DE102007012501A1 - Conductor and circuit carrier assembly, for a hybrid circuit or circuit board, has a conductor embedded in a base plate with an extended tine in contact with a circuit component - Google Patents

Conductor and circuit carrier assembly, for a hybrid circuit or circuit board, has a conductor embedded in a base plate with an extended tine in contact with a circuit component Download PDF

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Publication number
DE102007012501A1
DE102007012501A1 DE102007012501A DE102007012501A DE102007012501A1 DE 102007012501 A1 DE102007012501 A1 DE 102007012501A1 DE 102007012501 A DE102007012501 A DE 102007012501A DE 102007012501 A DE102007012501 A DE 102007012501A DE 102007012501 A1 DE102007012501 A1 DE 102007012501A1
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Prior art keywords
circuit
base plate
carrier
conductor
circuit carrier
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DE102007012501A
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German (de)
Inventor
Gerald Scharf
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Continental Automotive GmbH
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Continental Automotive GmbH
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Priority to DE102007012501A priority Critical patent/DE102007012501A1/en
Publication of DE102007012501A1 publication Critical patent/DE102007012501A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Abstract

The assembly (10) of a conductor carrier (12) and a circuit carrier has a base plate (24) for the conductor carrier, defined by edges (25). The electrical conductor (21) is a stamped grid embedded in an injection molded base plate. A conductive tine (22), as part of the conductor, extends over the base plate edge and/or at a gap from it, with a direct electrical coupling at the circuit carrier.

Description

Die Erfindung betrifft eine Anordnung aus einem Leitungsträger und einem Schaltungsträger.The The invention relates to an arrangement of a conductor carrier and a circuit carrier.

Bei Kraftfahrzeugen besteht immer häufiger die Anforderung, eine Steuerelektronik und dazugehörige elektrische und/oder elektronische Bauteilen direkt in die entsprechenden ausführenden Komponenten wie Getriebe, Bremsanlagen oder Motoren zu integrieren. Auch bei elektromechanischen oder elektrohydraulischen Lenksystemen ist diese Art der Integration in zunehmendem Maße gewünscht. In den dabei immer mehr eingesetzten mechatronischen Systemen kommen vielfach Schaltungsträger zum Einsatz. Die auf dem Schaltungsträger aufgebrachte Steuerelektronik stellt hohe technologische Systemanforderungen. Diese ergeben sich insbesondere in Bezug auf die mechanische Stabilität wie die Festigkeit gegenüber Vibrationsbeschleunigungen.at Motor vehicles is more often the Requirement, control electronics and associated electrical and / or electronic Components directly into the corresponding exporting components such as gearboxes, To integrate brake systems or engines. Also with electromechanical or electrohydraulic steering systems is this type of integration increasingly desired. In the increasingly used mechatronic systems come Many circuit carriers for Commitment. The applied on the circuit board control electronics represents high technological system requirements. These arise especially in terms of mechanical stability like the Strength against Vibration accelerations.

Der Erfindung liegt die Aufgabe zugrunde, eine Anordnung aus einem Leitungsträger und einem Schaltungsträger zu schaffen, die eine mechanisch sichere elektrische Anbindung von dem Schaltungsträger an den Leitungsträger ermöglicht.Of the Invention is based on the object, an arrangement of a conductor carrier and a circuit carrier to create a mechanically secure electrical connection of the circuit carrier to the management board allows.

Die Aufgabe wird gelöst durch die Merkmale der unabhängigen Ansprüche. Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen angegeben.The Task is solved by the characteristics of the independent Claims. Advantageous embodiments of the invention are specified in the subclaims.

Die Erfindung zeichnet sich aus durch eine Anordnung aus einem Leitungsträger und einem Schaltungsträger, wobei der Leitungsträger aufweist eine Basisplatte, die durch Kanten begrenzt ist, ein elektrische Leiterbahnen aufweisendes Stanzgitter, das auf oder in der Basisplatte angeordnet und mit der Basisplatte mechanisch gekoppelt ist, und einen elektrisch leitenden Kontaktfinger, der als ein Teil einer der elektrischen Leiterbahnen ausgebildet und derart angeordnet ist, dass er an einer der Kanten über die Basisplatte hinausragt und/oder von der Basisplatte bereichsweise beabstandet ist, und stoffschlüssig direkt mit dem Schaltungsträger elektrisch gekoppelt ist.The Invention is characterized by an arrangement of a conductor carrier and a circuit carrier, the leader has a base plate bounded by edges, an electrical Punched punched grid on or in the base plate arranged and mechanically coupled to the base plate, and an electrically conductive contact finger acting as a part of one of electrical conductor tracks is formed and arranged such that he over at one of the edges the base plate protrudes and / or area of the base plate is spaced, and cohesively directly to the circuit carrier is electrically coupled.

Die Kontaktfinger stellen hierbei also freiliegende Verlängerungen der Leiterbahnen dar, die über eine Ober- oder Unterseite und/oder die Kanten der Basisplatte des Leitungsträgers hinausragen.The Contact fingers thus represent exposed extensions of the tracks that over a top or bottom and / or the edges of the base plate of line carrier protrude.

Dies hat den Vorteil, dass kein separates elektrisch leitendes Bauteil zur elektrischen Kopplung zwischen der Leiterbahn und dem Schaltungsträger erforderlich ist, sondern dass die Kontaktfinger der Leiterbahnen unmittelbar der elektrischen Kopplung zwischen der Leiterbahn und dem Schaltungsträger dienen können. Des Weiteren ist wegen des Hinausragens der Kontaktfinger über Seiten oder Kanten der Basisplatte des Leitungsträgers hinaus eine freie Positionierung des Schaltungsträgers relativ zum Leitungsträger möglich. Aufgrund der Ausbildung von nur einer Kopplungsstelle zwischen der Leiterbahn und dem Schaltungsträger ist darüber hinaus ein kleiner Übergangswiderstand zwischen der Leiterbahn und dem Schaltungsträger möglich. Schließlich ist eine hohe mechanische Stabilität des einstückigen Verbunds aus Leiterbahn und Kontaktfinger erreichbar.This has the advantage that no separate electrically conductive component required for electrical coupling between the conductor track and the circuit carrier is, but that the contact fingers of the tracks directly serve the electrical coupling between the conductor track and the circuit carrier can. Furthermore, because of the protrusion of the contact fingers over pages or edges of the base plate of the cable carrier beyond a free positioning of the circuit board relative to the management carrier possible. Due to the formation of only one coupling point between the Trace and the circuit carrier is about it In addition, a small contact resistance between the track and the circuit board possible. Finally is a high mechanical stability of the one piece Compound of conductor track and contact fingers reachable.

In einer bevorzugten Ausführungsform besteht der Kontaktfinger aus einem Material, das Kupfer aufweist. Dies hat den Vorteil, dass eine gute elektrische Leitfähigkeit und eine gute elektrische Kopplung zwischen dem Kontaktfinger und dem Schaltungsträger möglich ist. Darüber hinaus ist eine einfache und zuverlässige mechanische Kopplung zwischen dem Kontaktfinger und dem Schaltungsträger möglich.In a preferred embodiment the contact finger is made of a material that has copper. This has the advantage of having good electrical conductivity and good electrical coupling between the contact finger and the circuit carrier possible is. About that In addition, a simple and reliable mechanical coupling between the contact finger and the circuit carrier possible.

In einer weiteren bevorzugten Ausführungsform ist die Basisplatte spritzgegossen und das Stanzgitter ist mindestens teilweise in die Basisplatte eingebettet. Dies hat den Vorteil, dass eine einfache Ausbildung des Verbunds aus der Basisplatte des Leitungsträgers und dem einstückigen Verbund aus Leiterbahn und Kontaktfinger möglich ist. Des Weiteren ist eine stabile mechanische Kopplung der Leiterbahn mit der Basisplatte des Leitungsträgers bei hoher Flexibilität der elektrischen Kopplung zwischen Leiterbahn und dem Schaltungsträger möglich.In a further preferred embodiment the base plate is injection molded and the punched grid is at least partially embedded in the base plate. This has the advantage that a simple formation of the composite of the base plate of the cable carrier and the one-piece Composite of conductor track and contact fingers is possible. Furthermore is a stable mechanical coupling of the track to the base plate of the management carrier with high flexibility the electrical coupling between the conductor and the circuit board possible.

In einer weiteren bevorzugten Ausführungsform ist der Leitungsträger mit dem Schaltungsträger mittels Laserschweißen elektrisch gekoppelt. Dies hat den Vorteil, dass eine einfache und sichere stoffschlüssige Kopplung zwischen dem Leitungsträger und dem Schaltungsträger möglich ist. Insbesondere ist Laserschweißen ein Verfahren, das unempfindlich gegen Verschmutzungen auf dem Leitungsträger oder dem Schaltungsträger ist.In a further preferred embodiment is the manager with the circuit carrier by means of laser welding electrically coupled. This has the advantage of being a simple and secure cohesive Coupling between the line carrier and the circuit carrier possible is. In particular, laser welding is a process that is insensitive to Dirt on the cable carrier or the circuit carrier is.

In einer weiteren bevorzugten Ausführungsform ist der Schaltungsträger eine Hybridschaltung. Dies hat den Vorteil, dass auf ein separates elektrisch leitendes Bauteil zur elektrischen Kopplung zwischen der Leiterbahn und der Hybridschaltung verzichtet werden kann, die Kontaktfinger der Leiterbahnen vielmehr unmittelbar der elektrischen Kopplung zwischen der Leiterbahn und der Hybridschaltung dienen können.In a further preferred embodiment is the circuit carrier a hybrid circuit. This has the advantage of being on a separate electrically conductive component for electrical coupling between the Track and the hybrid circuit can be omitted, the contact fingers the tracks rather directly the electrical coupling between the track and the hybrid circuit can serve.

In einer weiteren bevorzugten Ausführungsform ist der Schaltungsträger eine Leiterplatte mit elektrischen und/oder elektronischen Bauteilen. Dies hat den Vorteil, dass für Leiterplatten mit elektrischen und/oder elektronischen Bauteilen auf ein separates elektrisch leitendes Bauteil zur elektrischen Kopplung zwischen der Leiterbahn und dem Schaltungsträger verzichtet werden kann, die Kontaktfinger der Leiterbahnen vielmehr unmittelbar der elektrischen Kopplung zwischen der Leiterbahn und dem Schaltungsträger dienen können.In a further preferred embodiment, the circuit carrier is a printed circuit board with electrical and / or electronic components. This has the advantage that for printed circuit boards with electrical and / or electronic components on a separate electrically conductive component for electrical Kopp ment can be dispensed with between the conductor track and the circuit carrier, the contact fingers of the conductor tracks can rather serve directly the electrical coupling between the conductor track and the circuit carrier.

Vorteilhafte Ausgestaltungen der Erfindung sind nachfolgend anhand der schematischen Zeichnungen näher erläutert. Es zeigen:advantageous Embodiments of the invention are described below with reference to the schematic Drawings closer explained. Show it:

1 eine teilweise geschnittene und gebrochene Aufsicht auf eine Anordnung aus einem Leitungsträger und einem Schaltungsträger, 1 a partially sectioned and broken plan view of an arrangement of a conductor carrier and a circuit carrier,

2a eine Schnittansicht einer ersten Ausführungsform der Anordnung aus dem Leitungsträger und dem Schaltungsträger entlang der Linie II-II' der 1, und 2a a sectional view of a first embodiment of the arrangement of the conductor carrier and the circuit carrier along the line II-II 'of 1 , and

2b eine Schnittansicht einer zweiten Ausführungsform der Anordnung aus dem Leitungsträger und dem Schaltungsträger. 2 B a sectional view of a second embodiment of the arrangement of the conductor carrier and the circuit carrier.

1 zeigt eine teilweise geschnittene Aufsicht auf eine Anordnung 10 aus einem Leitungsträger 12 und einem Schaltungsträger 14. Der Schaltungsträger 14 ist insbesondere eine Leiterplatte mit einer Vielzahl von elektrischen und/oder elektronischen Bauteilen 16. Der Schaltungsträger 14 kann auch eine Hybridschaltung sein. Sowohl der Leitungsträger 12 als auch der Schaltungsträger 14 sind auf einer Grundplatte 18 angeordnet, die einen stabilen Verbund aus dem Leitungsträger 12 und dem Schaltungsträger 14 ermöglicht. Diese Anordnung ermöglicht weiter, dass der Leitungsträger 12 und der Schaltungsträger 14 in einer gemeinsamen Ebene angeordnet sind. 1 shows a partially cut plan view of an arrangement 10 from a management carrier 12 and a circuit carrier 14 , The circuit carrier 14 is in particular a printed circuit board with a plurality of electrical and / or electronic components 16 , The circuit carrier 14 can also be a hybrid circuit. Both the management board 12 as well as the circuit carrier 14 are on a base plate 18 arranged a stable composite of the conductor carrier 12 and the circuit carrier 14 allows. This arrangement further allows the conductor carrier 12 and the circuit carrier 14 arranged in a common plane.

Der Leitungsträger 12 hat eine Basisplatte 24, die vorzugsweise aus einem Material gebildet ist, das einen Kunststoff aufweist, und in die gemäß einer ersten Ausführungsform ein Stanzgitter 32 eingebettet ist (2a). Das Stanzgitter 32 hat elektrische Leiterbahnen 21.The management carrier 12 has a base plate 24 , which is preferably formed from a material having a plastic, and in which according to a first embodiment, a stamped grid 32 is embedded ( 2a ). The punched grid 32 has electrical tracks 21 ,

Die Basisplatte 24 des Leitungsträgers 12 ist vorzugsweise mittels eines Spritzgussverfahrens hergestellt und das Stanzgitter 32 ist vorzugsweise mindestens teilweise in die Basisplatte 24 des Leitungsträgers 12 eingebettet. Damit kann erreicht werden, dass das Stanzgitter 32 mit den Leiterbahnen 21 mechanisch stabil mit der Basisplatte 24 des Leitungsträgers 12 gekoppelt ist.The base plate 24 of the management carrier 12 is preferably produced by means of an injection molding process and the stamped grid 32 is preferably at least partially in the base plate 24 of the management carrier 12 embedded. This can be achieved that the punched grid 32 with the tracks 21 mechanically stable with the base plate 24 of the management carrier 12 is coupled.

Das Stanzgitter 32 kann gemäß einer zweiten Ausführungsform alternativ oder zusätzlich auch auf einer Oberfläche 20 der Basisplatte 24 des Leitungsträgers 12 angeordnet sein (2b).The punched grid 32 may according to a second embodiment alternatively or additionally also on a surface 20 the base plate 24 of the management carrier 12 be arranged ( 2 B ).

Der Leitungsträger 12 hat weiter Kontaktfinger 22, die jeweils als ein Teil einer der elektrischen Leiterbahnen 21 ausgebildet sind, mit diesen zusammen also einstückig sind. Die Kontaktfinger 22 sind außerhalb der Basisplatte 24 des Leitungsträgers 12 angeordnet, ragen also über eine Kante 25 der Basisplatte 24 des Leitungsträgers 12 hinaus. Alternativ oder zusätzlich können die Kontaktfinger 22 auch von der Oberfläche 20 der Basisplatte 24 des Leitungsträgers 12 beabstandet sein, wie dies in 2b gezeigt ist.The management carrier 12 has further contact fingers 22 , each as a part of one of the electrical conductors 21 are formed with these together so are one piece. The contact fingers 22 are outside the base plate 24 of the management carrier 12 arranged, thus protrude over an edge 25 the base plate 24 of the management carrier 12 out. Alternatively or additionally, the contact fingers 22 also from the surface 20 the base plate 24 of the management carrier 12 be spaced like this in 2 B is shown.

Die Leiterbahnen 21 und/oder die Kontaktfinger 22 haben vorzugsweise einen rechteckigen Querschnitt, wobei beliebige Verhältnisse zwischen Breite und Höhe insbesondere des Kontaktfingers 22 ausgebildet werden können. Insbesondere lassen sich flache Geometrien des Kontaktfingers 22 ausbilden, wobei das Verhältnis zwischen Breite und Höhe des Kontaktfingers 22 vorzugsweise zwischen 5 und 20 liegt. Besonders bevorzugt ist, wenn die Breite des Kontaktfingers 22 zwischen 1 und 3 mm, und die Höhe des Kontaktfingers zwischen 0,1 und 0,3 mm ist. Derartige Breiten und Höhen des Kontaktfingers 22 ermöglichen eine besonders gute Biegbarkeit der Kontaktfinger 22 bei gleichwohl ausreichender Belastbarkeit mit elektrischem Strom.The tracks 21 and / or the contact fingers 22 preferably have a rectangular cross section, with any ratios between width and height, in particular of the contact finger 22 can be trained. In particular, flat geometries of the contact finger can be used 22 form, the ratio between width and height of the contact finger 22 preferably between 5 and 20. It is particularly preferred if the width of the contact finger 22 between 1 and 3 mm, and the height of the contact finger is between 0.1 and 0.3 mm. Such widths and heights of the contact finger 22 allow a particularly good bendability of the contact fingers 22 nevertheless sufficient capacity with electric current.

Die Kontaktfinger 22 und die Leiterbahnen 21 bestehen vorzugsweise aus einem Material, das Kupfer aufweist. Damit ist eine hohe elektrische Leitfähigkeit zwischen dem Leitungsträger 12 und dem Schaltungsträger 14 ermöglicht.The contact fingers 22 and the tracks 21 are preferably made of a material comprising copper. This is a high electrical conductivity between the conductor carrier 12 and the circuit carrier 14 allows.

Die Kontaktfinger 22 weisen weiter jeweils einen Dehnungsabschnitt 26 auf, mittels dem durch Temperaturänderungen verursachte Längenänderungen des Kontaktfingers 22 ausgeglichen werden können.The contact fingers 22 each further have a stretch section 26 on, by means of the changes in length caused by temperature changes of the contact finger 22 can be compensated.

An den Endabschnitten 30 der Kontaktfinger 22 sind jeweils Verbindungspunkte 28 ausgebildet, mittels denen eine mechanische und elektrische Kopplung des Kontaktfingers 22 mit dem Schaltungsträger 14 erfolgt.At the end sections 30 the contact finger 22 are each connection points 28 formed, by means of which a mechanical and electrical coupling of the contact finger 22 with the circuit carrier 14 he follows.

Die Kopplung zwischen dem Leitungsträger 12 im Bereich der Kontaktfinger 22 und dem Schaltungsträger 14 erfolgt bevorzugt mittels Laserschweißen. Dies ermöglicht eine besonders einfache stoffschlüssige elektrische Kopplung der Kontaktfinger 22 mit dem Schaltungsträger 14. Damit kann ein kleiner Übergangswiderstand zwischen der Leiterbahn 21 und dem Schaltungsträger 14 erreicht werden. Insbesondere kann darauf verzichtet werden, an Kontaktbereichen der elektrischen und/oder elektronischen Bauteile 16 des Schaltungsträgers 14 oder der Hybridschaltung aufwändige Oberflächenbehandlungen vorzunehmen, um eine gute Kopplung zwischen der Leiterbahn 21 und dem Schaltungsträger 14 zu erreichen.The coupling between the conductor carrier 12 in the area of contact fingers 22 and the circuit carrier 14 takes place preferably by means of laser welding. This allows a particularly simple cohesive electrical coupling of the contact fingers 22 with the circuit carrier 14 , This allows a small contact resistance between the conductor track 21 and the circuit carrier 14 be achieved. In particular, it can be dispensed with, at contact areas of the electrical and / or electronic components 16 of the circuit board 14 or the hybrid circuit complex surface treatments to make a good coupling between the conductor 21 and the circuit carrier 14 to reach.

Durch die sichere Kopplung zwischen den Kontaktfingern 22 und dem Schaltungsträger 14 kann insbesondere auch auf einen Verguss der Kontaktfinger 22 im Bereich der Kopplung mit dem Schaltungsträger 14 verzichtet werden. Dies gilt insbesondere auch dann, wenn die Anordnung 10 aus dem Leitungsträger 12 und dem Schaltungsträger 14 starken mechanischen Belastungen etwa durch mechanische Schwingungen, wie sie in Fahrzeugen auftreten können, ausgesetzt ist.Due to the secure coupling between the contact fingers 22 and the circuit carrier 14 can in particular also on a casting of the contact fingers 22 in the area of the coupling with the circuit carrier 14 be waived. This is especially true when the arrangement 10 from the management carrier 12 and the circuit carrier 14 strong mechanical loads such as mechanical vibrations, such as may occur in vehicles exposed.

1010
Anordnung aus Leitungsträger u. Schaltungsträgerarrangement from management carrier u. circuit support
1212
Leitungsträgerbusbar
1414
Schaltungsträgercircuit support
1616
elektrische und/oder elektronische Bauteileelectrical and / or electronic components
1818
Grundplattebaseplate
2020
Oberfläche der BasisplatteSurface of the baseplate
2121
Leiterbahnconductor path
2222
Kontaktfingercontact fingers
2424
Basisplatte des Leitungsträgersbaseplate of the management carrier
2525
Kante der Basisplatteedge the base plate
2626
Dehnungsabschnitt des Kontaktfingersexpansion portion of the contact finger
2828
Verbindungspunkt des Kontaktfingersjunction of the contact finger
3030
Endabschnitt des Kontaktfingersend of the contact finger
3232
Stanzgitterlead frame

Claims (6)

Anordnung (10) aus einem Leitungsträger (12) und einem Schaltungsträger (14), wobei der Leitungsträger (12) aufweist – eine Basisplatte (24), die durch Kanten (25) begrenzt ist, – ein elektrische Leiterbahnen (21) aufweisendes Stanzgitter (32), das auf oder in der Basisplatte (24) angeordnet und mit der Basisplatte (24) mechanisch gekoppelt ist, und – einen elektrisch leitenden Kontaktfinger (22), der als ein Teil einer der elektrischen Leiterbahnen (21) ausgebildet und derart angeordnet ist, dass er an einer der Kanten (25) über die Basisplatte (24) hinausragt und/oder von der Basisplatte (24) bereichsweise beabstandet ist, und stoffschlüssig direkt mit dem Schaltungsträger (14) elektrisch gekoppelt ist.Arrangement ( 10 ) from a management carrier ( 12 ) and a circuit carrier ( 14 ), whereby the management carrier ( 12 ) - a base plate ( 24 ) by edges ( 25 ), - an electrical conductor track ( 21 ) having punched grid ( 32 ) on or in the base plate ( 24 ) and with the base plate ( 24 ) is mechanically coupled, and - an electrically conductive contact finger ( 22 ), which is used as part of one of the electrical tracks ( 21 ) is formed and arranged such that it at one of the edges ( 25 ) over the base plate ( 24 protrudes and / or from the base plate ( 24 ) is partially spaced, and cohesively directly to the circuit carrier ( 14 ) is electrically coupled. Anordnung (10) nach Anspruch 1, wobei der Kontaktfinger (22) aus einem Material besteht, das Kupfer aufweist.Arrangement ( 10 ) according to claim 1, wherein the contact finger ( 22 ) is made of a material comprising copper. Anordnung (10) nach einem der vorhergehenden Ansprüche, wobei die Basisplatte (24) spritzgegossen ist und das Stanzgitter (32) mindestens teilweise in die Basisplatte (24) eingebettet ist.Arrangement ( 10 ) according to one of the preceding claims, wherein the base plate ( 24 ) is injection-molded and the punched grid ( 32 ) at least partially into the base plate ( 24 ) is embedded. Anordnung (10) nach einem der vorhergehenden Ansprüche, wobei der Leitungsträger (12) mit dem Schaltungsträger (14) mittels Laserschweißen elektrisch gekoppelt ist.Arrangement ( 10 ) according to one of the preceding claims, wherein the management carrier ( 12 ) with the circuit carrier ( 14 ) is electrically coupled by means of laser welding. Anordnung (10) nach einem der vorhergehenden Ansprüche, wobei der Schaltungsträger (14) eine Hybridschaltung ist.Arrangement ( 10 ) according to one of the preceding claims, wherein the circuit carrier ( 14 ) is a hybrid circuit. Anordnung (10) nach einem der Ansprüche 1 bis 4, wobei der Schaltungsträger (14) eine Leiterplatte mit elektrischen und/oder elektronischen Bauteilen ist.Arrangement ( 10 ) according to one of claims 1 to 4, wherein the circuit carrier ( 14 ) is a printed circuit board with electrical and / or electronic components.
DE102007012501A 2007-03-15 2007-03-15 Conductor and circuit carrier assembly, for a hybrid circuit or circuit board, has a conductor embedded in a base plate with an extended tine in contact with a circuit component Withdrawn DE102007012501A1 (en)

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US7773380B2 (en) 2008-04-03 2010-08-10 Robert Bosch Gmbh Electrical configuration as heat dissipation design
WO2021013915A1 (en) * 2019-07-25 2021-01-28 Robert Bosch Gmbh Electrical and/or electronic component and contact arrangement

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DE3813566A1 (en) * 1988-04-22 1989-11-02 Bosch Gmbh Robert Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production
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FR2876965A1 (en) * 2004-10-26 2006-04-28 Valeo Vision Sa Light source e.g. smart LED, support for e.g. headlight of motor vehicle, has two conductors, each presenting respective bonding pad to be integrated by welding with respective conductors of each electronic support

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Publication number Priority date Publication date Assignee Title
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US4731700A (en) * 1987-02-12 1988-03-15 Delco Electronics Corporation Semiconductor connection and crossover apparatus
DE3813566A1 (en) * 1988-04-22 1989-11-02 Bosch Gmbh Robert Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system
DE19719235A1 (en) * 1997-05-07 1998-11-12 Bosch Gmbh Robert Method for contacting at least one printed circuit board or at least one lead frame and at least one hybrid
JP2000133897A (en) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd Resin-forming substrate
FR2876965A1 (en) * 2004-10-26 2006-04-28 Valeo Vision Sa Light source e.g. smart LED, support for e.g. headlight of motor vehicle, has two conductors, each presenting respective bonding pad to be integrated by welding with respective conductors of each electronic support

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7773380B2 (en) 2008-04-03 2010-08-10 Robert Bosch Gmbh Electrical configuration as heat dissipation design
WO2021013915A1 (en) * 2019-07-25 2021-01-28 Robert Bosch Gmbh Electrical and/or electronic component and contact arrangement

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