DE3162833D1 - Automatic machine for bending the connection leads for integrated-circuit chips - Google Patents

Automatic machine for bending the connection leads for integrated-circuit chips

Info

Publication number
DE3162833D1
DE3162833D1 DE8181401867T DE3162833T DE3162833D1 DE 3162833 D1 DE3162833 D1 DE 3162833D1 DE 8181401867 T DE8181401867 T DE 8181401867T DE 3162833 T DE3162833 T DE 3162833T DE 3162833 D1 DE3162833 D1 DE 3162833D1
Authority
DE
Germany
Prior art keywords
bending
integrated
automatic machine
circuit chips
connection leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181401867T
Other languages
English (en)
Inventor
Raymond Delorme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CII HONEYWELL BULL
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Application granted granted Critical
Publication of DE3162833D1 publication Critical patent/DE3162833D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/023—Feeding of components with bending or straightening of the terminal leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)
DE8181401867T 1980-12-05 1981-11-25 Automatic machine for bending the connection leads for integrated-circuit chips Expired DE3162833D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8025856A FR2495836A1 (fr) 1980-12-05 1980-12-05 Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres

Publications (1)

Publication Number Publication Date
DE3162833D1 true DE3162833D1 (en) 1984-04-26

Family

ID=9248714

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181401867T Expired DE3162833D1 (en) 1980-12-05 1981-11-25 Automatic machine for bending the connection leads for integrated-circuit chips

Country Status (5)

Country Link
US (1) US4411149A (de)
EP (1) EP0053966B1 (de)
JP (1) JPS57120347A (de)
DE (1) DE3162833D1 (de)
FR (1) FR2495836A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620572A (en) * 1985-06-14 1986-11-04 International Business Machines Corporation Radial reform head
JPS6320846A (ja) * 1986-07-15 1988-01-28 Shinkawa Ltd 外部リ−ド接合装置
US4803540A (en) * 1986-11-24 1989-02-07 American Telephone And Telegraph Co., At&T Bell Labs Semiconductor integrated circuit packages
US4877174A (en) * 1988-12-21 1989-10-31 International Business Machines Corporation Tab device excise and lead form apparatus
US5057907A (en) * 1990-06-11 1991-10-15 National Semiconductor Corp. Method and structure for forming vertical semiconductor interconnection
US5673845A (en) * 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
US5890644A (en) 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US8870051B2 (en) 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
US10418172B2 (en) * 2016-12-07 2019-09-17 Astec International Limited Methods of forming coils for inductive components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
DE2223345C3 (de) * 1972-05-12 1979-03-29 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Bestückung eines Bauelementeträgers und Vorrichtung zur Durchfuhrung des Verfahrens
FR2205800B1 (de) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
US4010885A (en) * 1974-09-30 1977-03-08 The Jade Corporation Apparatus for accurately bonding leads to a semi-conductor die or the like
US3949925A (en) * 1974-10-03 1976-04-13 The Jade Corporation Outer lead bonder
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
US4099660A (en) * 1975-10-31 1978-07-11 National Semiconductor Corporation Apparatus for and method of shaping interconnect leads
FR2379909A1 (fr) * 1977-02-04 1978-09-01 Cii Honeywell Bull Procede et appareil de montage de dispositifs sur un substrat
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices

Also Published As

Publication number Publication date
EP0053966A1 (de) 1982-06-16
JPS57120347A (en) 1982-07-27
US4411149A (en) 1983-10-25
FR2495836B1 (de) 1984-03-30
JPS6355779B2 (de) 1988-11-04
FR2495836A1 (fr) 1982-06-11
EP0053966B1 (de) 1984-03-21

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee