DE3275683D1 - Method for inspecting integrated circuit chips - Google Patents

Method for inspecting integrated circuit chips

Info

Publication number
DE3275683D1
DE3275683D1 DE8282103180T DE3275683T DE3275683D1 DE 3275683 D1 DE3275683 D1 DE 3275683D1 DE 8282103180 T DE8282103180 T DE 8282103180T DE 3275683 T DE3275683 T DE 3275683T DE 3275683 D1 DE3275683 D1 DE 3275683D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit chips
inspecting integrated
inspecting
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282103180T
Other languages
English (en)
Inventor
David Perry Fouts
Jasvir Singh Jaspal
Walden Bennet Roush
Michael James Sullivan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3275683D1 publication Critical patent/DE3275683D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE8282103180T 1981-06-10 1982-04-15 Method for inspecting integrated circuit chips Expired DE3275683D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27242181A 1981-06-10 1981-06-10

Publications (1)

Publication Number Publication Date
DE3275683D1 true DE3275683D1 (en) 1987-04-16

Family

ID=23039730

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282103180T Expired DE3275683D1 (en) 1981-06-10 1982-04-15 Method for inspecting integrated circuit chips

Country Status (3)

Country Link
EP (1) EP0066694B1 (de)
JP (1) JPS57204141A (de)
DE (1) DE3275683D1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634027B2 (ja) * 1983-05-25 1994-05-02 パウ ルイ 集積回路又はプリント回路のような電気的装置の検査方法
JPH061164B2 (ja) * 1985-01-31 1994-01-05 伍良 松本 立体形状測定装置
KR910006367B1 (ko) * 1987-07-09 1991-08-21 스미도모덴기고오교오 가부시기가이샤 칩고정테이프
FR2706032B1 (fr) * 1993-06-01 1995-07-07 Commissariat Energie Atomique Procédé et dispositif de contrôle de la conformité de billes d'hybridation.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4725973U (de) * 1971-04-20 1972-11-24
DE2230277A1 (de) * 1972-06-21 1974-01-10 Basf Farben & Fasern Vorrichtung und verfahren zur quantitativen beurteilung der oberflaechenbeschaffenheit
DE2439988A1 (de) * 1974-08-21 1976-03-04 Ford Werke Ag Verfahren und vorrichtung zur ermittlung von oertlich begrenzten formfehlern an gewoelbten flaechen
JPS5278467A (en) * 1975-12-25 1977-07-01 Agency Of Ind Science & Technol Method of determining reference points for measurement of configuratio n
DE2719696A1 (de) * 1977-05-03 1978-11-09 Roswith Dr Med Ostertag Verfahren und vorrichtung zur vermessung der oberflaeche eines beliebig geformten koerpers

Also Published As

Publication number Publication date
JPS57204141A (en) 1982-12-14
EP0066694A3 (en) 1984-09-05
EP0066694A2 (de) 1982-12-15
EP0066694B1 (de) 1987-03-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee