DE3328547C1 - Arrangement for soldering electrical components to printed-circuit boards - Google Patents

Arrangement for soldering electrical components to printed-circuit boards

Info

Publication number
DE3328547C1
DE3328547C1 DE3328547A DE3328547A DE3328547C1 DE 3328547 C1 DE3328547 C1 DE 3328547C1 DE 3328547 A DE3328547 A DE 3328547A DE 3328547 A DE3328547 A DE 3328547A DE 3328547 C1 DE3328547 C1 DE 3328547C1
Authority
DE
Germany
Prior art keywords
circuit board
solder
components
connections
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3328547A
Other languages
German (de)
Inventor
Holger Dipl.-Ing. 2300 Klausdorf Scheler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hagenuk 24118 Kiel De GmbH
Original Assignee
Hagenuk 2300 Kiel De GmbH
Hagenuk 2300 Kiel GmbH
Hagenuk Telecom GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hagenuk 2300 Kiel De GmbH, Hagenuk 2300 Kiel GmbH, Hagenuk Telecom GmbH filed Critical Hagenuk 2300 Kiel De GmbH
Priority to DE3328547A priority Critical patent/DE3328547C1/en
Application granted granted Critical
Publication of DE3328547C1 publication Critical patent/DE3328547C1/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/094Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10583Cylindrically shaped component; Fixing means therefore
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/046Means for drawing solder, e.g. for removing excess solder from pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3415Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The arrangement relates to printed-circuit boards which are passed through automatically operating wave-soldering or drag-soldering machines for printed-circuit boards and which retain the connections of electrical components directly on associated connection points on the printed-circuit board. In this case, it is provided that the printed-circuit board connection point emerging from the solder bath last in the transportation direction has at least twice, or a multiple, of the width of a normal component connection, in order to collect the adhering quantity of solder by means of the enlarged connection point. <IMAGE>

Description

Die Breite (b) eines Anschlußpunktes 4 auf der Leiterplatte wird dabei für den zuletzt aus dem Lötbad 8 austretenden Anschlußpunkt 4' in Transportrichtung 8 um mindestens das Doppelte oder das Vielfache vergrößert, so daß eine Breite B entsteht. Hierdurch lassen sich Lötbrücken vermeiden, da das brückenbildende Lötzinn auf den vergrößerten Anschlußpunkt 4' fließt. The width (b) of a connection point 4 on the circuit board becomes for the connection point 4 'that emerges last from the solder bath 8 in the direction of transport 8 enlarged by at least twice or a multiple, so that a width B arises. In this way, solder bridges can be avoided, since the solder that forms the bridges flows to the enlarged connection point 4 '.

Claims (1)

Patentanspruch: Anordnung zum Verlöten elektrischer Bauelemente auf Leiterplatten mit automatisch arbeitenden Wellen- und Schlepplötmaschinen, wobei in einem Arbeitsgang sämtliche Lötverbindungen auf einer Leiterplattenseite hergestellt werden und sowohl bedrahtete Bauelemente als auch Bauelemente mit Anschlüssen, die direkt auf zugeordnete Anschlußpunkte der Leiterplatte auf der Lötseite gesetzt sind, verbunden werden, d a d u r c h g e -k e n nz ei c h n e t, daß der in Transportrichtung (9) zuletzt aus dem Lötbad (8) austretende Anschlußpunkt (4') mindestens das Doppelte oder Vielfache der Breite (b) der vorhergehenden Anschlußpunkte (4) aufweist Die Erfindung bezieht sich auf eine Anordnung zum Verlöten elektrischer Bauelemente auf Leiterplatten mit automatisch arbeitenden Wellen- und Schlepplötmaschinen, wobei in einem Arbeitsgang sämtliche Lötverbindungen auf einer Leiterplattenseite hergestellt werden und sowohl bedrahtete Bauelemente als auch Bauelemente mit Anschlüssen, die direkt auf zugeordnete Anschlußpunkte der Leiterplatte auf der Lötseite gesetzt sind, verbunden werden. Claim: arrangement for soldering electrical components Printed circuit boards with automatically operating wave and drag soldering machines, whereby All soldered connections are made on one side of the circuit board in one operation and both wired components and components with connections that placed directly on assigned connection points of the circuit board on the solder side are to be connected, d u r c h e -k e n nz ei c h n e t that the in transport direction (9) the last connection point (4 ') emerging from the solder bath (8) is at least twice as large or multiples of the width (b) of the preceding connection points (4) The invention relates to an arrangement for soldering electrical components on printed circuit boards with automatically operating wave and drag soldering machines, whereby All soldered connections are made on one side of the circuit board in one operation and both wired components and components with connections that placed directly on assigned connection points of the circuit board on the solder side are to be connected. Es ist bekannt, die Herstellung der erforderlichen Weichlötverbindungen auf automatisch arbeitenden Wellen- und Schlepplötmaschinen vorzunehmen und in einem Arbeitsgang sämtliche Lötverbindungen auf einer Plattenseite herzustellen. Deshalb werden bedrahtete Bauteile auf der der Lötseite abgewandten Seite der Leiterplatte angeordnet. Bei mehrpoligen Miniaturbauelementen ist es durch den geringen Mittenabstand der elektrischen Anschlüsse nicht möglich, eine Ausbildung zur Aufnahme in Bohrungen der Leiterplatte zu bilden, da eine Herstellung der Durchkontaktierung und ein Lötfluß innerhalb der Bohrung nicht gewährleistet werden. It is known to produce the required soft solder connections to be carried out on automatically operating wave and drag soldering machines and in one Operation to produce all soldered connections on one side of the plate. That's why are wired components on the side of the circuit board facing away from the soldering side arranged. In the case of multipole miniature components, it is due to the small center-to-center spacing the electrical connections not possible, a training for inclusion in bores to form the circuit board, as a production of the via and a solder flux cannot be guaranteed within the bore. Diese mehrpoligen Miniaturbauelemente werden daher mit ihren Anschlüssen direkt auf die Anschlußpunkte der Leiterplatte gesetzt. Hierbei werden die Bauelemente mit wärmebeständigem Kleber in der entsprechenden Position fixiert und während des Lötvorganges kurzzeitig vom Lot umspült. Somit ist es möglich, den Lötvorgang mit bedrahteten Bauelementen auf der Oberseite und mit unbedrahteten Bauelementen auf der Unterseite der Leiterplatte herzustellen. These multipole miniature components are therefore with their connections placed directly on the connection points of the circuit board. Here are the components fixed in the appropriate position with heat-resistant adhesive and during the The soldering process was briefly bathed in the soldering process. Thus it is possible to use the soldering process wired components on the top and unwired components the underside of the circuit board. Es hat sich aber in der Praxis gezeigt, daß die Wirtschaftlichkeit des Verfahrens eingeschränkt wird durch manuelles Nacharbeiten zur Beseitigung von sich bildenden Lötbrücken zwischen den elektrischen Anschlüssen der Miniaturbauteile auf der Leiterplattenun terseite (Lötseite). Diese Lötbrücken entstehen ausschließlich zwischen den zuletzt aus dem Lötbad austretenden Anschlüssen. However, it has been shown in practice that the economy of the procedure is limited by manual reworking to eliminate solder bridges that form between the electrical connections of the miniature components on the underside of the circuit board (solder side). These solder bridges are created exclusively between the last connections to emerge from the solder bath. Die Aufgabe der Erfindung ist es, bei einer Anordnung der gattungsgemäßen Art eine einfache Ausbildung für Leiterplatten zu schaffen, die die Bildung von Lötbrücken bei direkt auf die Anschlußpunkte aufgesetzte Bauteile mit relativ geringen Anschlußabständen in paralleler Anordnung vermeidet und einwandfreie Lötstellen gewährleistet. The object of the invention is, in an arrangement of the generic Kind of a simple training for circuit boards to create the formation of Solder bridges in the case of components placed directly on the connection points with relatively small Connection spacing in a parallel arrangement avoids and flawless soldering points guaranteed. Die Lösung dieser Aufgabe erfolgt erfindungsgemäß dadurch, daß der in Transportrichtung zuletzt aus dem Lötbad austretende Anschlußpunkt mindestens das Doppelte oder das Vielfache der Breite der vorhergehenden Anschlußpunkte aufweist. This object is achieved according to the invention in that the At least the last connection point to emerge from the solder bath in the direction of transport is twice or a multiple of the width of the preceding connection points. Hierdurch wird ermöglicht, daß das brückenbildende Lötzinn auf den vergrößerten Anschlußpunkt fließt bzw. sich dort die aus der Welle abreißende Lötmenge sammelt. This makes it possible that the bridging solder on the enlarged connection point flows or there is the amount of solder tearing off the shaft collects. In der Zeichnung ist ein Ausführungsbeispiel einer erfindungsgemäßen Anordnung schematisch dargestellt. Es zeigt F i g. 1 eine Seitenansicht einer beidseitig bestückten Leiterplatte über einer Lötwelle, F i g. 2 und F i g. 3 perspektivische Darstellungen auf Anschlüsse einer Leiterplatte direkt aufgesetzte Bauteile. In the drawing is an embodiment of an inventive Arrangement shown schematically. It shows F i g. 1 a side view of a double-sided assembled circuit board over a solder wave, F i g. 2 and F i g. 3 perspective Representations of components directly attached to the connections of a circuit board. Die dargestellte Leiterplatte 1 ist mit bedrahteten Bauelementen 2 auf der Oberseite 3 und direkt auf Anschlußpunkte 4 der Unterseite (Lötseite) 5 mit ihren Anschlüssen 6 aufgesetzten Bauteilelementen 7 versehen. Die Leiterplatte 1 wird zur Durchführung des Lötvorganges über eine automatisch arbeitende Wellen-und Schlepplötmaschine 8 geführt. Die Transportrichtung der Leiterplatte list je durch einen Pfeil 9 gekennzeichnet. The circuit board 1 shown is with wired components 2 on the top 3 and directly on connection points 4 on the bottom (solder side) 5 provided with their connections 6 attached component elements 7. The circuit board 1 is used to carry out the soldering process via an automatically operating wave and Drag soldering machine 8 out. The direction of transport of the circuit board is always through marked by an arrow 9.
DE3328547A 1983-08-08 1983-08-08 Arrangement for soldering electrical components to printed-circuit boards Expired DE3328547C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3328547A DE3328547C1 (en) 1983-08-08 1983-08-08 Arrangement for soldering electrical components to printed-circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3328547A DE3328547C1 (en) 1983-08-08 1983-08-08 Arrangement for soldering electrical components to printed-circuit boards

Publications (1)

Publication Number Publication Date
DE3328547C1 true DE3328547C1 (en) 1984-10-04

Family

ID=6206028

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3328547A Expired DE3328547C1 (en) 1983-08-08 1983-08-08 Arrangement for soldering electrical components to printed-circuit boards

Country Status (1)

Country Link
DE (1) DE3328547C1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0306930A2 (en) * 1987-09-10 1989-03-15 Siemens Aktiengesellschaft Conductor tracks with connection points for an electronic component comprising a plurality of terminals, arranged on a circit board
EP0478879A3 (en) * 1990-10-01 1992-07-01 Hewlett-Packard Company Secondary board for mounting of components having differing bonding requirements
EP0611064A1 (en) * 1993-02-10 1994-08-17 Ford Motor Company Solder pad configuration for wave soldering

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0306930A2 (en) * 1987-09-10 1989-03-15 Siemens Aktiengesellschaft Conductor tracks with connection points for an electronic component comprising a plurality of terminals, arranged on a circit board
EP0306930A3 (en) * 1987-09-10 1990-05-02 Siemens Aktiengesellschaft Conductor tracks with connection points for an electronic component comprising a plurality of terminals, arranged on a circit board
EP0478879A3 (en) * 1990-10-01 1992-07-01 Hewlett-Packard Company Secondary board for mounting of components having differing bonding requirements
EP0611064A1 (en) * 1993-02-10 1994-08-17 Ford Motor Company Solder pad configuration for wave soldering

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Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8327 Change in the person/name/address of the patent owner

Owner name: HAGENUK TELECOM GMBH, 24118 KIEL, DE

8327 Change in the person/name/address of the patent owner

Owner name: HAGENUK GMBH, 24118 KIEL, DE

8339 Ceased/non-payment of the annual fee