DE3380265D1 - Method and apparatus for gas phase treatment of substrates - Google Patents
Method and apparatus for gas phase treatment of substratesInfo
- Publication number
- DE3380265D1 DE3380265D1 DE8383301464T DE3380265T DE3380265D1 DE 3380265 D1 DE3380265 D1 DE 3380265D1 DE 8383301464 T DE8383301464 T DE 8383301464T DE 3380265 T DE3380265 T DE 3380265T DE 3380265 D1 DE3380265 D1 DE 3380265D1
- Authority
- DE
- Germany
- Prior art keywords
- substrates
- gas phase
- phase treatment
- treatment
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/005—Oxydation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2902—Materials being Group IVA materials
- H10P14/2905—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57042456A JPS58158915A (ja) | 1982-03-16 | 1982-03-16 | 薄膜生成装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3380265D1 true DE3380265D1 (en) | 1989-08-31 |
Family
ID=12636564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8383301464T Expired DE3380265D1 (en) | 1982-03-16 | 1983-03-16 | Method and apparatus for gas phase treatment of substrates |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4486461A (enExample) |
| EP (1) | EP0089242B1 (enExample) |
| JP (1) | JPS58158915A (enExample) |
| DE (1) | DE3380265D1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60191269A (ja) * | 1984-03-13 | 1985-09-28 | Sharp Corp | 電子写真感光体製造装置 |
| GB2213836B (en) * | 1987-12-18 | 1992-08-26 | Gen Electric Co Plc | Vacuum deposition process |
| KR100297282B1 (ko) * | 1993-08-11 | 2001-10-24 | 마쓰바 구니유키 | 열처리장치 및 열처리방법 |
| US5514246A (en) * | 1994-06-02 | 1996-05-07 | Micron Technology, Inc. | Plasma reactors and method of cleaning a plasma reactor |
| US5569363A (en) * | 1994-10-25 | 1996-10-29 | Sony Corporation | Inductively coupled plasma sputter chamber with conductive material sputtering capabilities |
| US5643639A (en) * | 1994-12-22 | 1997-07-01 | Research Triangle Institute | Plasma treatment method for treatment of a large-area work surface apparatus and methods |
| US5874014A (en) * | 1995-06-07 | 1999-02-23 | Berkeley Scholars, Inc. | Durable plasma treatment apparatus and method |
| US6230719B1 (en) | 1998-02-27 | 2001-05-15 | Micron Technology, Inc. | Apparatus for removing contaminants on electronic devices |
| US6350321B1 (en) * | 1998-12-08 | 2002-02-26 | International Business Machines Corporation | UHV horizontal hot wall cluster CVD/growth design |
| US6291358B1 (en) | 1999-10-15 | 2001-09-18 | Micron Technology, Inc. | Plasma deposition tool operating method |
| JP4676567B1 (ja) * | 2010-07-20 | 2011-04-27 | 三井造船株式会社 | 半導体基板熱処理装置 |
| US9548378B2 (en) * | 2012-02-09 | 2017-01-17 | GlobalFoundries, Inc. | Epitaxial channel formation methods and structures |
| CN215925072U (zh) * | 2020-09-24 | 2022-03-01 | 株式会社国际电气 | 基板处理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4268538A (en) * | 1977-03-09 | 1981-05-19 | Atomel Corporation | High-pressure, high-temperature gaseous chemical method for silicon oxidation |
| JPS5845177B2 (ja) * | 1979-03-09 | 1983-10-07 | 富士通株式会社 | 半導体表面絶縁膜の形成法 |
| JPS5846057B2 (ja) * | 1979-03-19 | 1983-10-14 | 富士通株式会社 | プラズマ処理方法 |
| SE8004352L (sv) * | 1979-06-14 | 1980-12-15 | Atomic Energy Authority Uk | Vermeoverforingselement och -system |
| US4401689A (en) * | 1980-01-31 | 1983-08-30 | Rca Corporation | Radiation heated reactor process for chemical vapor deposition on substrates |
| JPS5710937A (en) * | 1980-06-25 | 1982-01-20 | Mitsubishi Electric Corp | Plasma gaseous phase growth device |
| US4339645A (en) * | 1980-07-03 | 1982-07-13 | Rca Corporation | RF Heating coil construction for stack of susceptors |
| JPS5724024A (en) * | 1980-07-16 | 1982-02-08 | Tdk Corp | Magnetic recording medium |
-
1982
- 1982-03-16 JP JP57042456A patent/JPS58158915A/ja active Granted
-
1983
- 1983-03-16 DE DE8383301464T patent/DE3380265D1/de not_active Expired
- 1983-03-16 US US06/476,551 patent/US4486461A/en not_active Expired - Lifetime
- 1983-03-16 EP EP83301464A patent/EP0089242B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0089242A2 (en) | 1983-09-21 |
| JPS58158915A (ja) | 1983-09-21 |
| JPH0377655B2 (enExample) | 1991-12-11 |
| EP0089242B1 (en) | 1989-07-26 |
| US4486461A (en) | 1984-12-04 |
| EP0089242A3 (en) | 1985-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |