DE3144345A1 - Solvent and method for removing insulating lacquer layers from the surface of and points on circuit boards - Google Patents

Solvent and method for removing insulating lacquer layers from the surface of and points on circuit boards

Info

Publication number
DE3144345A1
DE3144345A1 DE19813144345 DE3144345A DE3144345A1 DE 3144345 A1 DE3144345 A1 DE 3144345A1 DE 19813144345 DE19813144345 DE 19813144345 DE 3144345 A DE3144345 A DE 3144345A DE 3144345 A1 DE3144345 A1 DE 3144345A1
Authority
DE
Germany
Prior art keywords
solvent
circuit boards
circuit board
points
lacquer layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19813144345
Other languages
German (de)
Other versions
DE3144345C2 (en
Inventor
Werner 5628 Heiligenhaus Kocks
Ingrid Wiederhold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Training Center GmbH and Co KG
Original Assignee
Hartmann and Braun AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hartmann and Braun AG filed Critical Hartmann and Braun AG
Priority to DE19813144345 priority Critical patent/DE3144345C2/en
Publication of DE3144345A1 publication Critical patent/DE3144345A1/en
Application granted granted Critical
Publication of DE3144345C2 publication Critical patent/DE3144345C2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Abstract

A solvent and a method for removing insulating lacquer layers from the surface of and points on circuit boards is proposed. The solvent consists of a mixture of 50 ml of N-methyl-2-pyrrolidone and 3 g of silica. It is applied to the coated circuit board surface and heated for about one minute at 70 to 80 DEG C. The cooled reaction product can readily be removed mechanically.

Description

Lösungsmittel und Verfahren zum flächigen und punktuellenSolvent and method for flat and punctiform

Entfernen von Isolierlackschichten auf Leiterplatten Mit elektrischen Bauelementen bestückte Leiterplatten werden zum Schutz der Bauelemente sowie der gedruckten Verdrahtung mit Isolierlack überzogen. Bei nachträglicher Änderung oder Nachbesserung an lackierten Leiterplatten entstehen an den Eingriffs stellen nicht reparable Schäden (Zerstörung der Leiterplatte durch Lackzersetzung).Removal of insulating lacquer layers on printed circuit boards With electrical Printed circuit boards equipped with components are used to protect the components as well as the printed wiring covered with insulating varnish. In the event of a subsequent change or Improvements to coated circuit boards do not occur at the points of contact Repairable damage (destruction of the circuit board due to paint decomposition).

Die Aufgabe der Erfindung besteht darin, ein Lösungsmittel zum flächigen und punktuellen Entfernen von Isolierlackschichten auf Leiterplatten anzugeben. Ferner soll ein Verfahren angegeben werden, mit dem unter Verwendung des neuen Lösungsmittels kleine Lackflächen vorgebbarer Form von der Leiterplatte entfernt werden können.The object of the invention is to provide a solvent for flat and selective removal of insulating varnish layers on printed circuit boards. Furthermore, a method is to be specified with the use of the new solvent small lacquer areas of a predetermined shape can be removed from the circuit board.

Die Aufgabe wird erfindungsgemäß mit den in Anspruch 1 angegebenen Mitteln sowie mit dem im Anspruch 3 angegebenen Verfahren gelöst.The object is achieved according to the invention with those specified in claim 1 Means as well as solved with the method specified in claim 3.

Eine besonders vorteilhafte Mischung des Lösungsmittels erhält man, wenn man 50 ml N-Methyl-2-Pyrrolidon mit 3 g Kieselsäure (die) verdickt. Es entsteht eine durchsichtige gallertartige Substanz, die sich auch punktuell in fein dosierbarer Menge auf eine vorbestimmte lackierte Reparaturstelle auftragen läßt. Sie verbleibt auf benetzter Lackstelle und verläuft nicht in angrenzende Bereiche. Bei Raumtemperatur von 230C verflüchtigt sich das Lösungsmittel erst nach 12 - 24 Stunden.A particularly advantageous mixture of the solvent is obtained when 50 ml of N-methyl-2-pyrrolidone are thickened with 3 g of silica (die). It arises a transparent gel-like substance that can also be found in fine Can be applied dosed amount to a predetermined painted repair area. It remains on the wetted paint area and does not run into adjacent areas. At room temperature of 230C the solvent only evaporates after 12-24 Hours.

Das auf die Reparaturstelle aufgetragene Lösungsmittel reagiert erst bei ausreichender Wärmezufuhr (Strahlungswärmeoder induktive Wärme) mit dem Leiterplattenisolierlack. Optimale Lackablösezeiten werden bei einer Temperatur von 70 bis 800C der Lackoberfläche erreicht.The solvent applied to the repair site only reacts with sufficient heat supply (radiant heat or inductive heat) with the circuit board insulating varnish. Optimal paint removal times are at a temperature of 70 to 800C of the paint surface achieved.

Bei dieser Temperatur werden die Bauelemente, das Basismaterial einschließlich Leiterbahnen und die unbehandelte Lackschicht nicht verändert oder zerstört. Die Reaktionszeit beträgt etwa eine Minute.At this temperature the components, including the base material Conductor tracks and the untreated paint layer are not changed or destroyed. the Response time is about a minute.

Das Reaktionsende zeigt sich optisch durch die Bildung eines trockenen, weißen, folienartigen Belags, der leicht mechanisch beseitigt werden kann, z.B. durch Bürsten.The end of the reaction is shown visually by the formation of a dry, white, film-like coating that can easily be removed mechanically, e.g. by brushing.

Die sofortige Beseitigung des Reaktionsproduktes ist nicht erforderlich, da es chemisch inaktiv und nicht toxisch ist.The immediate removal of the reaction product is not necessary, because it is chemically inactive and non-toxic.

Zum punktuellen sowie auch flächigen Entfernen von Isolierlackschichten eignen sich beide Verfahren nach Anspruch 3 und Anspruch 4.For selective as well as extensive removal of layers of insulating varnish Both methods according to claim 3 and claim 4 are suitable.

Sollen gleichzeitig mehrere Flächenteile einer Leiterplatte von der Isolierlackschicht befreit werden, so kann es zweckmäßig sein, zuerst die gesamte Leiterplatte zu erwärmen, um anschließend die ausgewählten Flächen mit Lösungsmittel zu benetzen. Als Wärmequelle eignet sich in diesem Fall ein Wärmeofen.If several surface parts of a circuit board are to be removed from the If the insulating lacquer layer is to be freed, it may be useful to first apply the entire layer To heat the printed circuit board, then the selected areas with solvent to wet. A heating furnace is suitable as a heat source in this case.

Das Lösungsmittel eignet sich für alle PUR- und EP-isolierlackbeschichtete Leiterplatten. Es ist geruchsarm, nicht toxisch, nicht ätzend, verdunstungsarm und sparsam in der Anwendung.The solvent is suitable for all PUR and EP insulating lacquer coated Printed circuit boards. It is low in odor, non-toxic, non-corrosive, low in evaporation and economical to use.

Claims (4)

Patentansprüche: 1. Lösungsmittel zum flächigen und punktuellen Entfernen von Isolierlackschichten auf Le iterplatten, dadurch gekennzeichnet, daß es mit amorpher hoch dispersiver Kieselsäure (SiO2) verdicktes N-Methyl-2-Pyrrolidon (NMP) enthält.Claims: 1. Solvent for extensive and selective removal of insulating lacquer layers on circuit boards, characterized in that it is with amorphous highly dispersive silica (SiO2) thickened N-methyl-2-pyrrolidone (NMP) contains. 2. Lösungsmittel nach Anspruch 1, gekennzeichnet durch eine Mischung von 50 ml NMP und 3 g Kieselsäure.2. Solvent according to claim 1, characterized by a mixture of 50 ml of NMP and 3 g of silica. 3. Verfahren zum flächigen und punktuellen Entfernen von Isolierlackschichten auf Leiterplatten unter Verwendung eines Lösungsmittels nach Anspruch 1, gekennzeichnet durch folgende Verfahrensschritte: a) Auftragen des Lösungsmittels auf die mit Isolierlack beschichtete Stelle der Leiterplattenfläche; b) Erwärmen der mit dem Lösungsmittel benetzten Leiterplattenstelle auf 70 bis so0o, bis sich die Lösungsmittelschicht infolge chemischer Reaktion mit der Lackschicht zu einem weißen Belag verändert; c) Abkühlen der Leiterplattenstelle und mechanisches Entfernen des entstandenen trockenen, folienartigen Belages.3. Process for the extensive and selective removal of layers of insulating varnish on printed circuit boards using a solvent according to claim 1, characterized by the following process steps: a) Applying the solvent to the insulating varnish coated area of the circuit board surface; b) heating the with the solvent wetted circuit board point to 70 to so0o, until the solvent layer changed to a white coating as a result of chemical reaction with the paint layer; c) Cooling the circuit board location and mechanical removal of the resulting dry, film-like covering. 4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Verfahrensschritte a) und b) vertauscht sind.4. The method according to claim 3, characterized in that the method steps a) and b) are interchanged. 5-. Verfahren nach Anspruch 3 oder 4, dadurch gekennzeichnet, daß als Wärmequelle eine IR-Heizsonde verwendet wird.5-. Method according to claim 3 or 4, characterized in that an IR heating probe is used as the heat source.
DE19813144345 1981-11-07 1981-11-07 Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards Expired DE3144345C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813144345 DE3144345C2 (en) 1981-11-07 1981-11-07 Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813144345 DE3144345C2 (en) 1981-11-07 1981-11-07 Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards

Publications (2)

Publication Number Publication Date
DE3144345A1 true DE3144345A1 (en) 1983-05-19
DE3144345C2 DE3144345C2 (en) 1984-11-22

Family

ID=6145910

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813144345 Expired DE3144345C2 (en) 1981-11-07 1981-11-07 Mixture and method for the flat and selective removal of insulating varnish layers on printed circuit boards

Country Status (1)

Country Link
DE (1) DE3144345C2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630480A1 (en) * 1986-09-08 1988-03-10 Oskar Dr Wack Process for improving the efficacy of a solvent
DE4003700A1 (en) * 1989-07-11 1991-01-24 Scheidel Georg Gmbh PREPARATION FOR REMOVING COATINGS AND ADHESIVES
WO2001072945A1 (en) * 2000-03-27 2001-10-04 Andreas Schlootz Method for removing inclusions on surfaces of tiles and a means therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Römpp: Chemie-Lexikon, 7. Aufl., 1975, S. 2854 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630480A1 (en) * 1986-09-08 1988-03-10 Oskar Dr Wack Process for improving the efficacy of a solvent
DE4003700A1 (en) * 1989-07-11 1991-01-24 Scheidel Georg Gmbh PREPARATION FOR REMOVING COATINGS AND ADHESIVES
WO2001072945A1 (en) * 2000-03-27 2001-10-04 Andreas Schlootz Method for removing inclusions on surfaces of tiles and a means therefor

Also Published As

Publication number Publication date
DE3144345C2 (en) 1984-11-22

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: C11D 7/50

8181 Inventor (new situation)

Free format text: WIEDERHOLD, INGRID, 5628 HEILIGENHAUS, DE

8181 Inventor (new situation)

Free format text: WIEDERHOLD, INGRID KOCKS, WERNER, 5628 HEILIGENHAUS, DE

D2 Grant after examination
8320 Willingness to grant licences declared (paragraph 23)
8380 Miscellaneous part iii

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