DE3813566A1 - Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production - Google Patents

Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production

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Publication number
DE3813566A1
DE3813566A1 DE19883813566 DE3813566A DE3813566A1 DE 3813566 A1 DE3813566 A1 DE 3813566A1 DE 19883813566 DE19883813566 DE 19883813566 DE 3813566 A DE3813566 A DE 3813566A DE 3813566 A1 DE3813566 A1 DE 3813566A1
Authority
DE
Germany
Prior art keywords
circuit board
electrical connection
hybrid assembly
printed circuit
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19883813566
Other languages
German (de)
Inventor
Willi Ing Grad Gansert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19883813566 priority Critical patent/DE3813566A1/en
Priority to FR8904667A priority patent/FR2630615A1/en
Publication of DE3813566A1 publication Critical patent/DE3813566A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

An electrical connection between a hybrid assembly and an electrical printed circuit board is proposed, which connection is distinguished by the fact that the printed circuit board (4) has flexible regions which are used as connecting tabs (9) and are in touching contact with contact surfaces (11) of the hybrid assembly (1). The electrical connection is produced by soldering using a soldering iron, holes which are provided in the ends of the connecting tabs (9) simplifying visual inspection of the connections. Precise alignment of the printed circuit board (4) with respect to the hybrid assembly (1) is simplified by means of an adjusting device having located pins (8) and locating holes (12). <IMAGE>

Description

Stand der TechnikState of the art

Die Erfindung betrifft eine elektrische Verbindung zwischen einer Hybridbaugruppe und einer Leiterplatte nach der Gattung des Hauptanspruchs sowie ein Ver­ fahren zu deren Herstellung gemäß Oberbegriff des An­ spruchs 9.The invention relates to an electrical connection between a hybrid assembly and a circuit board according to the genus of the main claim and a ver drive to their manufacture according to the preamble of the An Proverbs 9

Bekannte elektrische Verbindungen zwischen Hybridbau­ gruppen und Leiterplatten bestehen beispielsweise aus starren Kämmen, die mit den beiden genannten Teilen fest verlötet sind.Known electrical connections between hybrid construction Groups and circuit boards consist of, for example rigid combs with the two parts mentioned are firmly soldered.

Andere bekannte elektrische Verbindungen weisen Bond­ verbindungen zwischen den Hybridbaugruppen und den Leiterplatten auf. Other known electrical connections have Bond connections between the hybrid modules and the PCBs on.  

Diese Verbindungen haben den Nachteil, daß sie auf­ wendig in der Herstellung und nicht universell ver­ wendbar sind. Beispielsweise müssen bei den Bondver­ bindungen jeweils starre Verbindungen zwischen Lei­ terplatte und Hybridbaugruppe geschaffen werden, wo­ durch die Anschlußmöglichkeiten der Hybridbaugruppe eingeschränkt werden: In den Bereichen der starren Verbindungen können keine elektrischen Verbindungen vorgesehen werden.These connections have the disadvantage that they are based on manoeuvrable to manufacture and not universally ver are reversible. For example, in the bondver bonds rigid connections between Lei terplatte and hybrid assembly are created where through the connection options of the hybrid module be restricted: in the areas of rigid Connections cannot be electrical connections be provided.

Vorteile der ErfindungAdvantages of the invention

Die erfindungsgemäße elektrische Verbindung zwischen Hybridbaugruppe der Leiterplatte mit den im Haupt­ anspruch genannten Merkmalen hat dem gegenüber den Vorteil, daß sie automatisch und in großserien-taug­ lichen Fertigungsverfahren herstellbar ist. Besonders vorteilhaft ist die einfache Vorbereitung der Verbin­ dung, die lediglich darin besteht, daß flexible, als Anschlußfahnen dienende Bereiche der Leiterplatte vorgesehen werden.The electrical connection between Hybrid assembly of the circuit board with those in the main claim mentioned features compared to the The advantage of being automatic and suitable for large series Liche manufacturing process is producible. Especially The simple preparation of the connection is advantageous dung, which consists only in that flexible, as Areas of the printed circuit board that serve as terminal lugs be provided.

Bei einem besonders bevorzugten Ausführungsbeispiel ist eine Justiereinrichtung vorgesehen, durch die die mit den Kontaktflächen der Hybridbaugruppe zu ver­ bindenden Anschlußfahnen der Leiterplatte sehr genau aufeinander ausgerichtet und in dieser Lage gehalten werden.In a particularly preferred embodiment an adjustment device is provided through which the ver with the contact surfaces of the hybrid assembly binding terminal lugs of the circuit board very precisely aligned and held in this position will.

Ein weiteres bevorzugtes Ausführungsbeispiel zeichnet sich durch einen Halterahmen aus, der sowohl der Zug­ entlastung der elektrischen Verbindung und/oder dem Schutz der Hybridbaugruppe und der Verbindungen dient. Another preferred embodiment draws is characterized by a holding frame, which is both the train relief of the electrical connection and / or the Protection of the hybrid assembly and the connections serves.  

Weitere Vorteile und Ausgestaltungen der elektrischen Verbindung ergeben sich aus den Unteransprüchen.Further advantages and configurations of the electrical Connection result from the subclaims.

Das erfindungsgemäße Verfahren zur Herstellung der elektrischen Verbindung zwischen Hybridbaugruppen und Leiterplatten mit den im Anspruch 9 genannten Merk­ malen hat den Vorteil, daß die elektrischen Verbin­ dungen einfach und mit hoher Fertigungssicherheit automatisch herstellbar sind. Dies wird durch die optimale Ausrichtung der Anschlußfahnen der Leiter­ platte gegenüber den Kontaktflächen der Hybridbau­ gruppe erreicht und durch das einfach ausführbare Lötverfahren. Besonderer Vorteil des Verfahrens ist es, daß die Fertigungsprüfung durch Sichtkontrolle durchführbar ist.The inventive method for producing the electrical connection between hybrid modules and Printed circuit boards with the Merk mentioned in claim 9 paint has the advantage that the electrical connec simple and with high manufacturing reliability are automatically producible. This is through the optimal alignment of the connection lugs of the conductors plate opposite the contact surfaces of the hybrid construction group reached and through the easily executable Soldering process. A particular advantage of the process is it that the manufacturing inspection by visual inspection is feasible.

Durch die in den Anschlußfahnen bei einer besonderen Ausführungsform des Verfahrens vorgesehenen Ausneh­ mungen bzw. Löcher ist die Kontrolle des Lötflusses besonders leicht möglich.Through the in the connecting lugs at a special one Embodiment of the method provided Ausneh the control of the soldering flow particularly easy.

Zeichnungdrawing

Die Erfindung wird im folgenden anhand der Zeichnung näher erläutert. Es zeigen:The invention is described below with reference to the drawing explained in more detail. Show it:

Fig. 1 eine Seitenansicht einer elektrischen Ver­ bindung zwischen einer Hybridbaugruppe und einer Leiterplatte; Figure 1 is a side view of an electrical connection between a hybrid assembly and a circuit board.

Fig. 2 eine Draufsicht auf die Anordnung gemäß Fig. 1; FIG. 2 shows a top view of the arrangement according to FIG. 1;

Fig. 3 eine Vergrößerung eines Ausschnitts aus Fig. 2, nämlich eine Anschlußfahne mit einer Ausnehmung und Fig. 3 is an enlargement of a section of Fig. 2, namely a terminal lug with a recess and

Fig. 4 eine Seitenansicht einer Anordnung ähnlich Fig. 1 mit einem Halterahmen. Fig. 4 is a side view of an arrangement similar to FIG. 1 with a holding frame.

Beschreibung der AusführungsbeispieleDescription of the embodiments

Fig. 1 zeigt in einer Seitenansicht eine als Dick­ schicht-Hybridbaugruppe ausgelegte Hybridbaugruppe mit einigen lediglich angedeuteten Bauelementen 2. Die Hybridbaugruppe 1 ist auf eine als Kühlkörper 3 dienende Unterlage aufgebracht, beispielsweise ge­ klebt. An diese Hybridbaugruppe ist eine flexible Leiterplatte 4 herangeführt, deren an die Hybridbau­ gruppe angrenzende Bereiche ebenfalls mit dem Kühl­ körper 3 verklebt sind. Fig. 1 shows a side view of a hybrid module designed as a thick-layer hybrid assembly with some components 2 only indicated. The hybrid assembly 1 is applied to a base serving as a heat sink 3 , for example ge glued. At this hybrid assembly, a flexible circuit board 4 is introduced, the areas adjacent to the hybrid assembly are also glued to the cooling body 3 .

Die flexible Leiterplatte 4 besteht hier beispiels­ weise aus einer Trägerfolie 5, einer Kupferfolie 6 sowie einer Deckfolie 7.The flexible printed circuit board 4 consists here, for example, of a carrier film 5 , a copper film 6 and a cover film 7 .

In Fig. 1 sind auch zwei von dem Kühlkörper ausge­ hende, durch die Leiterplatte 4 hindurchragende, als Justiereinrichtung dienende Fangstifte 8 erkennbar.In Fig. 1, two of the heat sink starting from, protruding through the circuit board 4 , serving as an adjustment device catch pins 8 can be seen .

Von der flexiblen Leiterplatte 4 gehen Anschlußfah­ nen 9 aus, die auf der Hybridbaugruppe 1 enden.From the flexible printed circuit board 4 , connecting grooves 9 start , which end on the hybrid assembly 1 .

In Fig. 2 sind gleiche Teile mit gleichen Bezugszei­ chen versehen, so daß auf deren Beschreibung verzich­ tet werden kann. In Fig. 2 ist erkennbar, daß die Leiterplatte 4 einen Auschnitt 10 aufweist, in dem die Hybridbaugruppe 1 angeordnet ist. Es sind mehrere Kontaktflächen 11 der Hybridbaugruppe 1 angedeutet, auf denen die Anschlußfahnen 9 der flexbilen Leiter­ platte 4 zu liegen kommen. Aus der Draufsicht ist er­ kennbar, daß die Fangstifte 8 in zugehörige Fanglö­ cher 12 in der flexiblen Leiterplatte passen. Durch die aus Fangstift und Fangloch bestehende Justierein­ richtung werden die Anschlußfahnen 9 der flexiblen Leiterplatte genau auf die Kontaktflächen 11 der Hy­ bridbaugruppe ausgerichtet.In Fig. 2, the same parts are provided with the same reference numerals, so that their description can be waived. In Fig. 2 it can be seen that the circuit board 4 has a cutout 10 in which the hybrid assembly 1 is arranged. There are several contact surfaces 11 of the hybrid assembly 1 indicated, on which the terminal lugs 9 of the flexible printed circuit board 4 come to rest. From the top view, it can be seen that the catch pins 8 fit into associated catch holes 12 in the flexible printed circuit board. Due to the Justierein device consisting of a catch pin and catch hole, the connecting lugs 9 of the flexible printed circuit board are aligned precisely with the contact surfaces 11 of the hybrid assembly.

In Fig. 3 sind eine Anschlußfahne 9 der flexiblen Leiterplatte 4 sowie eine Kontaktfläche 11 der Hybridbaugruppe 1 vergrößert dargestellt. Erkennbar ist hier auch eine Ausnehmung bzw. ein Loch 13 in der Anschlußfahne 9.In Fig. 3, a terminal lug 9 of the flexible circuit board 4 and a contact surface 11 of the hybrid assembly 1 are shown enlarged. A recess or a hole 13 in the connecting lug 9 can also be seen here .

Nachdem die Hybridbaugruppe 1 auf dem Kühlkörper 3 festgeklebt wurde, wird die flexible Leiterplatte auf dem Kühlkörper aufgebracht und durch die Justiereinrichtung bzw. die Fangstifte 8 und -löcher 12 genau ausgerichtet. Dadurch liegen die An­ schlußfahnen 9 so auf den Kontaktflächen 11 der Hy­ bridbaugruppe 1, daß durch ein Bügel-Lötverfahren eine elektrische Verbindung hergestellt werden kann. Dabei werden in einem Arbeitsgang mehrere An­ schlußfahnen 9 mit den zugehörigen Kontaktflächen gleichzeitig verbunden. Anschließend ist eine Sichtkontrolle der Kontaktstellen ohne weiteres mög­ lich, wobei aufgrund der Löcher 13 in den An­ schlußfahnen 9 der Lötfluß an den Kontaktstellen sehr leicht kontrolliert werden kann.After the hybrid assembly 1 has been glued to the heat sink 3 , the flexible printed circuit board is applied to the heat sink and precisely aligned by the adjusting device or the catch pins 8 and holes 12 . As a result, the circuit flags 9 are so on the contact surfaces 11 of the hybrid assembly 1 that an electrical connection can be made by a bracket soldering process. Here, several flags 9 are connected to the associated contact surfaces simultaneously in one operation. Subsequently, a visual inspection of the contact points is easily possible, whereby the soldering flux at the contact points can be checked very easily due to the holes 13 in the connecting flags 9 .

In der Seitenansicht in Fig. 4, in der wiederum gleiche Teile mit gleichen Bezugszeichen versehen sind, ist ein Halterahmen 14 erkennbar, der auf die Fangstifte 8 aufgesetzt und mit diesen beispielsweise durch Verlöten verbunden ist. Der Halterahmen dient einerseits als Schutz der elektrischen Verbindungen bzw. der Hybridbaugruppe und andererseits als Zugent­ lastung der elektrischen Verbindungen. Die Zugentla­ stung kann durch Verkleben des Halterahmens 14 mit der flexiblen Leiterplatte 4 erreicht werden. Es ist jedoch auch möglich, durch Vorsprünge auf dem Hal­ terahmen und entsprechende Ausnehmungen in der flexi­ blen Leiterplatte einen Formschluß und damit eine Zugentlastung zu erreichen. Durch die gestrichelte Linie ist angedeutet, daß ein zusätzlicher Schutz der Hybridbaugruppe und/oder elektrischen Verbindung durch ein Gel 15 erreicht werden kann, das in den In­ nenraum des Halterahmens eingegossen wird. Das Gel verhindert, daß Umwelteinflüsse die elektrischen Ver­ bindungen oder die Bauelemente 2 der Hybridbaugruppe 1 beeinträchtigen.In the side view in FIG. 4, in which the same parts are again provided with the same reference numerals, a holding frame 14 can be seen which is placed on the catch pins 8 and connected to them, for example by soldering. The holding frame serves on the one hand to protect the electrical connections or the hybrid assembly and on the other hand to relieve the strain on the electrical connections. The Zugentla stung can be achieved by gluing the holding frame 14 to the flexible circuit board 4 . However, it is also possible to achieve a positive fit and thus strain relief by means of projections on the hal frame and corresponding recesses in the flexi ble circuit board. The dashed line indicates that additional protection of the hybrid assembly and / or electrical connection can be achieved by a gel 15 , which is poured into the interior of the holding frame. The gel prevents environmental influences from affecting the electrical connections or the components 2 of the hybrid assembly 1 .

In den Fig. 1 und 4 ist die Hybridbaugruppe auf die Oberfläche des Kühlkörpers 3 aufgeklebt. Es ist jedoch auch möglich, eine Vertiefung in den Kühl­ körper, der beispielsweise auch aus Druckguß herge­ stellt werden kann, einzubringen, und die Hybridbau­ gruppe in diese Vertiefung einzukleben.In Figs. 1 and 4, the hybrid module is glued to the surface of the radiator 3. However, it is also possible to introduce a recess in the cooling body, which can also be produced, for example, from die casting, and to glue the hybrid assembly into this recess.

Die in den Figuren gezeigte flexible Leiterplatte 4 kann direkt in einen verstärkten Bereich übergehen, in dem weitere Bauelemente angeordnet sind. Es ist auch möglich, die flexible Leiterplatte 4 über ge­ eignete Kontaktierungseinrichtungen mit starren Lei­ terplatten zu verbinden. The flexible printed circuit board 4 shown in the figures can pass directly into a reinforced area in which further components are arranged. It is also possible to connect the flexible circuit board 4 via ge suitable contacting devices with rigid Lei terplatten.

Die Herstellung der elektrischen Verbindung wird da­ durch sehr erleichtert, daß durch die Justiereinrich­ tung 8, 12 eine optimale Ausrichtung der Anschlußfah­ nen 9 gegenüber den Kontaktflächen 11 auf der Hybrid­ baugruppe 1 erreicht wird. Die Anschlußfahnen sind die Enden der Kupferleiterbahnen der flexiblen Lei­ terplatte. Die Verbindung mit den Kontaktflächen er­ folgt durch Löten, beispielsweise durch eine Bügel- Lötung, wobei jeweils alle Lötverbindungen einer Seite einer Hybridbaugruppe gleichzeitig hergestellt werden. Für diese Art Verbindung ist beispielsweise auch das Reflow-Lötverfahren geeignet. Das notwendige Lot befindet sich entweder auf den Anschlußfahnen oder auf den Kontaktflächen der Hybridbaugruppe. Es ist jedoch auch möglich, beide Teile mit Lot zu ver­ sehen.The production of the electrical connection is made much easier by the fact that the Justiereinrich device 8 , 12 optimal alignment of the Anschlussfah NEN 9 relative to the contact surfaces 11 on the hybrid assembly 1 is achieved. The connection lugs are the ends of the copper conductor tracks of the flexible circuit board. The connection to the contact areas is made by soldering, for example by ironing, with all solder connections on one side of a hybrid assembly being made at the same time. The reflow soldering method is also suitable for this type of connection. The necessary solder is either on the connection lugs or on the contact surfaces of the hybrid module. However, it is also possible to see both parts with solder.

Durch die einfache Ausrichtung und die einfache Her­ stellung der Verbindung sind großserien-taugliche Fertigungsverfahren mit großer Fertigungssicherheit bei der Herstellung der elektrischen Verbindungen einsetzbar. Die Qualität der Lötverbindung ist ohne Zerstörung der Verbindungsstellen einfach durch Sichtkontrolle durchführbar, wobei durch das Loch 13 in der Anschlußfahne 9 der Lötfluß sehr leicht über­ prüft werden kann.Due to the simple alignment and the simple manufacture of the connection, large-scale production processes with great manufacturing reliability can be used in the manufacture of the electrical connections. The quality of the soldered connection can be carried out by visual inspection without destroying the connection points, and the soldering flow can be checked very easily through the hole 13 in the connecting lug 9 .

Die mit diesem Verfahren herstellbaren elektrischen Verbindungen sind sehr robust, so daß grundsätzlich ein Schutz der Verbindungen nicht erforderlich ist. Bei rauhen Bedingungen ist es jedoch auch möglich, durch den in Fig. 4 dargestellten, oben erwähnten Halterrahmen die Verbindungen und auch die Hybridbau­ gruppe zu schützen.The electrical connections that can be produced with this method are very robust, so that in principle protection of the connections is not necessary. In harsh conditions, however, it is also possible to protect the connections and also the hybrid assembly by the holder frame shown in FIG. 4, mentioned above.

Claims (10)

1. Elektrische Verbindung zwischen einer Hybridbau­ gruppe und einer Leiterplatte, gekenn­ zeichnet durch flexible, als An­ schlußfahnen (9) dienende Bereiche der Leiterplatte (4).1. Electrical connection between a hybrid assembly group and a printed circuit board, characterized by flexible, as at lugs ( 9 ) serving areas of the circuit board ( 4 ). 2. Elektrische Verbindung nach Anspruch 1, da­ durch gekennzeichnet, daß die An­ schlußfahnen (9) im Bereich ihrer auf den Kontakt­ flächen (11) der Hybridbaugruppe (1) aufliegenden En­ den eine Ausnehmung (13) aufweisen.2. Electrical connection according to claim 1, characterized in that the on flags ( 9 ) in the area of their on the contact surfaces ( 11 ) of the hybrid assembly ( 1 ) lying on the En have a recess ( 13 ). 3. Elektrische Verbindung nach Anspruch 1 oder 2, gekennzeichnet durch eine Ju­ stiereinrichtung (8, 12) die die Anschlußfahnen (9) der Leiterplatte (4) gegenüber der Hybridbaugruppe (1) ausrichtet. 3. Electrical connection according to claim 1 or 2, characterized by a Ju bull device ( 8 , 12 ) which aligns the terminal lugs ( 9 ) of the circuit board ( 4 ) relative to the hybrid assembly ( 1 ). 4. Elektrische Verbindung nach Anspruch 3, da­ durch gekennzeichnet, daß die Justiereinrichtung einen von der Unterlage (3) der Hybridbaugruppe ausgehenden Fangstift (8) aufweist, der in ein entsprechendes Fangloch (12) in der Leiterplatte (4) eingreift.4. Electrical connection according to claim 3, characterized in that the adjusting device has a catch pin ( 8 ) extending from the base ( 3 ) of the hybrid assembly, which engages in a corresponding catch hole ( 12 ) in the printed circuit board ( 4 ). 5. Elektrische Verbindung nach einem der Ansprüche 1 bis 4, gekennzeichnet durch einen der Zugentlastung der elektrischen Verbindung und/oder dem Schutz der Hybridbaugruppe und der elektrischen Verbindung dienenden Halterahmen (14) .5. Electrical connection according to one of claims 1 to 4, characterized by one of the strain relief of the electrical connection and / or the protection of the hybrid assembly and the electrical connection serving holding frame ( 14 ). 6. Elektrische Verbindung nach Anspruch 5, da­ durch gekennzeichnet, daß der Halterahmen von den Fangstiften (8) der Justierein­ richtung gehalten wird.6. Electrical connection according to claim 5, characterized in that the holding frame is held by the catch pins ( 8 ) of the Justierein direction. 7. Elektrische Verbindung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß die Hybridbaugruppe (1) und der unmittelbar be­ nachbarte Bereich der Leiterplatte (4) auf einer ge­ meinsamen Unterlage angebracht sind.7. Electrical connection according to one of claims 1 to 6, characterized in that the hybrid assembly ( 1 ) and the immediately adjacent region of the printed circuit board ( 4 ) are mounted on a common base. 8. Elektrische Verbindung nach Anspruch 7, da­ durch gekennzeichnet, daß die Hy­ bridbaugruppe (1) und der flexible Bereich der Leiterplatte (4) mit einem gemeinsamen Kühlkörper (3) verklebt sind.8. Electrical connection according to claim 7, characterized in that the Hy bridbaugruppe ( 1 ) and the flexible region of the circuit board ( 4 ) with a common heat sink ( 3 ) are glued. 9. Verfahren zur Herstellung einer elektrischen Verbindung zwischen einer Hybridbaugruppe und einer Leiterplatte nach einem der Ansprüche 1 bis 8, ge­ kennzeichnet durch folgende Schritte:
  • - elastische Anschlußfahnen (9) der Leiterplatte (8) werden in einer eindeutigen Lagezuordnung auf Kontaktflächen (11) der Hybridbaugruppe (1) ange­ ordnet und in dieser Lage mittels einer Justier­ einrichtung (8, 12) fixiert, anschließend werden
  • - mehrere elektrische Verbindungen zwischen der Hybridbaugruppe (1) und der Leiterplatte (4) gleichzeitig durch Bügel-Lötung hergestellt.
9. A method for producing an electrical connection between a hybrid assembly and a printed circuit board according to one of claims 1 to 8, characterized by the following steps:
  • - Elastic connection lugs ( 9 ) of the printed circuit board ( 8 ) are arranged in a unique position on contact surfaces ( 11 ) of the hybrid assembly ( 1 ) and in this position by means of an adjustment device ( 8 , 12 ) fixed, then
  • - Several electrical connections between the hybrid assembly ( 1 ) and the printed circuit board ( 4 ) simultaneously made by bracket soldering.
10. Verfahren nach Anspruch 9, dadurch ge­ kennzeichnet, daß die Lötverbindungen durch Sichtprüfung kontrolliert werden.10. The method according to claim 9, characterized ge indicates that the solder connections be checked by visual inspection.
DE19883813566 1988-04-22 1988-04-22 Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production Withdrawn DE3813566A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19883813566 DE3813566A1 (en) 1988-04-22 1988-04-22 Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production
FR8904667A FR2630615A1 (en) 1988-04-22 1989-04-10 ELECTRICAL JUNCTION BETWEEN A HYBRID BUILDING ELEMENT AND A CIRCUIT BOARD AND A PROCESS FOR CARRYING OUT SAID CIRCUIT BOARD

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DE19883813566 DE3813566A1 (en) 1988-04-22 1988-04-22 Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19720167A1 (en) * 1997-05-14 1998-11-19 Siemens Ag Remote electrical component connection structure for automatic transmission
EP0938252A2 (en) * 1998-02-18 1999-08-25 Siemens Aktiengesellschaft Electrical circuit arrangement
WO2000074446A1 (en) * 1999-05-31 2000-12-07 Tyco Electronics Logistics Ag Intelligent power module
DE102007012501A1 (en) * 2007-03-15 2008-09-18 Continental Automotive Gmbh Conductor and circuit carrier assembly, for a hybrid circuit or circuit board, has a conductor embedded in a base plate with an extended tine in contact with a circuit component
DE102014107996A1 (en) * 2014-06-06 2015-12-17 Neuschäfer Elektronik GmbH Rotatable PCB connectors

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19719235A1 (en) 1997-05-07 1998-11-12 Bosch Gmbh Robert Method for contacting at least one printed circuit board or at least one lead frame and at least one hybrid
DE19750306A1 (en) * 1997-11-13 1999-05-20 Bosch Gmbh Robert Electronic control device for motor vehicle

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19720167A1 (en) * 1997-05-14 1998-11-19 Siemens Ag Remote electrical component connection structure for automatic transmission
FR2763467A1 (en) * 1997-05-14 1998-11-20 Siemens Ag STRUCTURE FOR CONNECTING ELECTRICAL COMPONENTS TO A CENTRAL UNIT
US6104618A (en) * 1997-05-14 2000-08-15 Siemens Aktiengesellschaft Structure for connecting a plurality of mutually remote electrical components to a central unit
DE19720167B4 (en) * 1997-05-14 2006-06-22 Siemens Ag Structure for connecting a plurality of remote electrical components to a central unit
EP0938252A2 (en) * 1998-02-18 1999-08-25 Siemens Aktiengesellschaft Electrical circuit arrangement
EP0938252A3 (en) * 1998-02-18 2001-02-14 Siemens Aktiengesellschaft Electrical circuit arrangement
WO2000074446A1 (en) * 1999-05-31 2000-12-07 Tyco Electronics Logistics Ag Intelligent power module
US6882538B1 (en) 1999-05-31 2005-04-19 Tyco Electronics Logistics Ag Intelligent power module
DE102007012501A1 (en) * 2007-03-15 2008-09-18 Continental Automotive Gmbh Conductor and circuit carrier assembly, for a hybrid circuit or circuit board, has a conductor embedded in a base plate with an extended tine in contact with a circuit component
DE102014107996A1 (en) * 2014-06-06 2015-12-17 Neuschäfer Elektronik GmbH Rotatable PCB connectors

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