DE3279450D1 - Semiconductor device having conductor lines connecting the elements - Google Patents

Semiconductor device having conductor lines connecting the elements

Info

Publication number
DE3279450D1
DE3279450D1 DE8282306124T DE3279450T DE3279450D1 DE 3279450 D1 DE3279450 D1 DE 3279450D1 DE 8282306124 T DE8282306124 T DE 8282306124T DE 3279450 T DE3279450 T DE 3279450T DE 3279450 D1 DE3279450 D1 DE 3279450D1
Authority
DE
Germany
Prior art keywords
elements
semiconductor device
lines connecting
conductor lines
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282306124T
Other languages
English (en)
Inventor
Masayoshi Kimoto
Yasuhiko Mafune
Yasuhisa Sugo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3279450D1 publication Critical patent/DE3279450D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/763—Polycrystalline semiconductor regions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Element Separation (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE8282306124T 1981-11-20 1982-11-17 Semiconductor device having conductor lines connecting the elements Expired DE3279450D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18652881A JPS58105551A (ja) 1981-11-20 1981-11-20 半導体装置

Publications (1)

Publication Number Publication Date
DE3279450D1 true DE3279450D1 (en) 1989-03-16

Family

ID=16190067

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282306124T Expired DE3279450D1 (en) 1981-11-20 1982-11-17 Semiconductor device having conductor lines connecting the elements

Country Status (4)

Country Link
EP (1) EP0086915B1 (de)
JP (1) JPS58105551A (de)
DE (1) DE3279450D1 (de)
IE (1) IE54372B1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63248147A (ja) * 1987-04-03 1988-10-14 Sony Corp 半導体装置
JPS6467945A (en) * 1987-09-08 1989-03-14 Mitsubishi Electric Corp Wiring layer formed on buried dielectric and manufacture thereof
US5254491A (en) * 1991-09-23 1993-10-19 Motorola, Inc. Method of making a semiconductor device having improved frequency response
US5457068A (en) * 1992-11-30 1995-10-10 Texas Instruments Incorporated Monolithic integration of microwave silicon devices and low loss transmission lines

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4187516A (en) * 1972-04-10 1980-02-05 Raytheon Company Semiconductor integrated circuits
US4032373A (en) * 1975-10-01 1977-06-28 Ncr Corporation Method of manufacturing dielectrically isolated semiconductive device
US4037306A (en) * 1975-10-02 1977-07-26 Motorola, Inc. Integrated circuit and method
JPS5373972A (en) * 1976-12-14 1978-06-30 Matsushita Electric Ind Co Ltd Manufacture for semiconductor device
JPS5468178A (en) * 1977-11-11 1979-06-01 Fujitsu Ltd Wiring construction of integrated circuit
JPS55113343A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Manufacture of semiconductor device
US4255207A (en) * 1979-04-09 1981-03-10 Harris Corporation Fabrication of isolated regions for use in self-aligning device process utilizing selective oxidation
JPS6024585B2 (ja) * 1979-08-31 1985-06-13 大同特殊鋼株式会社 クラツド材の製造方法
JPS56146247A (en) * 1980-03-25 1981-11-13 Fujitsu Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
IE54372B1 (en) 1989-09-13
EP0086915A2 (de) 1983-08-31
IE822754L (en) 1983-05-20
EP0086915A3 (en) 1985-12-18
EP0086915B1 (de) 1989-02-08
JPS58105551A (ja) 1983-06-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee