DE3464109D1 - Integrated circuit package holder - Google Patents

Integrated circuit package holder

Info

Publication number
DE3464109D1
DE3464109D1 DE8484401898T DE3464109T DE3464109D1 DE 3464109 D1 DE3464109 D1 DE 3464109D1 DE 8484401898 T DE8484401898 T DE 8484401898T DE 3464109 T DE3464109 T DE 3464109T DE 3464109 D1 DE3464109 D1 DE 3464109D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit package
package holder
holder
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484401898T
Other languages
English (en)
Inventor
Georges Nalbanti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE3464109D1 publication Critical patent/DE3464109D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/216—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for button or coin cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
DE8484401898T 1983-09-23 1984-09-21 Integrated circuit package holder Expired DE3464109D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8315150A FR2552590B1 (fr) 1983-09-23 1983-09-23 Support de boitier de circuit integre

Publications (1)

Publication Number Publication Date
DE3464109D1 true DE3464109D1 (en) 1987-07-09

Family

ID=9292480

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484401898T Expired DE3464109D1 (en) 1983-09-23 1984-09-21 Integrated circuit package holder

Country Status (5)

Country Link
US (1) US4633239A (de)
EP (1) EP0136237B1 (de)
JP (1) JPS6091658A (de)
DE (1) DE3464109D1 (de)
FR (1) FR2552590B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX167287B (es) * 1987-11-23 1993-03-15 Lancer Corp Aparato para controlar el crecimiento de un banco de hielo alrededor de un aparato de enfriamiento
US5038467A (en) * 1989-11-09 1991-08-13 Advanced Interconnections Corporation Apparatus and method for installation of multi-pin components on circuit boards
US4985989A (en) * 1989-11-09 1991-01-22 Advanced Interconnections Corporation Method and apparatus for removing a multi-pin component installed in sockets on a circuit board
JP2681109B2 (ja) * 1989-11-14 1997-11-26 山一電機株式会社 電気部品用接続器
US5287617A (en) * 1992-08-11 1994-02-22 Advanced Interconnections Corporation Apparatus for extracting an integrated circuit package installed in a socket on a circuit board
JPH08179698A (ja) * 1994-12-20 1996-07-12 Niles Parts Co Ltd 表示装置の組立構造及び組立方法
US6992378B2 (en) * 2000-12-30 2006-01-31 Intel Corporation Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
JP2002275976A (ja) * 2001-03-21 2002-09-25 Toto Ltd 圧送装置
US7088074B2 (en) * 2002-01-02 2006-08-08 International Business Machines Corporation System level device for battery and integrated circuit integration
EP1691431A1 (de) * 2005-02-14 2006-08-16 SAT Akkumulatoren Technik AG Verbindungselement zur Verbindung von Zellen zu Akkumulatoren
EP2942739A1 (de) * 2014-05-07 2015-11-11 Siemens Aktiengesellschaft Halterung für RFID-Transponder, RFID-Transponder und Betätigungswerkzeug

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2748328A (en) * 1953-12-14 1956-05-29 Premier Res Lab Inc Combination pronged base for electrical devices
US2782389A (en) * 1954-01-11 1957-02-19 Motorola Inc Subminiature tube receptacle
US3289045A (en) * 1964-03-02 1966-11-29 Intellux Inc Circuit module
US3634600A (en) * 1969-07-22 1972-01-11 Ceramic Metal Systems Inc Ceramic package
BE757101A (fr) * 1969-10-06 1971-03-16 Grisby Barton Inc Assemblage de relais
FR2445630A1 (fr) * 1969-10-15 1980-07-25 Amerace Corp Connecteur pour plaquette porte-circuit
US3880493A (en) * 1973-12-28 1975-04-29 Burroughs Corp Capacitor socket for a dual-in-line package
US4245877A (en) * 1976-12-30 1981-01-20 Burndy Corporation Circuit package receptacle with movable base separation means
US4107400A (en) * 1977-06-24 1978-08-15 Timex Corporation Battery hatch cover
GB2084769B (en) * 1980-08-06 1985-03-13 Racal Microelect System Back-up electrical power supply
EP0081484B1 (de) * 1981-05-27 1986-11-20 Mostek Corporation Modul für integrierte schaltung mit batterieraum

Also Published As

Publication number Publication date
EP0136237A1 (de) 1985-04-03
FR2552590A1 (fr) 1985-03-29
US4633239A (en) 1986-12-30
FR2552590B1 (fr) 1986-03-28
JPS6091658A (ja) 1985-05-23
EP0136237B1 (de) 1987-06-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee