DE3463949D1 - Method for conditioning a surface of a dielectric substrate for electroless plating - Google Patents

Method for conditioning a surface of a dielectric substrate for electroless plating

Info

Publication number
DE3463949D1
DE3463949D1 DE8484111285T DE3463949T DE3463949D1 DE 3463949 D1 DE3463949 D1 DE 3463949D1 DE 8484111285 T DE8484111285 T DE 8484111285T DE 3463949 T DE3463949 T DE 3463949T DE 3463949 D1 DE3463949 D1 DE 3463949D1
Authority
DE
Germany
Prior art keywords
conditioning
dielectric substrate
electroless plating
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484111285T
Other languages
English (en)
Inventor
James R Bupp
Gary Kevin Lemon
Voya Markovich
Carlos J Sambucetti
Stephen L Tisdale
Donna J Trevitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3463949D1 publication Critical patent/DE3463949D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8484111285T 1983-10-11 1984-09-21 Method for conditioning a surface of a dielectric substrate for electroless plating Expired DE3463949D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54096283A 1983-10-11 1983-10-11

Publications (1)

Publication Number Publication Date
DE3463949D1 true DE3463949D1 (en) 1987-07-02

Family

ID=24157631

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484111285T Expired DE3463949D1 (en) 1983-10-11 1984-09-21 Method for conditioning a surface of a dielectric substrate for electroless plating

Country Status (3)

Country Link
EP (1) EP0139233B1 (de)
JP (1) JPS6083395A (de)
DE (1) DE3463949D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2666470B2 (ja) * 1989-05-09 1997-10-22 日立化成工業株式会社 無電解めっき法
US5254156A (en) * 1989-05-09 1993-10-19 Hitachi Chemical Company, Ltd. Aqueous solution for activation accelerating treatment
JPH04282887A (ja) * 1991-03-11 1992-10-07 Nec Corp プリント配線板の製造方法
DE4141416A1 (de) * 1991-12-11 1993-06-17 Schering Ag Verfahren zur beschichtung von oberflaechen mit feinteiligen feststoff-partikeln
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627593A (en) * 1979-08-14 1981-03-17 Fujitsu Ltd Check system
DE3137587A1 (de) * 1981-09-22 1983-04-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur vorbehandlung von formteilen aus polyamiden fuer das aufbringen haftfester, chemisch abgeschiedener metallbeschichtungen
US4478883A (en) * 1982-07-14 1984-10-23 International Business Machines Corporation Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
JPS6321752A (ja) * 1986-07-15 1988-01-29 Tanaka Kikinzoku Kogyo Kk ガス拡散電極

Also Published As

Publication number Publication date
EP0139233A1 (de) 1985-05-02
JPH0236075B2 (de) 1990-08-15
EP0139233B1 (de) 1987-05-27
JPS6083395A (ja) 1985-05-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee