DE3464298D1 - Method of manufacturing a semiconductor device by means of a molecular beam technique - Google Patents

Method of manufacturing a semiconductor device by means of a molecular beam technique

Info

Publication number
DE3464298D1
DE3464298D1 DE8484200296T DE3464298T DE3464298D1 DE 3464298 D1 DE3464298 D1 DE 3464298D1 DE 8484200296 T DE8484200296 T DE 8484200296T DE 3464298 T DE3464298 T DE 3464298T DE 3464298 D1 DE3464298 D1 DE 3464298D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
molecular beam
beam technique
technique
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484200296T
Other languages
English (en)
Inventor
Jan Haisma
Poul Kjaerby Larsen
Jong Tim De
Der Veen Johannes Friso Van
Willem Alle Sander Douma
Frans Willem Saris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE3464298D1 publication Critical patent/DE3464298D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02461—Phosphides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02387—Group 13/15 materials
    • H01L21/02392—Phosphides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02658—Pretreatments
    • H01L21/02661—In-situ cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/003—Anneal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/007—Autodoping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/025—Deposition multi-step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/123—Polycrystalline diffuse anneal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/169—Vacuum deposition, e.g. including molecular beam epitaxy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Recrystallisation Techniques (AREA)
DE8484200296T 1983-03-03 1984-03-01 Method of manufacturing a semiconductor device by means of a molecular beam technique Expired DE3464298D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8300780A NL8300780A (nl) 1983-03-03 1983-03-03 Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een moleculaire bundeltechniek.

Publications (1)

Publication Number Publication Date
DE3464298D1 true DE3464298D1 (en) 1987-07-23

Family

ID=19841495

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484200296T Expired DE3464298D1 (en) 1983-03-03 1984-03-01 Method of manufacturing a semiconductor device by means of a molecular beam technique

Country Status (5)

Country Link
US (1) US4554030A (de)
EP (1) EP0127200B1 (de)
JP (1) JPS59211216A (de)
DE (1) DE3464298D1 (de)
NL (1) NL8300780A (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047111A (en) * 1985-03-16 1991-09-10 Director-General Of The Agency Of Industrial Science And Technology Method of forming a metal silicide film
US4757030A (en) * 1985-06-20 1988-07-12 Cornell Research Foundation, Inc. Method of making group IV single crystal layers on group III-V substrates using solid phase epitaxial growth
JPS62119196A (ja) * 1985-11-18 1987-05-30 Univ Nagoya 化合物半導体の成長方法
JPH0834180B2 (ja) * 1986-08-26 1996-03-29 セイコー電子工業株式会社 化合物半導体薄膜の成長方法
US4860066A (en) * 1987-01-08 1989-08-22 International Business Machines Corporation Semiconductor electro-optical conversion
US4786616A (en) * 1987-06-12 1988-11-22 American Telephone And Telegraph Company Method for heteroepitaxial growth using multiple MBE chambers
US5081062A (en) * 1987-08-27 1992-01-14 Prahalad Vasudev Monolithic integration of silicon on insulator and gallium arsenide semiconductor technologies
US5594280A (en) * 1987-10-08 1997-01-14 Anelva Corporation Method of forming a thin film and apparatus of forming a metal thin film utilizing temperature controlling means
JPH01183825A (ja) * 1988-01-19 1989-07-21 Sanyo Electric Co Ltd 単結晶シリコン膜の形成方法
US4952527A (en) * 1988-02-19 1990-08-28 Massachusetts Institute Of Technology Method of making buffer layers for III-V devices using solid phase epitaxy
JP2691721B2 (ja) * 1988-03-04 1997-12-17 富士通株式会社 半導体薄膜の製造方法
US5086321A (en) * 1988-06-15 1992-02-04 International Business Machines Corporation Unpinned oxide-compound semiconductor structures and method of forming same
US4987095A (en) * 1988-06-15 1991-01-22 International Business Machines Corp. Method of making unpinned oxide-compound semiconductor structures
US6387781B1 (en) 1990-05-18 2002-05-14 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of forming three-dimensional semiconductors structures
US5262361A (en) * 1992-01-07 1993-11-16 Texas Instruments Incorporated Via filling by single crystal aluminum
US5501174A (en) * 1994-04-07 1996-03-26 Texas Instruments Incorporated Aluminum metallization for sige devices
US8391534B2 (en) 2008-07-23 2013-03-05 Asius Technologies, Llc Inflatable ear device
DE102013112785B3 (de) * 2013-11-19 2015-02-26 Aixatech Gmbh Verfahren zur Herstellung eines Verbundkörpers mit zumindest einer funktionellen Schicht oder zur weiteren Herstellung elektronischer oder opto-elektronischer Bauelemente

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615931A (en) * 1968-12-27 1971-10-26 Bell Telephone Labor Inc Technique for growth of epitaxial compound semiconductor films
US3988172A (en) * 1975-06-16 1976-10-26 Bell Telephone Laboratories, Incorporated Annealing solar cells of InP/CdS
US4039357A (en) * 1976-08-27 1977-08-02 Bell Telephone Laboratories, Incorporated Etching of III-V semiconductor materials with H2 S in the preparation of heterodiodes to facilitate the deposition of cadmium sulfide

Also Published As

Publication number Publication date
JPS59211216A (ja) 1984-11-30
US4554030A (en) 1985-11-19
NL8300780A (nl) 1984-10-01
JPH0360171B2 (de) 1991-09-12
EP0127200B1 (de) 1987-06-16
EP0127200A1 (de) 1984-12-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee