DE3375839D1 - Method of forming a resist mask resistant to plasma etching - Google Patents
Method of forming a resist mask resistant to plasma etchingInfo
- Publication number
- DE3375839D1 DE3375839D1 DE8383200698T DE3375839T DE3375839D1 DE 3375839 D1 DE3375839 D1 DE 3375839D1 DE 8383200698 T DE8383200698 T DE 8383200698T DE 3375839 T DE3375839 T DE 3375839T DE 3375839 D1 DE3375839 D1 DE 3375839D1
- Authority
- DE
- Germany
- Prior art keywords
- forming
- plasma etching
- resist mask
- mask resistant
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08215432A GB2121198A (en) | 1982-05-26 | 1982-05-26 | Plasma-etch resistant mask formation |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3375839D1 true DE3375839D1 (en) | 1988-04-07 |
Family
ID=10530658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383200698T Expired DE3375839D1 (en) | 1982-05-26 | 1983-05-17 | Method of forming a resist mask resistant to plasma etching |
Country Status (5)
Country | Link |
---|---|
US (1) | US4504574A (de) |
EP (1) | EP0095212B1 (de) |
JP (1) | JPS59154A (de) |
DE (1) | DE3375839D1 (de) |
GB (1) | GB2121198A (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2121197A (en) * | 1982-05-26 | 1983-12-14 | Philips Electronic Associated | Plasma-etch resistant mask formation |
US4601778A (en) * | 1985-02-25 | 1986-07-22 | Motorola, Inc. | Maskless etching of polysilicon |
DE3682395D1 (de) * | 1986-03-27 | 1991-12-12 | Ibm | Verfahren zur herstellung von seitenstrukturen. |
JP2550982B2 (ja) * | 1987-04-06 | 1996-11-06 | 富士通株式会社 | レジストマスクの形成方法 |
US5545290A (en) * | 1987-07-09 | 1996-08-13 | Texas Instruments Incorporated | Etching method |
US4873176A (en) * | 1987-08-28 | 1989-10-10 | Shipley Company Inc. | Reticulation resistant photoresist coating |
US5912187A (en) * | 1993-12-30 | 1999-06-15 | Lucent Technologies Inc. | Method of fabricating circuits |
AU7124100A (en) | 1999-09-10 | 2001-04-10 | Unaxis Usa Inc. | Magnetic pole fabrication process and device |
US6547975B1 (en) | 1999-10-29 | 2003-04-15 | Unaxis Usa Inc. | Magnetic pole fabrication process and device |
US20030003374A1 (en) * | 2001-06-15 | 2003-01-02 | Applied Materials, Inc. | Etch process for photolithographic reticle manufacturing with improved etch bias |
US7183201B2 (en) | 2001-07-23 | 2007-02-27 | Applied Materials, Inc. | Selective etching of organosilicate films over silicon oxide stop etch layers |
WO2003021659A1 (en) | 2001-09-04 | 2003-03-13 | Applied Materials, Inc. | Methods and apparatus for etching metal layers on substrates |
WO2003089990A2 (en) * | 2002-04-19 | 2003-10-30 | Applied Materials, Inc. | Process for etching photomasks |
WO2004086143A2 (en) * | 2003-03-21 | 2004-10-07 | Applied Materials, Inc. | Multi-step process for etching photomasks |
US20040192058A1 (en) * | 2003-03-28 | 2004-09-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pre-etching plasma treatment to form dual damascene with improved profile |
US7077973B2 (en) * | 2003-04-18 | 2006-07-18 | Applied Materials, Inc. | Methods for substrate orientation |
KR100630677B1 (ko) * | 2003-07-02 | 2006-10-02 | 삼성전자주식회사 | 포토레지스트 패턴에의 불소를 포함하지 않는 탄소 함유폴리머 생성을 위한 플라즈마 전처리를 포함하는 식각 방법 |
US7521000B2 (en) * | 2003-08-28 | 2009-04-21 | Applied Materials, Inc. | Process for etching photomasks |
US8293430B2 (en) * | 2005-01-27 | 2012-10-23 | Applied Materials, Inc. | Method for etching a molybdenum layer suitable for photomask fabrication |
US7829243B2 (en) * | 2005-01-27 | 2010-11-09 | Applied Materials, Inc. | Method for plasma etching a chromium layer suitable for photomask fabrication |
CN101046626B (zh) * | 2006-03-30 | 2012-03-14 | 应用材料公司 | 适于制造光掩模的蚀刻钼层方法 |
KR100944846B1 (ko) * | 2006-10-30 | 2010-03-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 마스크 에칭 프로세스 |
US8507191B2 (en) | 2011-01-07 | 2013-08-13 | Micron Technology, Inc. | Methods of forming a patterned, silicon-enriched developable antireflective material and semiconductor device structures including the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4253888A (en) * | 1978-06-16 | 1981-03-03 | Matsushita Electric Industrial Co., Ltd. | Pretreatment of photoresist masking layers resulting in higher temperature device processing |
US4187331A (en) * | 1978-08-24 | 1980-02-05 | International Business Machines Corp. | Fluorine plasma resist image hardening |
NL8004007A (nl) * | 1980-07-11 | 1982-02-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleider- inrichting. |
US4382985A (en) * | 1980-10-11 | 1983-05-10 | Daikin Kogyo Co., Ltd. | Process for forming film of fluoroalkyl acrylate polymer on substrate and process for preparing patterned resist from the film |
US4370405A (en) * | 1981-03-30 | 1983-01-25 | Hewlett-Packard Company | Multilayer photoresist process utilizing an absorbant dye |
US4373018A (en) * | 1981-06-05 | 1983-02-08 | Bell Telephone Laboratories, Incorporated | Multiple exposure microlithography patterning method |
-
1982
- 1982-05-26 GB GB08215432A patent/GB2121198A/en not_active Withdrawn
-
1983
- 1983-05-17 DE DE8383200698T patent/DE3375839D1/de not_active Expired
- 1983-05-17 EP EP83200698A patent/EP0095212B1/de not_active Expired
- 1983-05-20 US US06/496,702 patent/US4504574A/en not_active Expired - Fee Related
- 1983-05-23 JP JP58089308A patent/JPS59154A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59154A (ja) | 1984-01-05 |
JPH0261736B2 (de) | 1990-12-20 |
EP0095212A2 (de) | 1983-11-30 |
US4504574A (en) | 1985-03-12 |
GB2121198A (en) | 1983-12-14 |
EP0095212A3 (en) | 1985-01-16 |
EP0095212B1 (de) | 1988-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |