DE3279662D1 - Triple diffused short channel device structure - Google Patents
Triple diffused short channel device structureInfo
- Publication number
- DE3279662D1 DE3279662D1 DE8282112060T DE3279662T DE3279662D1 DE 3279662 D1 DE3279662 D1 DE 3279662D1 DE 8282112060 T DE8282112060 T DE 8282112060T DE 3279662 T DE3279662 T DE 3279662T DE 3279662 D1 DE3279662 D1 DE 3279662D1
- Authority
- DE
- Germany
- Prior art keywords
- device structure
- channel device
- short channel
- triple diffused
- diffused
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
- H01L29/66598—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET forming drain [D] and lightly doped drain [LDD] simultaneously, e.g. using implantation through the wings a T-shaped layer, or through a specially shaped layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1041—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface
- H01L29/1045—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface the doping structure being parallel to the channel length, e.g. DMOS like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1083—Substrate region of field-effect devices of field-effect transistors with insulated gate with an inactive supplementary region, e.g. for preventing punch-through, improving capacity effect or leakage current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33560881A | 1981-12-30 | 1981-12-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3279662D1 true DE3279662D1 (en) | 1989-06-01 |
Family
ID=23312490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282112060T Expired DE3279662D1 (en) | 1981-12-30 | 1982-12-28 | Triple diffused short channel device structure |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0083447B1 (de) |
JP (1) | JPS58147074A (de) |
CA (1) | CA1193758A (de) |
DE (1) | DE3279662D1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1214615B (it) * | 1985-06-19 | 1990-01-18 | Ates Componenti Elettron | Transistore mos a canale n con limitazione dell'effetto di perforazione (punch-through) erelativo processo di formazione. |
US4649629A (en) * | 1985-07-29 | 1987-03-17 | Thomson Components - Mostek Corp. | Method of late programming a read only memory |
JPH0789587B2 (ja) * | 1985-12-27 | 1995-09-27 | 株式会社東芝 | 絶縁ゲート型電界効果トランジスタおよびその製造方法 |
JPH0758776B2 (ja) * | 1986-08-22 | 1995-06-21 | 株式会社日立製作所 | 複合半導体装置 |
US4682404A (en) * | 1986-10-23 | 1987-07-28 | Ncr Corporation | MOSFET process using implantation through silicon |
KR930011031B1 (ko) * | 1990-06-30 | 1993-11-19 | 금성일렉트론 주식회사 | Ldd 제조방법 및 구조 |
US5401994A (en) * | 1991-05-21 | 1995-03-28 | Sharp Kabushiki Kaisha | Semiconductor device with a non-uniformly doped channel |
US5244823A (en) * | 1991-05-21 | 1993-09-14 | Sharp Kabushiki Kaisha | Process for fabricating a semiconductor device |
JP2633104B2 (ja) * | 1991-05-21 | 1997-07-23 | シャープ株式会社 | 半導体装置の製造方法 |
US5744372A (en) * | 1995-04-12 | 1998-04-28 | National Semiconductor Corporation | Fabrication of complementary field-effect transistors each having multi-part channel |
US6127700A (en) * | 1995-09-12 | 2000-10-03 | National Semiconductor Corporation | Field-effect transistor having local threshold-adjust doping |
US7145191B1 (en) | 2000-03-31 | 2006-12-05 | National Semiconductor Corporation | P-channel field-effect transistor with reduced junction capacitance |
US6797576B1 (en) | 2000-03-31 | 2004-09-28 | National Semiconductor Corporation | Fabrication of p-channel field-effect transistor for reducing junction capacitance |
US6566204B1 (en) | 2000-03-31 | 2003-05-20 | National Semiconductor Corporation | Use of mask shadowing and angled implantation in fabricating asymmetrical field-effect transistors |
US6548842B1 (en) | 2000-03-31 | 2003-04-15 | National Semiconductor Corporation | Field-effect transistor for alleviating short-channel effects |
JP2001284540A (ja) * | 2000-04-03 | 2001-10-12 | Nec Corp | 半導体装置およびその製造方法 |
US8084827B2 (en) | 2009-03-27 | 2011-12-27 | National Semiconductor Corporation | Structure and fabrication of like-polarity field-effect transistors having different configurations of source/drain extensions, halo pockets, and gate dielectric thicknesses |
US8410549B2 (en) | 2009-03-27 | 2013-04-02 | National Semiconductor Corporation | Structure and fabrication of field-effect transistor using empty well in combination with source/drain extensions or/and halo pocket |
US8163619B2 (en) | 2009-03-27 | 2012-04-24 | National Semiconductor Corporation | Fabrication of semiconductor structure having asymmetric field-effect transistor with tailored pocket portion along source/drain zone |
US8304835B2 (en) | 2009-03-27 | 2012-11-06 | National Semiconductor Corporation | Configuration and fabrication of semiconductor structure using empty and filled wells |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3959025A (en) * | 1974-05-01 | 1976-05-25 | Rca Corporation | Method of making an insulated gate field effect transistor |
DE2703877C2 (de) * | 1977-01-31 | 1982-06-03 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | MIS-Transistor von kurzer Kanallänge und Verfahren zu seiner Herstellung |
JPS53112069A (en) * | 1977-03-11 | 1978-09-30 | Nippon Telegr & Teleph Corp <Ntt> | Production of mis transistor |
JPS54136276A (en) * | 1978-04-14 | 1979-10-23 | Agency Of Ind Science & Technol | Manufacture for semiconductor device |
US4198250A (en) * | 1979-02-05 | 1980-04-15 | Intel Corporation | Shadow masking process for forming source and drain regions for field-effect transistors and like regions |
US4376947A (en) * | 1979-09-04 | 1983-03-15 | Texas Instruments Incorporated | Electrically programmable floating gate semiconductor memory device |
-
1982
- 1982-12-28 DE DE8282112060T patent/DE3279662D1/de not_active Expired
- 1982-12-28 EP EP19820112060 patent/EP0083447B1/de not_active Expired
- 1982-12-29 CA CA000418700A patent/CA1193758A/en not_active Expired
- 1982-12-30 JP JP23492982A patent/JPS58147074A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58147074A (ja) | 1983-09-01 |
EP0083447A3 (en) | 1985-03-13 |
JPH0459774B2 (de) | 1992-09-24 |
CA1193758A (en) | 1985-09-17 |
EP0083447A2 (de) | 1983-07-13 |
EP0083447B1 (de) | 1989-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SGS-THOMSON MICROELECTRONICS, INC. (N.D.GES.DES ST |
|
8328 | Change in the person/name/address of the agent |
Free format text: JOCHEM, B., DIPL.-WIRTSCH.-ING., PAT.-ANW., 60323 FRANKFURT |
|
8339 | Ceased/non-payment of the annual fee |