DE3412724A1 - Verfahren und anordnung zum messen der schichtdicke und/oder der konzentration von auf substraten abgeschiedenen duennen schichten waehrend ihrer herstellung - Google Patents
Verfahren und anordnung zum messen der schichtdicke und/oder der konzentration von auf substraten abgeschiedenen duennen schichten waehrend ihrer herstellungInfo
- Publication number
- DE3412724A1 DE3412724A1 DE19843412724 DE3412724A DE3412724A1 DE 3412724 A1 DE3412724 A1 DE 3412724A1 DE 19843412724 DE19843412724 DE 19843412724 DE 3412724 A DE3412724 A DE 3412724A DE 3412724 A1 DE3412724 A1 DE 3412724A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate holder
- measuring
- measuring system
- arrangement according
- layer thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000010453 quartz Substances 0.000 claims abstract description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 28
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 3
- 238000005259 measurement Methods 0.000 claims description 21
- 239000013078 crystal Substances 0.000 claims description 19
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 238000010410 dusting Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 210000000056 organ Anatomy 0.000 claims 2
- 238000009529 body temperature measurement Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009675 coating thickness measurement Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012625 in-situ measurement Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/063—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators
- G01B7/066—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators for measuring thickness of coating
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843412724 DE3412724A1 (de) | 1984-04-04 | 1984-04-04 | Verfahren und anordnung zum messen der schichtdicke und/oder der konzentration von auf substraten abgeschiedenen duennen schichten waehrend ihrer herstellung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843412724 DE3412724A1 (de) | 1984-04-04 | 1984-04-04 | Verfahren und anordnung zum messen der schichtdicke und/oder der konzentration von auf substraten abgeschiedenen duennen schichten waehrend ihrer herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3412724A1 true DE3412724A1 (de) | 1985-10-17 |
| DE3412724C2 DE3412724C2 (enrdf_load_stackoverflow) | 1991-01-10 |
Family
ID=6232686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19843412724 Granted DE3412724A1 (de) | 1984-04-04 | 1984-04-04 | Verfahren und anordnung zum messen der schichtdicke und/oder der konzentration von auf substraten abgeschiedenen duennen schichten waehrend ihrer herstellung |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3412724A1 (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3710365A1 (de) * | 1987-03-28 | 1988-10-13 | Messerschmitt Boelkow Blohm | Verfahren zur reproduzierbaren bildung von materialschichten und/oder behandlung von halbleiter-materialschichten |
| US4817430A (en) * | 1987-01-08 | 1989-04-04 | Leybold Aktiengesellschaft | System for determining the thickness of varying material coatings |
| DE3732594A1 (de) * | 1987-09-28 | 1989-04-06 | Leybold Ag | Einrichtung zum ermitteln der jeweiligen dicke von sich veraendernden material-schichten auf einem substrat |
| US5079958A (en) * | 1989-03-17 | 1992-01-14 | Olympus Optical Co., Ltd. | Sensor having a cantilever |
| US6895831B2 (en) * | 1998-03-06 | 2005-05-24 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
| WO2011039191A1 (en) * | 2009-10-02 | 2011-04-07 | Applied Materials, Inc. | Coating thickness measuring device and method |
| CN107388953A (zh) * | 2017-08-30 | 2017-11-24 | 苏州昌田机械设备制造有限公司 | 一种金属表面涂层厚度测试仪 |
| CN108893722A (zh) * | 2018-05-10 | 2018-11-27 | 京东方科技集团股份有限公司 | 蒸镀设备中晶振片位置的检测方法、蒸镀方法及相关装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3667424A (en) * | 1969-04-14 | 1972-06-06 | Stanford Research Inst | Multi-station vacuum apparatus |
| US4207836A (en) * | 1977-07-01 | 1980-06-17 | Hitachi, Ltd. | Vacuum vapor-deposition apparatus |
| DE3120443A1 (de) * | 1980-07-21 | 1982-05-06 | Balzers Hochvakuum Gmbh, 6200 Wiesbaden | "schwingquarzmesskopf" |
-
1984
- 1984-04-04 DE DE19843412724 patent/DE3412724A1/de active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3667424A (en) * | 1969-04-14 | 1972-06-06 | Stanford Research Inst | Multi-station vacuum apparatus |
| US4207836A (en) * | 1977-07-01 | 1980-06-17 | Hitachi, Ltd. | Vacuum vapor-deposition apparatus |
| DE3120443A1 (de) * | 1980-07-21 | 1982-05-06 | Balzers Hochvakuum Gmbh, 6200 Wiesbaden | "schwingquarzmesskopf" |
Non-Patent Citations (1)
| Title |
|---|
| W. Hofmann, H. Gatzmanga, Einführung in die Betriebsmeßtechnik, VEB-Verlag Technik, Berlin, 1972, S. 42-44 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4817430A (en) * | 1987-01-08 | 1989-04-04 | Leybold Aktiengesellschaft | System for determining the thickness of varying material coatings |
| DE3710365A1 (de) * | 1987-03-28 | 1988-10-13 | Messerschmitt Boelkow Blohm | Verfahren zur reproduzierbaren bildung von materialschichten und/oder behandlung von halbleiter-materialschichten |
| DE3732594A1 (de) * | 1987-09-28 | 1989-04-06 | Leybold Ag | Einrichtung zum ermitteln der jeweiligen dicke von sich veraendernden material-schichten auf einem substrat |
| WO1989003016A1 (en) * | 1987-09-28 | 1989-04-06 | Leybold Aktiengesellschaft | Device for determining the relevant thicknesses of variable layers of material on a substrate |
| US5079958A (en) * | 1989-03-17 | 1992-01-14 | Olympus Optical Co., Ltd. | Sensor having a cantilever |
| US7331250B2 (en) | 1998-03-06 | 2008-02-19 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
| US6895831B2 (en) * | 1998-03-06 | 2005-05-24 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
| US7434485B2 (en) | 1998-03-06 | 2008-10-14 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
| WO2011039191A1 (en) * | 2009-10-02 | 2011-04-07 | Applied Materials, Inc. | Coating thickness measuring device and method |
| EP2309220A1 (en) * | 2009-10-02 | 2011-04-13 | Applied Materials, Inc. | Coating thickness measuring device and method |
| CN107388953A (zh) * | 2017-08-30 | 2017-11-24 | 苏州昌田机械设备制造有限公司 | 一种金属表面涂层厚度测试仪 |
| CN108893722A (zh) * | 2018-05-10 | 2018-11-27 | 京东方科技集团股份有限公司 | 蒸镀设备中晶振片位置的检测方法、蒸镀方法及相关装置 |
| CN108893722B (zh) * | 2018-05-10 | 2019-06-28 | 京东方科技集团股份有限公司 | 蒸镀设备中晶振片位置的检测方法、蒸镀方法及相关装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3412724C2 (enrdf_load_stackoverflow) | 1991-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |