DE3301526A1 - Thermally conductive connection - Google Patents

Abstract

Thermally conductive connection between a heat-dissipating or heat-absorbing first component and a working medium, it being possible to exchange the first component without opening the working circuit, characterised in that the first component (1, 3) is housed in an elastically sealed fashion in a sleeve (6) in the working medium (4) and the gap (14) between the sleeve (6) and the first component (1, 3) is filled with a solder (13). <IMAGE>

Description

Thermally conductive connection

The invention relates to a thermally conductive connection between a heat-emitting or heat-absorbing first component and a working medium, in particular between the condensation part of a heat pipe and one that absorbs the heat Working fluid.

Heat pipes are well-known components with an extremely high thermal conductivity. They absorb heat at one end (collector) and release it at the other end (condenser) off again. They are used, for example, to transfer heat between a solar collector and a working medium, e.g.

Water, a low-boiling liquid, ammonia, or air. One A large number of heat pipes absorb the energy on the collector side and release it in a common collecting pipe back to a working fluid.

The heat should be transferred from the collector to the working medium with as little loss as possible reach. In addition, there are good heat-conducting connections to the heat pipe and from the heat pipe necessary to the working medium.

It is known that the heat-emitting side of a heat pipe through a to push the opening into the container of the working medium and to seal it.

Good heat transfers can be achieved, but the heat pipe is to seal, especially in the case of volatile, low-boiling working media There are sealing problems. A heat pipe can only be exchanged by opening it of the working cycle possible.

It is known to use a metal block in which the capacitor of the heat pipe is pinched, as is the collecting pipe of the working fluid. Included there are large temperature losses, as the heat conduction takes place over a long distance and the condenser and the header are arranged perpendicular to each other. One Exchangeability of the heat pipes without opening the working circuit is given.

The length of the manifold is limited by thermal expansion, because the manifold is heated and expands and the other end of the heat pipe stays cold. This means that the maximum lengths of the collecting pipe are without expansion compensation elements reachable from approx. 2 m.

The integration of the condenser of the heat pipe into the is known Collecting tube (European Publication No. 0055478), with good heat transfer is achieved.

The problem of exchangeability of the heat pipe without opening the circuit, as well as the problem of thermal expansion are not solved.

The invention is based on the object of a connection between a heat-emitting or heat-absorbing first component (e.g. a heat pipe) and to create a working medium - which has good thermal conductivity, so that only small temperature differences between the first component during operation (Heat pipe) and the working medium occur, - the individual heat pipes without Opening of the working cycle can be exchanged and - with thermal expansions in the manifold (or similar constructions) at working temperature or idling temperature be absorbed elastically.

The object is achieved according to the invention by those mentioned in claim 1 Characteristics.

Advantageous designs and manufacturing processes are objects of subclaims.

The thermally conductive connection according to the invention combines the advantages the high thermal conductivity of a liquid, the easy interchangeability individual components, universal applicability and automatic compensation the thermal expansion in itself.

The production is inexpensive because of the well-known components and manufacturing processes can be used. There are no special requirements for the sealing of the sleeve posed because the solder is solid at low temperatures and at working temperatures has a high viscosity.

The elastic seal and the liquid solder allow in addition to the Relative movement of the heat-emitting component to the heat collector in all three directions also a rotation or tilting by a certain angular amount.

This also prevents stress cracks in long manifolds. Expansion compensation elements can be dispensed with. In the application for solar collectors large collector areas of up to approx. 25 m2 on a single manifold to be ordered.

To replace individual heat pipes, the circuit of the working medium cannot be opened. The heating of the corresponding heat pipe is sufficient Working temperature, provided the solder is liquid in this temperature range, or to its melting temperature (heating without Energy consumption) and Unscrew the sleeve.

In addition to the application to heat pipe solar collectors in the exemplary embodiments is described in more detail, the invention can also be used in other areas, where it is important to transmit a high heat flux density. This applies to the Use of process heat in water desalination, in water treatment direct evaporation of various liquids, in the case of medical sterilization Devices and for cooling heat engines or systems.

Further advantages, features and designs result from the figures described below.

Figures 1 to 4 show different embodiments of the invention Link.

Figure 1 shows a connection according to the invention between a heat pipe 1, which consists of a collector part 2 and a condenser part 3 and a working medium 4, e.g. B.

Water, which is located in a container 5. The container 5 can e.g. be a boiler or a manifold.

A sleeve 6 open on both sides extends through the container 5 and is firmly connected to it by common processes such as welding or soldering. The sleeve is closed with screw caps 7, 8 at the top and bottom. The lower screw cap 8th has a central bore 9 with a seal 10 (e.g. an O-Rig) through which the capacitor part 3 is inserted. In the upper part of the sleeve 6 there is a spring 11, a lid 12 and a measured amount of solder 13.

To start up, the heat pipe 1 is heated. The condenser part 3 causes solder 13 to melt.

The solder 13 flows into the air gap 14 between the capacitor 3 and Sleeve 6 and provides an intimate, good heat-conducting contact between the two surfaces here. Spring 11 and cover 12 ^ ensure that the gap 14 is completely separated from the solder benett is.

In the case of a version with an inclined or vertical heat pipe the spring 11 or the cover 12 is not necessary. Then gravity is enough - possibly supported by the capillary force - for distributing the solder.

Re-measuring the distance between cover 12 and capacitor 3 at the same time results in a control of the functionality of the heat pipe.

Figure 2 shows an embodiment with a closed sleeve 6a.

This design is chosen when the container 5 is much deeper ls the condenser 3 of the heat pipe 1 is.

Like FIG. 2, FIG. 3 shows an embodiment with a closed sleeve 6a.! The sleeve 6a is here with a flexible one Seal 15 for Container 5 closed. Thermal expansion of the container 5 can be caused by angular movements (i) the sleeve 6a or caught by relative movements between the sleeve 6a and the container 5 will.

In Figures 1 to 3, the filling state is before commissioning shown, the solder has not yet melted.

FIG. 4 shows an embodiment in the operating state with molten Lot 13. In this embodiment, an open sleeve 6b with a flexible seal is used 16 used between the screw cap 8a and the sleeve 6b.

Thermal expansions, e.g. of the container 5, can be caused by angular movements of the capacitor 3 or by relative movements between the capacitor 3 and the sleeve 6b are caught.

In this embodiment, the solder 13 must be liquid at working temperature be to the desired mobility (three directions of translation and the tilt to reach the angle &).

In the embodiment shown in Figure 3, the solder can at operating temperature be firm, but it must have been heated so high that it clears the gap 14 completely wetted.

The heat pipe can be replaced by heating up the collector (without heat consumption) or by heating up outside. Included heat is applied from top to bottom on the sleeve and after the melting process the capacitor pulled down.

- blank page - -

Claims (8)

Claims: Heat Thermally conductive connection between a heat-emitting or heat-absorbing first component and a working medium, wherein the first component can be exchanged without opening the working cycle, characterized in that that the first component (1, 3) is elastically sealed in a sleeve (6) in the working medium (4) and the gap (14) between the sleeve (6) and the first component (1, 3) with a Lot (13) is filled. 2. A compound according to claim 1, characterized in that a sleeve (6a) which is closed on one side and engages in the working medium (14) is connected to the container (5). 3. A compound according to claim 1, characterized in that a sleeve (6) open on both sides: which passes through the container (5) for the working medium (4), is firmly connected to the container (5). 4. A compound according to any one of claims 1 to 3, characterized in that that instead of the solder another, thermally conductive and in the range of the working temperature melting material is used. 5. A method for producing a compound according to any one of the claims 1 to 4, characterized in that the soldering is carried out by running in automatically of the solder from above or by heating the sleeve and pressing it in. 6. A compound according to any one of claims 1 to 4, characterized in that that a spring (11) and a cover (12) are provided for automatic soldering, which press a measured amount of solder (13) into the gap (14) when heated. 7. A compound according to any one of claims 1 to 6, characterized in that that to compensate for thermal expansion or angular displacements (oC) a flexible Sealing (16) is provided between the first component (1, 3) and the sleeve (6b) is. 8. A compound according to any one of claims 1 to 7, characterized in that that to compensate for thermal expansion or angular displacements (6) a flexible Sealing (15) is provided between the sleeve (6a) and the container (5).