DE3466136D1 - Rectifier device - Google Patents

Rectifier device

Info

Publication number
DE3466136D1
DE3466136D1 DE8484300146T DE3466136T DE3466136D1 DE 3466136 D1 DE3466136 D1 DE 3466136D1 DE 8484300146 T DE8484300146 T DE 8484300146T DE 3466136 T DE3466136 T DE 3466136T DE 3466136 D1 DE3466136 D1 DE 3466136D1
Authority
DE
Germany
Prior art keywords
rectifier device
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484300146T
Other languages
English (en)
Inventor
Nobutada Amagasa
Ryoji Takatani
Hiroshi Inoo
Kazuichi Room No E Suzuki
Mitsuo C O Wakaba Dor Kiriyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58013387A external-priority patent/JPS59138356A/ja
Priority claimed from JP1338883A external-priority patent/JPS59138357A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE3466136D1 publication Critical patent/DE3466136D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)
DE8484300146T 1983-01-28 1984-01-10 Rectifier device Expired DE3466136D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58013387A JPS59138356A (ja) 1983-01-28 1983-01-28 整流装置
JP1338883A JPS59138357A (ja) 1983-01-28 1983-01-28 整流装置

Publications (1)

Publication Number Publication Date
DE3466136D1 true DE3466136D1 (de) 1987-10-15

Family

ID=26349171

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484300146T Expired DE3466136D1 (de) 1983-01-28 1984-01-10 Rectifier device

Country Status (3)

Country Link
US (1) US4646131A (de)
EP (1) EP0115386B1 (de)
DE (1) DE3466136D1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829364A (en) * 1985-11-29 1989-05-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
DE3718598A1 (de) * 1986-06-04 1987-12-10 Mitsubishi Electric Corp Halbleiteranordnung
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
US4994890A (en) * 1989-11-27 1991-02-19 Snap-On Tools Corporation Rectifier structure with individual links
JP3458531B2 (ja) * 1995-06-02 2003-10-20 株式会社デンソー 交流発電機
DE19530264A1 (de) * 1995-08-17 1997-02-20 Abb Management Ag Leistungshalbleitermodul
US6107711A (en) * 1998-08-21 2000-08-22 Emerson Electric Co. Brushless exciter for a rotating electromagnetic machine
HRP990234A2 (en) * 1999-07-23 2001-04-30 Končar - Elektronika I Informatika D.D. Zagreb Arrangement of bilaterally cooled energetic semiconductor valves protected from negative environmental effects
EP1263045A1 (de) * 2001-06-01 2002-12-04 ABB Schweiz AG Leistungshalbleitermodul

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
SE321741B (de) * 1966-02-23 1970-03-16 Asea Ab
CA869745A (en) * 1967-09-11 1971-04-27 R. Petersen Sigrud Spring mounted pressure diodes
JPS5030428B1 (de) * 1969-03-31 1975-10-01
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
DE2300935A1 (de) * 1972-03-06
US3852628A (en) * 1972-09-11 1974-12-03 Westinghouse Electric Corp Rectifier assembly for brushless excitation systems
JPS5318266Y2 (de) * 1973-01-25 1978-05-16
US3872335A (en) * 1974-03-07 1975-03-18 Westinghouse Electric Corp Rotating rectifier assembly for brushless exciters
US4021839A (en) * 1975-10-16 1977-05-03 Rca Corporation Diode package
DE2556749A1 (de) * 1975-12-17 1977-06-23 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement in scheibenzellenbauweise
JPS5354971A (en) * 1976-10-28 1978-05-18 Mitsubishi Electric Corp Semiconductor device
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
DE2841370A1 (de) * 1978-09-22 1980-03-27 Siemens Ag Vorrichtung zum einspannen eines scheibenfoermigen halbleiterbauelements
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
EP0054597A1 (de) * 1980-12-18 1982-06-30 International Business Machines Corporation Kühlanordnung für Modul-Steckerstifte

Also Published As

Publication number Publication date
EP0115386B1 (de) 1987-09-09
US4646131A (en) 1987-02-24
EP0115386A1 (de) 1984-08-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee