DE3162978D1 - Monolithic ampliflier comprising a power dividing and combining system containing a plurality of transistors - Google Patents

Monolithic ampliflier comprising a power dividing and combining system containing a plurality of transistors

Info

Publication number
DE3162978D1
DE3162978D1 DE8181401336T DE3162978T DE3162978D1 DE 3162978 D1 DE3162978 D1 DE 3162978D1 DE 8181401336 T DE8181401336 T DE 8181401336T DE 3162978 T DE3162978 T DE 3162978T DE 3162978 D1 DE3162978 D1 DE 3162978D1
Authority
DE
Germany
Prior art keywords
ampliflier
monolithic
transistors
system containing
power dividing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181401336T
Other languages
English (en)
Inventor
Alain Bert
Didier Kaminsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3162978D1 publication Critical patent/DE3162978D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/08—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
    • H03F1/18—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of distributed coupling, i.e. distributed amplifiers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/34—DC amplifiers in which all stages are DC-coupled
    • H03F3/343—DC amplifiers in which all stages are DC-coupled with semiconductor devices only
    • H03F3/347—DC amplifiers in which all stages are DC-coupled with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Microwave Amplifiers (AREA)
  • Amplifiers (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Junction Field-Effect Transistors (AREA)
DE8181401336T 1980-09-02 1981-08-25 Monolithic ampliflier comprising a power dividing and combining system containing a plurality of transistors Expired DE3162978D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8018926A FR2489624B1 (fr) 1980-09-02 1980-09-02 Amplificateur monolithique comportant un systeme de division et de recombinaison de puissance groupant plusieurs transistors

Publications (1)

Publication Number Publication Date
DE3162978D1 true DE3162978D1 (en) 1984-05-10

Family

ID=9245570

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181401336T Expired DE3162978D1 (en) 1980-09-02 1981-08-25 Monolithic ampliflier comprising a power dividing and combining system containing a plurality of transistors

Country Status (5)

Country Link
US (1) US4430623A (de)
EP (1) EP0047690B1 (de)
JP (1) JPS5776907A (de)
DE (1) DE3162978D1 (de)
FR (1) FR2489624B1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684965A (en) * 1983-05-09 1987-08-04 Raytheon Company Monolithic programmable attenuator
JPS63164504A (ja) * 1986-12-25 1988-07-07 A T R Koudenpa Tsushin Kenkyusho:Kk 半導体装置
JPS63197346A (ja) * 1987-02-12 1988-08-16 Hitachi Ltd 高周波半導体装置
JPS63309001A (ja) * 1987-06-10 1988-12-16 A T R Koudenpa Tsushin Kenkyusho:Kk マイクロ波集積回路装置
JPH01204477A (ja) * 1988-02-09 1989-08-17 Nec Corp 電界効果型超高周波半導体装置
KR100381685B1 (ko) * 1994-08-15 2003-07-10 텍사스 인스트루먼츠 인코포레이티드 리액티브보상전력트랜지스터회로
US6265937B1 (en) 1994-09-26 2001-07-24 Endgate Corporation Push-pull amplifier with dual coplanar transmission line
US5528203A (en) * 1994-09-26 1996-06-18 Endgate Corporation Coplanar waveguide-mounted flip chip
US5623231A (en) * 1994-09-26 1997-04-22 Endgate Corporation Push-pull power amplifier
US5698469A (en) * 1994-09-26 1997-12-16 Endgate Corporation Method of making a hybrid circuit with a chip having active devices with extra-chip interconnections
US5942957A (en) * 1994-09-26 1999-08-24 Endgate Corporation Flip-mounted impedance
JP3515886B2 (ja) * 1997-09-29 2004-04-05 三菱電機株式会社 半導体装置およびその製造方法
CN101662061A (zh) * 2009-09-25 2010-03-03 华南理工大学 平面空间功率分配/合成放大器
RU2573195C1 (ru) * 2014-09-23 2016-01-20 Акционерное общество Центральное конструкторское бюро аппаратостроения (АО ЦКБА) Малошумящий приемно-усилительный модуль

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1235473A (en) * 1967-06-21 1971-06-16 Texas Instruments Ltd Amplifiers
US4023198A (en) * 1974-08-16 1977-05-10 Motorola, Inc. High frequency, high power semiconductor package
US3969745A (en) * 1974-09-18 1976-07-13 Texas Instruments Incorporated Interconnection in multi element planar structures
US3967218A (en) * 1975-09-26 1976-06-29 The United States Of America As Represented By The Secretary Of The Army Edge-guided wave directional combiner

Also Published As

Publication number Publication date
FR2489624B1 (fr) 1985-06-14
US4430623A (en) 1984-02-07
FR2489624A1 (fr) 1982-03-05
EP0047690B1 (de) 1984-04-04
EP0047690A1 (de) 1982-03-17
JPH0161244B2 (de) 1989-12-27
JPS5776907A (en) 1982-05-14

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