DE3144345C2 - Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards - Google Patents
Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boardsInfo
- Publication number
- DE3144345C2 DE3144345C2 DE19813144345 DE3144345A DE3144345C2 DE 3144345 C2 DE3144345 C2 DE 3144345C2 DE 19813144345 DE19813144345 DE 19813144345 DE 3144345 A DE3144345 A DE 3144345A DE 3144345 C2 DE3144345 C2 DE 3144345C2
- Authority
- DE
- Germany
- Prior art keywords
- mixture
- circuit boards
- printed circuit
- insulating varnish
- selective removal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
Abstract
Es wird ein Lösungsmittel sowie ein Verfahren zum flächigen und punktuellen Entfernen von Isolierlackschichten auf Leiterplatten vorgeschlagen. Das Lösungsmittel besteht aus einer Mischung von 50 ml N-Methyl-2-Pyrrolidon und 3 g Kieselsäure. Es wird auf die beschichtete Leiterplattenfläche aufgetragen und ca. eine Minute auf 70 bis 80 ° C erhitzt. Das abgekühlte Reaktionsprodukt läßt sich leicht mechanisch entfernen.A solvent and a method for the areal and punctiform removal of insulating lacquer layers on printed circuit boards are proposed. The solvent consists of a mixture of 50 ml of N-methyl-2-pyrrolidone and 3 g of silica. It is applied to the coated circuit board surface and heated to 70 to 80 ° C for about one minute. The cooled reaction product can easily be removed mechanically.
Description
a) Auftragen des Lösungsmittels auf die mit Isolierlack beschichtete Stelle der Leiicrplattcnfläche: a) Applying the solvent to the with insulating varnish coated area of the sheet metal surface:
b) Erwärmen der mit dem Gemisch benetzten Leiterplatienstelle auf 70 bis 8O0C. bis sich die Gemischschicht infolge chemischer Reaktion mit der Lackschicht zu einem weißen Belag verändert; b until the mixture layer changed) heating the wetted with the mixture Leiterplatienstelle to 70 to 8O 0 C. due to chemical reaction with the layer of lacquer to a white coating;
c) Abkühlen der Leiierplattenstclle und mechanisches Entfernen des entstandenen trockenen, folienartigen Belages.c) Cooling of the circuit board parts and mechanical Remove the resulting dry, film-like covering.
reagiert erst bei ausreichender Wärmezufuhr (Str.ihlungswäi mc oder induktive Wärme) mit dein Lcitcrplailenisiilicrlack. Optimale I aekablöse/.eiten werden bei einer Temperatur von 70 bis 80"C der Liickobcrfläche s erreicht. Hei dieser Temperatur werden die Bauelemente, das Basismaterial einschließlich Leiterbahnen und die unbeluindclte l-acksehichi nicht verändert oder zerstört. Die Reaktionszeit beträgt etwa eine Minute.only reacts when there is sufficient heat supply (Str.ihlungswäi mc or inductive heat) with your lcitcrplailenisiilicrlack. Optimal release / release times are achieved at a temperature of 70 to 80 "C of the lid surface s achieved. At this temperature the components the base material including conductor tracks and the unbeluindclte l-acksehichi are not changed or destroyed. The reaction time is about one minute.
Das Reaktionsende zeigt sich optisch durch die BiI-dung eines trockenen, weißen, folienariigcn Bckigs, der leicht mechanisch beseitigt werden kann. /.. B. durch Bürsten. Die sofortige Beseitigung des Reaktionsproduktes ist nicht erforderlich, da es chemisch inaktiv und nicht toxisch ist.The end of the reaction is shown optically by the formation of a dry, white, foil-like square that can easily be removed mechanically. / .. B. by brushing. The immediate disposal of the reaction product is not necessary because it is chemically inactive and non-toxic.
is Zum punktuellen sowie auch flächigen Entfernen von Isolierlackschichtcn eignen sich beide Verfahren nach Anspruch 3 und Anspruch 4.is For selective as well as extensive removal of Isolierlackschichtcn both methods according to claim 3 and claim 4 are suitable.
Sollen gleichzeitig mehrere Flächenteile einer Leiterplatte von der Isolierlackschicht befreit werden, so kann es zweckmäßig sein, zuerst die gesamte Leiterplatte zu erwärmen, um anschließend die ausgewählten Flächen mit dem Gemisch zu benetzen. Als Wärmequelle eignet sich in diesem Fall ein Wärmeofen.If several surface parts of a printed circuit board are to be freed from the insulating varnish layer at the same time, so can it may be useful to first cover the entire circuit board heat in order to then wet the selected areas with the mixture. Suitable as a heat source in this case a heating furnace.
Das Gemisch eignet sich für alle PUR- und EP-isolierlackbcschichtcten Leiterplatten. Es ist geruchsarm, nicht toxisch, nicht ätzend, verdunstungsarm und sparsam in der Anwendung.The mixture is suitable for all PUR and EP insulating varnish layers Printed circuit boards. It is low-odor, non-toxic, non-corrosive, low in evaporation and economical in the application.
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Verfahrenssehriite a) und b) vcr- jo tauscht sind.4. The method according to claim 3, characterized in that the process series a) and b) vcr- jo exchanges are.
Mit elektrischen Bauelementen bestückte Leiterplatten werden zum Schutz der Bauelemente sowie der gedruckten Verdrahtung mit Isolierlack überzogen. Bei nachträglicher Änderung oder Nachbesserung an lakk'erten Leiterplatten entstehen an ilen Eingriffsstcllcn nicht reparable Schäden (Zerstörung der Leiterplatte durch Lackzersetzung).Printed circuit boards equipped with electrical components are used to protect the components as well as the printed ones Wiring covered with insulating varnish. In the event of subsequent changes or repairs to lakk'erten Circuit boards result in irreparable damage at all points of engagement (destruction of the circuit board due to paint decomposition).
In Römps Chemie-Lexikon, 7. Auflage. 1975, Seite 2854 wird das 2-l'yrrolidon als Lösungsmittel beschrieben. Es ist auch allgemein bekannt, hochdisperse 4S Kieselsaure als Verdickungsmittel für organische Lo- «•'jr.gsrtiir.el /u verwenden.In Römps Chemie-Lexikon, 7th edition. 1975, p In 2854 2-l'yrrolidone is described as a solvent. It is also well known to use highly disperse 4S silica as a thickener for organic lo- «• Use 'jr.gsrtiir.el / u.
Der Erfindung liegt die Aufgabe zugrunde, ein Gemisch anzugeben, mit dem Isolierlackschichicn oder Teile davon auf Leiterplatten entfernt werden können, so ohne daß das Leiterplattenmaterial und die darauf befindlichen Bauelemente beschädigt werden. Ferner soll ein Verfahren angegeben werden, mit dem unter Verwendung des Gemisches kleine Lackflächen vorgebbarer Form von der Leiterplatte entfernt werden können, ssThe invention is based on the object of a mixture indicate with the insulating varnish layer or Parts of it on circuit boards can be removed without affecting the circuit board material and those on it Components are damaged. Furthermore, a method is to be specified with which using the mixture can be removed from the circuit board small lacquer areas of a predetermined shape, ss
Die Aufgabe wird erfindungsgemäß mit dem in Anspruch 1 angegebenen Gemisch und mit dem in Anspruch 3 angegebenen Verfahren gelöst.The object is according to the invention with the claim 1 specified mixture and solved with the method specified in claim 3.
Ein besonders vorteilhaft wirkendes Gemisch erhält man. wenn man 50 ml NMeihyl-2-Pyrrolidon mit 3 g w) Kieselsäure (SiO.') ν erdickt. Es entsteht eine durchsichtige gallertartige Substanz, die sich auch punkiuell in fein dosicrbarer Menge auf eine vorbesiimmie lackierte Reparaturstelle auftragen lü!5t Sie verbleibt auf benetzter Lackstelle und verläuft nicht in angrenzende Bereiche, ni Bei Raumtemperatur von 23°C verflüchtigt sich das Gemisch erst nach 12 bis 24 Stunden.A particularly advantageous mixture is obtained. if one 50 ml NMeihyl-2-pyrrolidone with 3 g w) Silicic acid (SiO. ') Ν thickened. A transparent one is created gelatinous substance, which can also sometimes be fine dosable amount on a previously painted repair area Apply lü! 5t It remains on the wetted paint area and does not run into adjacent areas, ni At room temperature of 23 ° C, the mixture only evaporates after 12 to 24 hours.
Das auf die Reparaturstelle aufgetragene GemischThe mixture applied to the repair site
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813144345 DE3144345C2 (en) | 1981-11-07 | 1981-11-07 | Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813144345 DE3144345C2 (en) | 1981-11-07 | 1981-11-07 | Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3144345A1 DE3144345A1 (en) | 1983-05-19 |
| DE3144345C2 true DE3144345C2 (en) | 1984-11-22 |
Family
ID=6145910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19813144345 Expired DE3144345C2 (en) | 1981-11-07 | 1981-11-07 | Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3144345C2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3630480A1 (en) * | 1986-09-08 | 1988-03-10 | Oskar Dr Wack | Process for improving the efficacy of a solvent |
| DE4003700A1 (en) * | 1989-07-11 | 1991-01-24 | Scheidel Georg Gmbh | PREPARATION FOR REMOVING COATINGS AND ADHESIVES |
| DE10107468C2 (en) * | 2000-03-27 | 2002-03-28 | Andreas Schlootz | Detergent to remove inclusions on tile surfaces |
-
1981
- 1981-11-07 DE DE19813144345 patent/DE3144345C2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3144345A1 (en) | 1983-05-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8125 | Change of the main classification |
Ipc: C11D 7/50 |
|
| 8181 | Inventor (new situation) |
Free format text: WIEDERHOLD, INGRID, 5628 HEILIGENHAUS, DE |
|
| 8181 | Inventor (new situation) |
Free format text: WIEDERHOLD, INGRID KOCKS, WERNER, 5628 HEILIGENHAUS, DE |
|
| D2 | Grant after examination | ||
| 8320 | Willingness to grant licences declared (paragraph 23) | ||
| 8380 | Miscellaneous part iii |
Free format text: BEIM ERFINDER IST ZU STREICHEN: "ANTRAG AUF TEILNICHTNENNUNG" |
|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |