DE3164131D1 - Encapsulating housing resistant against high external pressures for a hybrid circuit - Google Patents

Encapsulating housing resistant against high external pressures for a hybrid circuit

Info

Publication number
DE3164131D1
DE3164131D1 DE8181400904T DE3164131T DE3164131D1 DE 3164131 D1 DE3164131 D1 DE 3164131D1 DE 8181400904 T DE8181400904 T DE 8181400904T DE 3164131 T DE3164131 T DE 3164131T DE 3164131 D1 DE3164131 D1 DE 3164131D1
Authority
DE
Germany
Prior art keywords
hybrid circuit
against high
high external
encapsulating housing
resistant against
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181400904T
Other languages
German (de)
English (en)
Inventor
Ny Jacques Le
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3164131D1 publication Critical patent/DE3164131D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W76/157—
    • H10W76/18—
    • H10W76/60—
    • H10W72/5449—
DE8181400904T 1980-06-19 1981-06-05 Encapsulating housing resistant against high external pressures for a hybrid circuit Expired DE3164131D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8013596A FR2485262A1 (fr) 1980-06-19 1980-06-19 Boitier d'encapsulation resistant a de fortes pressions externes

Publications (1)

Publication Number Publication Date
DE3164131D1 true DE3164131D1 (en) 1984-07-19

Family

ID=9243259

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181400904T Expired DE3164131D1 (en) 1980-06-19 1981-06-05 Encapsulating housing resistant against high external pressures for a hybrid circuit

Country Status (4)

Country Link
US (1) US4518818A (enExample)
EP (1) EP0044755B1 (enExample)
DE (1) DE3164131D1 (enExample)
FR (1) FR2485262A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2591801B1 (fr) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut Boitier d'encapsulation d'un circuit electronique
FR2688629A1 (fr) * 1992-03-10 1993-09-17 Thomson Csf Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices.
FR2709020B1 (fr) * 1993-08-13 1995-09-08 Thomson Csf Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant.
FR2719967B1 (fr) * 1994-05-10 1996-06-07 Thomson Csf Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés.
FR2802706B1 (fr) * 1999-12-15 2002-03-01 3D Plus Sa Procede et dispositif d'interconnexion en trois dimensions de composants electroniques
FR2832136B1 (fr) * 2001-11-09 2005-02-18 3D Plus Sa Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte
FR2875672B1 (fr) * 2004-09-21 2007-05-11 3D Plus Sa Sa Dispositif electronique avec repartiteur de chaleur integre
FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
FR2894070B1 (fr) * 2005-11-30 2008-04-11 3D Plus Sa Sa Module electronique 3d
FR2895568B1 (fr) * 2005-12-23 2008-02-08 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2905198B1 (fr) * 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2911995B1 (fr) * 2007-01-30 2009-03-06 3D Plus Sa Sa Procede d'interconnexion de tranches electroniques
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
FR2943176B1 (fr) 2009-03-10 2011-08-05 3D Plus Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
US3436775A (en) * 1966-12-28 1969-04-08 Arthur J Schlosser Deep submersible instrumentation package assembly
US3450082A (en) * 1968-01-29 1969-06-17 Ppg Industries Inc Load-bearing member for curved ceramic segments subjected to high compressive loads
DE1764263A1 (de) * 1968-05-06 1971-06-16 Siemens Ag Gut waermeableitendes Flachgehaeuse fuer Halbleitersysteme
CA1032276A (en) * 1973-12-03 1978-05-30 Andrew Koutalides Package for semiconductor beam lead devices
US4208698A (en) * 1977-10-26 1980-06-17 Ilc Data Device Corporation Novel hybrid packaging scheme for high density component circuits

Also Published As

Publication number Publication date
FR2485262B1 (enExample) 1984-10-26
EP0044755A3 (en) 1982-02-10
EP0044755B1 (fr) 1984-06-13
EP0044755A2 (fr) 1982-01-27
US4518818A (en) 1985-05-21
FR2485262A1 (fr) 1981-12-24

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee