
US4994890A (en) * | 1989-11-27 | 1991-02-19 | Snap-On Tools Corporation | Rectifier structure with individual links |
JP3458531B2 (ja) * | 1995-06-02 | 2003-10-20 | 株式会社デンソー | 交流発電機 |
DE19530264A1 (de) * | 1995-08-17 | 1997-02-20 | Abb Management Ag | Leistungshalbleitermodul |
US6107711A (en) * | 1998-08-21 | 2000-08-22 | Emerson Electric Co. | Brushless exciter for a rotating electromagnetic machine |
HRP990234A2 (en) * | 1999-07-23 | 2001-04-30 | Končar - Elektronika I Informatika D.D. Zagreb | Arrangement of bilaterally cooled energetic semiconductor valves protected from negative environmental effects |
EP1263045A1 (de) * | 2001-06-01 | 2002-12-04 | ABB Schweiz AG | Leistungshalbleitermodul |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2751528A (en) * | 1954-12-01 | 1956-06-19 | Gen Electric | Rectifier cell mounting |
SE321741B (de) * | 1966-02-23 | 1970-03-16 | Asea Ab | |
CA869745A (en) * | 1967-09-11 | 1971-04-27 | R. Petersen Sigrud | Spring mounted pressure diodes |
JPS5030428B1 (de) * | 1969-03-31 | 1975-10-01 | ||
US3654528A (en) * | 1970-08-03 | 1972-04-04 | Gen Electric | Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer |
DE2300935A1 (de) * | 1972-03-06 | |||
US3852628A (en) * | 1972-09-11 | 1974-12-03 | Westinghouse Electric Corp | Rectifier assembly for brushless excitation systems |
JPS5318266Y2 (de) * | 1973-01-25 | 1978-05-16 | ||
US3872335A (en) * | 1974-03-07 | 1975-03-18 | Westinghouse Electric Corp | Rotating rectifier assembly for brushless exciters |
US4021839A (en) * | 1975-10-16 | 1977-05-03 | Rca Corporation | Diode package |
DE2556749A1 (de) * | 1975-12-17 | 1977-06-23 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement in scheibenzellenbauweise |
JPS5354971A (en) * | 1976-10-28 | 1978-05-18 | Mitsubishi Electric Corp | Semiconductor device |
US4274106A (en) * | 1977-11-07 | 1981-06-16 | Mitsubishi Denki Kabushiki Kaisha | Explosion proof vibration resistant flat package semiconductor device |
JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
DE2841370A1 (de) * | 1978-09-22 | 1980-03-27 | Siemens Ag | Vorrichtung zum einspannen eines scheibenfoermigen halbleiterbauelements |
US4313128A (en) * | 1979-05-08 | 1982-01-26 | Westinghouse Electric Corp. | Compression bonded electronic device comprising a plurality of discrete semiconductor devices |
EP0054597A1 (de) * | 1980-12-18 | 1982-06-30 | International Business Machines Corporation | Kühlanordnung für Modul-Steckerstifte |
-
1983
- 1983-11-18 US US06/553,395 patent/US4646131A/en not_active Expired - Lifetime
-
1984
- 1984-01-10 EP EP84300146A patent/EP0115386B1/de not_active Expired
- 1984-01-10 DE DE8484300146T patent/DE3466136D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4646131A (en) | 1987-02-24 |
EP0115386A1 (de) | 1984-08-08 |
EP0115386B1 (de) | 1987-09-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR8401736A (pt) | Dispositivo fotovoltaico | |
AT385886B (de) | Befestigungsvorrichtung | |
MX161765A (es) | Dispositivo de conexion | |
IT1176163B (it) | Dispositivo assortitore | |
KR850009581U (ko) | 에스컬레이터 장치 | |
AT386113B (de) | Befestigungsvorrichtung | |
KR840006156U (ko) | 엘리베이터 장치 | |
DE3466136D1 (de) | Rectifier device | |
BR8305291A (pt) | Dispositivo anti-ofuscante | |
DK327884D0 (da) | Ensretterarrangement | |
KR850000462U (ko) | 조작장치 | |
ATA367084A (de) | Verbindungseinrichtung | |
IT1160548B (it) | Dispositivo per la filatura-ritorcitura | |
RO90231A (ro) | Dispozitiv de sustinere | |
DE3166830D1 (de) | Rectifier device | |
ATA177287A (de) | Befestigungsvorrichtung | |
NO834534L (no) | Forbindelsesinnretning | |
KR850003265U (ko) | 엘리베이터의 위치표시 장치 | |
ES274840Y (es) | Dispositivo erosionador | |
ES273605Y (es) | Dispositivo resucitador-reanimador | |
KR840004603U (ko) | 게장치 | |
RO85941A2 (ro) | Dispozitiv antivibrator | |
KR850003003U (ko) | 설합의 활지장치 | |
BR6300323U (pt) | Dispositivo imantado | |
BR6301427U (pt) | Dispositivo limitador |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |