DE3412296A1 - Hybridschaltung in multilayer-technik - Google Patents

Hybridschaltung in multilayer-technik

Info

Publication number
DE3412296A1
DE3412296A1 DE19843412296 DE3412296A DE3412296A1 DE 3412296 A1 DE3412296 A1 DE 3412296A1 DE 19843412296 DE19843412296 DE 19843412296 DE 3412296 A DE3412296 A DE 3412296A DE 3412296 A1 DE3412296 A1 DE 3412296A1
Authority
DE
Germany
Prior art keywords
hybrid circuit
metal substrate
circuit according
thin
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843412296
Other languages
German (de)
English (en)
Other versions
DE3412296C2 (https=
Inventor
Hartwig Dipl.-Phys. 6806 Viernheim Gernoth
Dieter Dipl.-Ing. 6840 Lampertheim Gilbers
Hans-Joachim Dipl.-Phys. Dr. 6907 Nußloch Krokoszinski
Henning Dipl.-Phys. Dr. 6922 Mauer Oetzmann
Conrad Dipl.-Phys. Dr. 6901 Gaiberg Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Germany
Priority to DE19843412296 priority Critical patent/DE3412296A1/de
Publication of DE3412296A1 publication Critical patent/DE3412296A1/de
Application granted granted Critical
Publication of DE3412296C2 publication Critical patent/DE3412296C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE19843412296 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik Granted DE3412296A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843412296 DE3412296A1 (de) 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843412296 DE3412296A1 (de) 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik

Publications (2)

Publication Number Publication Date
DE3412296A1 true DE3412296A1 (de) 1985-10-03
DE3412296C2 DE3412296C2 (https=) 1989-07-06

Family

ID=6232405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843412296 Granted DE3412296A1 (de) 1984-04-03 1984-04-03 Hybridschaltung in multilayer-technik

Country Status (1)

Country Link
DE (1) DE3412296A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0258691A3 (de) * 1986-09-03 1989-09-13 HÜCO GmbH Spannungsregler für Generatoren
DE3813565A1 (de) * 1988-04-22 1989-11-02 Bosch Gmbh Robert Elektrischer anschluss von hybridbaugruppen
DE4105152A1 (de) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Elektronische schaltungsanordnung
US5313701A (en) * 1990-04-14 1994-05-24 Robert Bosch Gmbh Assembly and testing of electronic power components insulation
DE4422216A1 (de) * 1993-06-25 1995-01-05 Fuji Electric Co Ltd Mehrlagige metallische Leiterplatte und gegossener Baustein

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2150695A1 (de) * 1971-10-12 1973-04-19 Bosch Gmbh Robert Verfahren zum isolierten aufbau von halbleiterelementen, gedruckten und/oder monolithisch und/oder hybrid integrierten schaltungen
DE7822999U1 (de) * 1978-08-01 1980-01-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Schichtschaltungsmodul
US4355199A (en) * 1975-10-10 1982-10-19 Luc Penelope Jane Vesey Conductive connections

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2150695A1 (de) * 1971-10-12 1973-04-19 Bosch Gmbh Robert Verfahren zum isolierten aufbau von halbleiterelementen, gedruckten und/oder monolithisch und/oder hybrid integrierten schaltungen
US4355199A (en) * 1975-10-10 1982-10-19 Luc Penelope Jane Vesey Conductive connections
DE7822999U1 (de) * 1978-08-01 1980-01-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Schichtschaltungsmodul

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
J.Lyman, "Flexible Circuits bend to Designers' Will", in Mikroelectronics Interconnections and Packaging, Mc Graw-Hill Publications Co., New York 1980, S. 120/121 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0258691A3 (de) * 1986-09-03 1989-09-13 HÜCO GmbH Spannungsregler für Generatoren
DE3813565A1 (de) * 1988-04-22 1989-11-02 Bosch Gmbh Robert Elektrischer anschluss von hybridbaugruppen
US5313701A (en) * 1990-04-14 1994-05-24 Robert Bosch Gmbh Assembly and testing of electronic power components insulation
DE4105152A1 (de) * 1991-02-20 1992-09-03 Export Contor Aussenhandel Elektronische schaltungsanordnung
DE4422216A1 (de) * 1993-06-25 1995-01-05 Fuji Electric Co Ltd Mehrlagige metallische Leiterplatte und gegossener Baustein

Also Published As

Publication number Publication date
DE3412296C2 (https=) 1989-07-06

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: BBC BROWN BOVERI AG, 6800 MANNHEIM, DE

8127 New person/name/address of the applicant

Owner name: ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee