DE3375248D1 - Conductive synthetic resin molding material - Google Patents

Conductive synthetic resin molding material

Info

Publication number
DE3375248D1
DE3375248D1 DE8383109901T DE3375248T DE3375248D1 DE 3375248 D1 DE3375248 D1 DE 3375248D1 DE 8383109901 T DE8383109901 T DE 8383109901T DE 3375248 T DE3375248 T DE 3375248T DE 3375248 D1 DE3375248 D1 DE 3375248D1
Authority
DE
Germany
Prior art keywords
synthetic resin
molding material
resin molding
conductive synthetic
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383109901T
Other languages
English (en)
Inventor
Toshio Mayama
Hidehiro Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26461349&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3375248(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP12473583A external-priority patent/JPS6018315A/ja
Priority claimed from JP58124734A external-priority patent/JPS6018314A/ja
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Application granted granted Critical
Publication of DE3375248D1 publication Critical patent/DE3375248D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/12—Making granules characterised by structure or composition
    • B29B9/14—Making granules characterised by structure or composition fibre-reinforced
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Textile Engineering (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
DE8383109901T 1983-07-11 1983-10-04 Conductive synthetic resin molding material Expired DE3375248D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12473583A JPS6018315A (ja) 1983-07-11 1983-07-11 導電性成形材料
JP58124734A JPS6018314A (ja) 1983-07-11 1983-07-11 導電性成形材料

Publications (1)

Publication Number Publication Date
DE3375248D1 true DE3375248D1 (en) 1988-02-11

Family

ID=26461349

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383109901T Expired DE3375248D1 (en) 1983-07-11 1983-10-04 Conductive synthetic resin molding material

Country Status (3)

Country Link
US (1) US4530779A (de)
EP (1) EP0131067B2 (de)
DE (1) DE3375248D1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL193609C (nl) * 1981-12-30 2000-04-04 Bekaert Sa Nv Samengestelde streng voor verwerking als granulaat in kunststofproducten en werkwijze voor het vervaardigen van een kunststofmenggranulaat.
JPS61111335A (ja) * 1984-11-05 1986-05-29 Dainippon Toryo Co Ltd プラスチツク成形方法
JPS6245659A (ja) * 1985-08-23 1987-02-27 Eng Plast Kk 導電性成形材料
EP0221434B1 (de) * 1985-11-04 1990-03-14 General Electric Company Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen
US4816184A (en) * 1987-02-20 1989-03-28 General Electric Company Electrically conductive material for molding
EP0306671A1 (de) * 1987-07-20 1989-03-15 Hitachi, Ltd. Elektrisch leitfähige Kunstharz-Zusammensetzung zum Formen und damit geformte Abschirmung
DE3804381C2 (de) * 1988-02-12 1993-10-28 Sachsenwerk Ag Ohmscher Spannungsteiler für eine Hochspannungsanlage
DE3810597A1 (de) * 1988-03-29 1989-10-12 Bayer Ag Metallisierte fasern enthaltende verbundstoffe sowie deren verwendung zur herstellung von elektromagnetisch abschirmenden formteilen
DE3810598A1 (de) * 1988-03-29 1989-10-12 Bayer Ag Metallfasern enthaltende verbundstoffe sowie deren verwendung zur herstellung von formteilen zur abschirmung von elektromagnetischer strahlung
FR2652943B1 (fr) * 1989-10-05 1994-07-01 Electricite De France Materiau conducteur pour electrode, composant electrique et leur procede de fabrication.
NL9201447A (nl) * 1992-08-12 1994-03-01 Hul A J Van Den Bv Eén- of meeraderige elektrisch geleidende kabel, meer in het bijzonder voor signaaloverdracht.
US7078098B1 (en) 2000-06-30 2006-07-18 Parker-Hannifin Corporation Composites comprising fibers dispersed in a polymer matrix having improved shielding with lower amounts of conducive fiber
US20020108699A1 (en) * 1996-08-12 2002-08-15 Cofer Cameron G. Method for forming electrically conductive impregnated fibers and fiber pellets
US5966593A (en) * 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Method of forming a wafer level contact sheet having a permanent z-axis material
US5830565A (en) * 1996-11-08 1998-11-03 W. L. Gore & Associates, Inc. High planarity and low thermal coefficient of expansion base for semi-conductor reliability screening
US5909123A (en) * 1996-11-08 1999-06-01 W. L. Gore & Associates, Inc. Method for performing reliability screening and burn-in of semi-conductor wafers
US5766979A (en) * 1996-11-08 1998-06-16 W. L. Gore & Associates, Inc. Wafer level contact sheet and method of assembly
US5966022A (en) * 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Wafer level burn-in system
US5896038A (en) * 1996-11-08 1999-04-20 W. L. Gore & Associates, Inc. Method of wafer level burn-in
US5886535A (en) * 1996-11-08 1999-03-23 W. L. Gore & Associates, Inc. Wafer level burn-in base unit substrate and assembly
JP4485117B2 (ja) * 2002-06-27 2010-06-16 日東電工株式会社 保護剥離用フィルム
KR101211134B1 (ko) * 2012-02-13 2012-12-11 금호석유화학 주식회사 탄소나노소재/고분자 복합소재의 제조방법
US20140272417A1 (en) * 2013-03-15 2014-09-18 Integral Technologies, Inc. Moldable capsule and method of manufacture

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708387A (en) * 1970-09-11 1973-01-02 Univ Drexel Metallic modified plastic compositions and method for the preparation thereof
US3983195A (en) * 1971-07-16 1976-09-28 Hasbro Industries, Inc. Pencil sheath compositions, method for making pencils
US4195114A (en) * 1976-12-28 1980-03-25 International Business Machines Corporation Conductive plastic and method of preparation
US4332853A (en) * 1977-05-09 1982-06-01 International Business Machines Corporation Conductive plastic with metalized glass fibers retained in partial clumps
SE7803576L (sv) * 1978-03-30 1979-10-01 Jensen Mogens P Verktyg for att dra loss hart fastsittande objekt
US4388422A (en) * 1979-04-16 1983-06-14 Dart Industries Inc. Fiber-reinforced composite materials
US4367745A (en) * 1980-05-27 1983-01-11 Minnesota Mining And Manufacturing Company Conformable electrically conductive compositions
US4438059A (en) * 1982-09-22 1984-03-20 Molded Fiber Glass Companies Electrically conductive fiber glass articles and sheets

Also Published As

Publication number Publication date
EP0131067B1 (de) 1988-01-07
EP0131067A1 (de) 1985-01-16
US4530779A (en) 1985-07-23
EP0131067B2 (de) 1995-08-16

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8339 Ceased/non-payment of the annual fee