DE3172253D1 - Method for the galvanic manufacture of whiskers and apparatus for carrying out this method - Google Patents
Method for the galvanic manufacture of whiskers and apparatus for carrying out this methodInfo
- Publication number
- DE3172253D1 DE3172253D1 DE8181108986T DE3172253T DE3172253D1 DE 3172253 D1 DE3172253 D1 DE 3172253D1 DE 8181108986 T DE8181108986 T DE 8181108986T DE 3172253 T DE3172253 T DE 3172253T DE 3172253 D1 DE3172253 D1 DE 3172253D1
- Authority
- DE
- Germany
- Prior art keywords
- whiskers
- carrying
- galvanic
- manufacture
- galvanic manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21966080A | 1980-12-24 | 1980-12-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3172253D1 true DE3172253D1 (en) | 1985-10-17 |
Family
ID=22820192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8181108986T Expired DE3172253D1 (en) | 1980-12-24 | 1981-10-27 | Method for the galvanic manufacture of whiskers and apparatus for carrying out this method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0054695B1 (de) |
JP (1) | JPS57110690A (de) |
DE (1) | DE3172253D1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5185073A (en) * | 1988-06-21 | 1993-02-09 | International Business Machines Corporation | Method of fabricating nendritic materials |
US5137461A (en) * | 1988-06-21 | 1992-08-11 | International Business Machines Corporation | Separable electrical connection technology |
CA2110472C (en) | 1993-03-01 | 1999-08-10 | Anilkumar Chinuprasad Bhatt | Method and apparatus for in-situ testing of integrated circuit chips |
AU3765097A (en) * | 1997-08-08 | 1999-03-01 | Vladimir Dvorak | Method of electrodeposition of metallic layers and equipment for implementing this method |
DE102005011298A1 (de) | 2005-03-04 | 2006-09-07 | Gebr. Schmid Gmbh & Co. | Vorrichtung und Verfahren zum Ätzen von Substraten |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2854387A (en) * | 1955-11-21 | 1958-09-30 | Philco Corp | Method of jet plating |
DE2504780A1 (de) * | 1975-02-05 | 1976-08-19 | Siemens Ag | Verfahren und vorrichtung zur spruehgalvanisierung |
FR2381567A1 (fr) * | 1977-02-24 | 1978-09-22 | Fmc Corp | Dispositif d'electrolyse par projection |
IT1112620B (it) * | 1977-04-15 | 1986-01-20 | Ibm | Connettore elettrico perfezionato |
-
1981
- 1981-09-18 JP JP56146424A patent/JPS57110690A/ja active Pending
- 1981-10-27 EP EP81108986A patent/EP0054695B1/de not_active Expired
- 1981-10-27 DE DE8181108986T patent/DE3172253D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57110690A (en) | 1982-07-09 |
EP0054695B1 (de) | 1985-09-11 |
EP0054695A1 (de) | 1982-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |