DE3378710D1 - A sputtering cathode apparatus - Google Patents

A sputtering cathode apparatus

Info

Publication number
DE3378710D1
DE3378710D1 DE8383109357T DE3378710T DE3378710D1 DE 3378710 D1 DE3378710 D1 DE 3378710D1 DE 8383109357 T DE8383109357 T DE 8383109357T DE 3378710 T DE3378710 T DE 3378710T DE 3378710 D1 DE3378710 D1 DE 3378710D1
Authority
DE
Germany
Prior art keywords
sputtering cathode
cathode apparatus
sputtering
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383109357T
Other languages
English (en)
Inventor
Lawrence L Hope
Ernest A Davey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
GTE Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GTE Products Corp filed Critical GTE Products Corp
Application granted granted Critical
Publication of DE3378710D1 publication Critical patent/DE3378710D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE8383109357T 1982-09-30 1983-09-20 A sputtering cathode apparatus Expired DE3378710D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/431,958 US4437966A (en) 1982-09-30 1982-09-30 Sputtering cathode apparatus

Publications (1)

Publication Number Publication Date
DE3378710D1 true DE3378710D1 (en) 1989-01-19

Family

ID=23714167

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383109357T Expired DE3378710D1 (en) 1982-09-30 1983-09-20 A sputtering cathode apparatus

Country Status (5)

Country Link
US (1) US4437966A (de)
EP (1) EP0105407B1 (de)
JP (1) JPS59116379A (de)
CA (1) CA1206914A (de)
DE (1) DE3378710D1 (de)

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US4715940A (en) * 1985-10-23 1987-12-29 Gte Products Corporation Mask for patterning electrode structures in thin film EL devices
US4615781A (en) * 1985-10-23 1986-10-07 Gte Products Corporation Mask assembly having mask stress relieving feature
DE3613018A1 (de) * 1986-04-17 1987-10-22 Santos Pereira Ribeiro Car Dos Magnetron-zerstaeubungskathode
JPS63317671A (ja) * 1987-06-19 1988-12-26 Shinku Kikai Kogyo Kk スパッタリング方法および装置
DE3721373A1 (de) * 1987-06-29 1989-01-12 Leybold Ag Beschichtungsvorrichtung
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US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
JPH07116588B2 (ja) * 1990-08-08 1995-12-13 信越化学工業株式会社 Ｘ線リソグラフィ用マスクの透過体の製造方法
DE4039101C2 (de) * 1990-12-07 1998-05-28 Leybold Ag Ortsfeste Magnetron-Zerstäubungskathode für Vakuumbeschichtungsanlagen
US5458759A (en) * 1991-08-02 1995-10-17 Anelva Corporation Magnetron sputtering cathode apparatus
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US7378356B2 (en) * 2002-03-16 2008-05-27 Springworks, Llc Biased pulse DC reactive sputtering of oxide films
US20030175142A1 (en) * 2002-03-16 2003-09-18 Vassiliki Milonopoulou Rare-earth pre-alloyed PVD targets for dielectric planar applications
US6884327B2 (en) 2002-03-16 2005-04-26 Tao Pan Mode size converter for a planar waveguide
FR2842348B1 (fr) * 2002-07-10 2004-09-10 Tecmachine Cathode pour pulverisation sous vide
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US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US7993773B2 (en) 2002-08-09 2011-08-09 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US7826702B2 (en) * 2002-08-27 2010-11-02 Springworks, Llc Optically coupling into highly uniform waveguides
WO2004077519A2 (en) 2003-02-27 2004-09-10 Mukundan Narasimhan Dielectric barrier layer films
US8728285B2 (en) * 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US7238628B2 (en) * 2003-05-23 2007-07-03 Symmorphix, Inc. Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides
US8500975B2 (en) * 2004-01-07 2013-08-06 Applied Materials, Inc. Method and apparatus for sputtering onto large flat panels
US20060049040A1 (en) * 2004-01-07 2006-03-09 Applied Materials, Inc. Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels
US7513982B2 (en) * 2004-01-07 2009-04-07 Applied Materials, Inc. Two dimensional magnetron scanning for flat panel sputtering
KR101021536B1 (ko) * 2004-12-08 2011-03-16 섬모픽스, 인코포레이티드 ＬｉＣｏＯ２의 증착
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
EP1710829A1 (de) * 2005-04-05 2006-10-11 Applied Films GmbH & Co. KG Magnetanordnung für ein Planar-Magnetron
JP4923450B2 (ja) * 2005-07-01 2012-04-25 富士ゼロックス株式会社 バッチ処理支援装置および方法、プログラム
US20070012663A1 (en) * 2005-07-13 2007-01-18 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070084720A1 (en) * 2005-07-13 2007-04-19 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070012559A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Method of improving magnetron sputtering of large-area substrates using a removable anode
US20070012558A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Magnetron sputtering system for large-area substrates
JP2009503255A (ja) * 2005-07-25 2009-01-29 アプライド マテリアルズ インコーポレイテッド ラージフラットパネルにスパッタリングする方法及び装置
US7838133B2 (en) * 2005-09-02 2010-11-23 Springworks, Llc Deposition of perovskite and other compound ceramic films for dielectric applications
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
US20070056843A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
US7588668B2 (en) 2005-09-13 2009-09-15 Applied Materials, Inc. Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
US20070056850A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070080056A1 (en) * 2005-10-07 2007-04-12 German John R Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths
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US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
TWI441937B (zh) 2007-12-21 2014-06-21 Infinite Power Solutions Inc 形成用於電解質薄膜之濺鍍靶材的方法
KR101606183B1 (ko) 2008-01-11 2016-03-25 사푸라스트 리써치 엘엘씨 박막 배터리 및 기타 소자를 위한 박막 캡슐화
EP2266183B1 (de) 2008-04-02 2018-12-12 Sapurast Research LLC Passive über-/unterspannungssteuerung und schutz für energiespeichereinrichtungen in bezug auf die energiegewinnung
EP2319101B1 (de) * 2008-08-11 2015-11-04 Sapurast Research LLC Stromvorrichtung mit integrierter sammelfläche zur gewinnung elektomagnetischer energie sowie verfahren dafür
KR101613671B1 (ko) 2008-09-12 2016-04-19 사푸라스트 리써치 엘엘씨 전자기 에너지에 의해 데이터 통신을 하는 통합 도전성 표면을 가진 에너지 장치 및 그 통신 방법
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
EP2474056B1 (de) 2009-09-01 2016-05-04 Sapurast Research LLC Bestückte leiterplatte mit integrierter dünnschichtbatterie
WO2011156392A1 (en) 2010-06-07 2011-12-15 Infinite Power Solutions, Inc. Rechargeable, high-density electrochemical device
CN104404460B (zh) * 2014-11-12 2017-03-15 永州市新辉开科技有限公司 一种ito靶材的阴极座优化方法

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DE2707144A1 (de) * 1976-02-19 1977-08-25 Sloan Technology Corp Kathodenzerstaeubungsvorrichtung
US4194962A (en) * 1978-12-20 1980-03-25 Advanced Coating Technology, Inc. Cathode for sputtering
DE3070700D1 (en) * 1980-08-08 1985-07-04 Battelle Development Corp Cylindrical magnetron sputtering cathode
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus

Also Published As

Publication number Publication date
EP0105407A3 (en) 1984-10-03
JPH042667B2 (de) 1992-01-20
EP0105407B1 (de) 1988-12-14
EP0105407A2 (de) 1984-04-18
CA1206914A (en) 1986-07-02
JPS59116379A (ja) 1984-07-05
US4437966A (en) 1984-03-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee