DE19525708C1 - Temporary start-up protection for copper and copper alloys - Google Patents

Temporary start-up protection for copper and copper alloys

Info

Publication number
DE19525708C1
DE19525708C1 DE1995125708 DE19525708A DE19525708C1 DE 19525708 C1 DE19525708 C1 DE 19525708C1 DE 1995125708 DE1995125708 DE 1995125708 DE 19525708 A DE19525708 A DE 19525708A DE 19525708 C1 DE19525708 C1 DE 19525708C1
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
copper
temporary
up protection
start
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1995125708
Other languages
German (de)
Inventor
Juergen Dr Hauk
Karl-Heinz Huefftlein
Rainer Dr Schumacher
Geb Wartenberg Hardeweg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rmh Polymers & Co Kg 06258 Schkopau De GmbH
Rmh Polymers & Co KG GmbH
Original Assignee
Rmh Polymers & Co Kg 06258 Schkopau De GmbH
Rmh Polymers & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49579Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49586Insulating layers on lead frames
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04Homopolymers or copolymers of esters
    • C09D133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008Temporary coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

Die Erfindung betrifft einen temporären Anlaufschutz für Ober flächen von Bauteilen, Gegenständen aus Kupfer und Kupferle gierungen, die vorwiegend in der Elektrotechnik verwendet werden. The invention relates to a temporary start-up protection for the upper surfaces of components, objects alloys of copper and Kupferle, which are mainly used in electrical engineering.

Die Oberflächen von Bauteilen und Gegenständen aus Kupfer und Kupferlegierungen laufen unter Einwirkung der Atmosphäre durch oxidative Prozesse sehr schnell an. The surfaces of the components and objects of copper and copper alloys run under exposure to the atmosphere by oxidative processes very quickly. Vor ihrer Weiterverarbeitung müssen die Oberflächen wieder gereinigt werden. Before further processing the surfaces must be cleaned again. Es werden daher üblicherweise Schutzfolien aufgeklebt oder Überzüge auf Basis von Lacken und Wachsen als Anlaufschutz verwendet. There are glued or coatings based on varnishes and waxes used as start-up protection therefore usually protective films. Solche bekannten Überzüge weisen jedoch eine geringere mechanische Stabilität auf und zu ihrer Entfernung sind organische Lösungsmittel und ggf. mechanische Reinigungsschritte erforderlich. However, such known coatings have a lower mechanical stability and for its removal, if necessary, organic solvents and mechanical cleaning steps are required.

Bekannt ist auch die Verwendung wiederentfernbarer Schutzüber züge auf Basis synthetischer Polymere für Eisenmetalle in Form von Automobilkarosserien, Maschinen bzw. Maschinenteilen und Werkzeugen. the use is known wiederentfernbarer protective coatings on the basis of synthetic polymers for ferrous metals in the form of automobile bodies, machines or machine parts and tools. Die DE 31 51 372 A1 beschreibt für diese Zwecke wäßrige Emulsionen auf Basis von saure Gruppen enthaltenden Acrylpolymerisaten. DE 31 51 372 A1 discloses for this purpose aqueous emulsions based on acrylic polymers containing acidic groups. Nachteilig wirkt sich bei der Anwendung solcher Emulsionen der hohe Anteil an nicht wäßrigen Bestand teilen und die Verwendung korrosiver Polymerisationshilfstoffe bei ihrer Herstellung aus. A disadvantage is the high proportion affects share of non-aqueous ingredients and the use of corrosive Polymerisationshilfstoffe in their preparation from in the application of such emulsions.

Aus der EP 0311906 B1 sind wäßrige Polyacrylatdispersionen oder Polyacrylatemulsionen mit einem pH-Wert von 4-6 bekannt, deren Herstellung bedingt aufwendig ist. From EP 0311906 B1 aqueous polyacrylate dispersions or polyacrylate emulsions are known having a pH-value of 4-6, their production is limited consuming. Die Dispersionen weisen eine Aktivsubstanz von 20% auf. The dispersions have an active substance of 20%. Weiterhin sind aus der EP 0115694 A2 wäßrige Dispersionen von Acrylatcopolymeren bekannt die für eine temporären Schutz von beschichteten Metalloberflächen, von Glas ua Oberflächen vor mechanischen Beschädigungen während des Her stellungs- und Verarbeitungsprozesses geeignet sind. Furthermore 0115694 A2 aqueous dispersions of acrylate copolymers are known from EP are positioner for temporary protection of the coated metal surfaces, glass surfaces, inter alia, from mechanical damage during processing and Her process suitable. Diese Disper sionen erfordern bei Anwendung und auch bei ihrer Entfernung einen Zusatz von Alkoholen. This disper sions requiring addition of alcohols in application and during its removal. Die Übertragung dieser bekannten technischen Lehren auf den erfindungsgemäßen Zweck ist nicht möglich. The transfer of these known teachings on the purpose of this invention is not possible.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, für Gegen stände aus Kupfer und dessen Legierungen einen temporären Anlauf schutz zu entwickeln, der nur dünne Schichten erfordert und nicht korrosiv wirkt. The present invention has for its object to develop for objects made of copper and its alloys to a temporary start-up protection which requires only thin layers and non-corrosive.

Die Aufgabe wird erfindungsgemäß dadurch gelöst, daß der tempo räre Anlaufschutz für Kupfer und dessen Legierungen aus 2 bis 20 µm dicke Schichten besteht, die mit Hilfe wäßriger Dispersionen von Acrylatcopolymeren der Molmasse von 50.000 bis 200.000 hergestellt werden. The object is inventively achieved in that the tempo rary tarnish protection for copper and its alloys, consisting of 2 to 20 microns thick layers, the aqueous dispersions of acrylate copolymers with molecular weights are produced from 50,000 to 200,000. Der Aktivsubstanzgehalt der wäßrigen Disper sionen beträgt 2-10%. The active substance content of the aqueous disper sions is 2-10%. Sie enthalten keine Hydrophobiermittel. They do not contain water repellents.

Die Herstellung der Acrylatcopolymeren erfolgt durch Emulsions polymerisation in an sich bekannten Verfahren ohne Verwendung organischer Lösungsmittel. The preparation of the acrylate copolymer is carried out by emulsion polymerization in the conventional procedure without using organic solvents. Es werden dabei Polymerisationshilfs stoffe verwendet, die nicht korrosiv wirken. Polymerisationshilfs materials are used here, which are not corrosive. In vorteilhafter Ausgestaltung der Erfindung können den wäßrigen Dispersionen korrosiosinhibierende Additive zugesetzt werden. In an advantageous embodiment of the invention korrosiosinhibierende additives may be added to the aqueous dispersions. Der Zusatz organischer Lösungsmittel, wie Alkohole, bei der Anwendung ist nicht erforderlich. The addition of organic solvents such as alcohols, in the application is not required.

Der erfindungsgemäße temporäre Anlaufschutz wird vorzugsweise zum Schutz von Gegenständen bzw. Bauteilen der Elektrotechnik und Elektronik wie z. The temporary Tarnish invention is preferably used to protect articles or components in electrical engineering and electronics such. B. für Dehnungsbänder, Kontakte oder Leiterplat ten eingesetzt. Eg for expansion connectors, contacts or printed th used. Der temporäre Anlaufschutz kann in einfacher Wei se durch Behandeln mit lösungsmittelfreien wäßrigalkalischen Lösungen rückstandfrei wieder entfernt werden. The temporary Tarnish can easily Wei se by treatment with solvent-free aqueous alkaline solutions without leaving residue be removed.

Bei der Weiterverarbeitung von mit Anlaufschutz beschichteten Bauteilen durch Löten ist überraschenderweise keine vorhergehende Entfernung der Schutzschicht erforderlich. In the further processing of coated with tarnish protection components by soldering, no prior removal of the protective layer is surprisingly required.

Die Anwendung des erfindungsgemäßen Anlaufschutzes ist auch für Gebäudeverkleidungen, Schilder u.ä. The application of the start-up protection of the invention is also suitable for building panels, etc. Signs aus Kupfer oder Kupferlegie rungen geeignet. of copper or Kupferlegie stanchions suitable.

Durch die Erfindung werden folgende Vorteile erreicht: Bereits in dünnen Schichten wird ein witterungsbeständiger, aus reichend fester, temporärer Schutz ohne vorherige Beschichtung oder Lackierung der Oberflächen erzielt. By the invention, the following advantages are obtained: Even in thin films, a weather-resistant, obtained from reaching solid, temporary protection without coating or painting of the surfaces. Damit verbunden ist der geringe Verbrauch durch den niedrigen Aktivsubstanzgehalt der Dispersionen. This is associated with the low consumption by the low active substance content of the dispersions. Ein weiterer Vorteil ist die einfache rückstands freie, lösungsmittelfreie Entfernung des Anlaufschutzes. Another advantage is the simple without residue-free, solvent-free removal of the start-up protection. Nach Entfernung wurde kein erhöhter elektrischer Widerstand festge stellt. After removal no increased electrical resistance was Festge provides. Vorteilhaft wirkt sich auch aus, daß bei Weiterbearbei tung durch Löten keine Entfernung des Anlaufschutzes erforderlich ist. Advantageously, also has an effect that, when request further processing by soldering no removal of start-up protection is required.

Im folgenden wird die Erfindung anhand von Ausführungsbeispielen näher erläutert. In the following the invention will be explained in more detail with reference to embodiments.

Beispiel 1 example 1

Eine erfindungsgemäße wäßrige Dispersion von Acrylatcopolymeren einer Molmasse von 100.000 mit einem Aktivsubstanzgehalt von 5% wurde auf Kupferblech der Abmessung 12×6 cm aufgetragen. An inventive aqueous dispersion of acrylate copolymers having a molecular weight of 100,000 with an active substance content of 5% was applied to copper plate with the dimensions 12 x 6 cm. Die Flächenbenetzung war gut. The surface coverage was good. Die Kupferblechstreifen wurden mit ei nem Heißluftfön getrocknet. The copper strips were dried with egg nem heat gun. Die Schichtdicke des Trockenfilms betrug ca. 5 µm. The layer thickness of the dry film was about 5 microns. Im Ergebnis wurde ein fester, wasserbeständiger Anlaufschutz erzielt. As a result, waterproof restart protection was achieved. Die damit beschichteten Kupferbleche zeig ten auch nach Ablauf von 2 Monaten keine Anlauferscheinungen. The thus-coated copper plates show th no start-up phenomena even after 2 months. Der Schutzfilm eines beschichteten Kupferbleches wurde durch eine 1% Sodalösung, der 0,5% Tenside und bis 1% übliche Korrosionsinhi bitoren zugesetzt wurden, rückstandsfrei in kurzer Zeit entfernt. The protective film of a coated copper sheet was customary Korrosionsinhi bitoren were added by a 1% sodium carbonate solution, 0.5% surfactants and up to 1%, residue-free removed in a short time.

Beispiel 2 example 2

Auf die Kontakte von zwei Leiterplatten wurde eine erfindungsge mäße wäßrige Dispersion mit 5% Aktivsubstanzgehalt aufgetragen. a erfindungsge Permitted aqueous dispersion was coated with 5% active substance content to the contacts of two circuit boards. Die Schichtdicke nach dem Trocknen betrug 5 bis 10 µm. The layer thickness after drying was 5 to 10 microns.

Von einer Leiterplatte wurde nach 20 Tagen der Anlaufschutz gem. From a circuit board of Tarnish was gem after 20 days. Beispiel 1 entfernt und Anschlüsse gelötet. Example 1 removed and soldered connections.

An der zweiten Leiterplatte wurden ebenfalls Anschlüsse, ohne Entfernung des Anlaufschutzes, gelötet. Connections were also to the second circuit board, without removal of the start-up protection soldered.

In beiden Fällen wurde an den Kontakten kein erhöhter elektri scher Widerstand gemessen. In both cases, no increase in shear electrical resistance was measured at the contacts.

Claims (3)

  1. 1. Temporärer Anlaufschutz für Oberflächen von Kupfer und Kupferlegierungen gegen klimatische und mechanische Einflüsse, dadurch gekennzeichnet, daß der Anlaufschutz aus 2 bis µm dicken Schichten wäßriger Dispersionen von Acrylatcopolymeren der Molmasse 50.000 bis 200.000 besteht. 1. Temporary tarnish protection for surfaces of copper and copper alloys to climatic and mechanical influences, characterized in that the start-up protection of 2 to microns thick layers of aqueous dispersions of acrylic copolymers of molecular weight 50,000 to 200,000 is.
  2. 2. Temporärer Anlaufschutz gemäß Anspruch 1, dadurch gekennzeich net, daß der Aktivsubstanzgehalt der wäßrigen Dispersionen 2 bis 10% beträgt. 2. Temporary tarnish protection according to claim 1, characterized in that the active substance content of the aqueous dispersions is 2 to 10%.
  3. 3. Temporärer Anlaufschutz gemäß Anspruch 1, dadurch gekennzeich net, daß die wäßrigen Dispersionen keine Hydrophobierungs mittel enthalten. 3. Temporary tarnish protection according to claim 1, characterized in that the aqueous dispersions contain no hydrophobing agent.
DE1995125708 1995-07-14 1995-07-14 Temporary start-up protection for copper and copper alloys Expired - Fee Related DE19525708C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1995125708 DE19525708C1 (en) 1995-07-14 1995-07-14 Temporary start-up protection for copper and copper alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1995125708 DE19525708C1 (en) 1995-07-14 1995-07-14 Temporary start-up protection for copper and copper alloys

Publications (1)

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DE19525708C1 true DE19525708C1 (en) 1997-01-30

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19652728A1 (en) * 1995-12-23 1997-06-26 Volkswagen Ag Application of peelable protective film to lacquered vehicle bodywork
WO2004021436A1 (en) * 2002-08-29 2004-03-11 Freescale Semiconductor, Inc. A packaged semiconductor with coated leads and method therefore
EP1615484A1 (en) * 2004-06-23 2006-01-11 Ormecon GmbH Article with a coating of an electrically conductive polymer and process for making it
US7547479B2 (en) 2004-06-25 2009-06-16 Ormecon Gmbh Tin-coated printed circuit boards with low tendency to whisker formation
US7989533B2 (en) 2005-08-19 2011-08-02 Ormecon Gmbh Chemical compound comprising an indium-containing intrinsically conductive polymer
US8153271B2 (en) 2006-09-13 2012-04-10 Ormecon Gmbh Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
US8344062B2 (en) 2004-01-23 2013-01-01 Ormecon Gmbh Dispersions of intrinsically conductive polymers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0115694A2 (en) * 1983-01-12 1984-08-15 Imperial Chemical Industries Plc Compositions for producing on a substrate a temporary protective coating subsequently removable with aqueous alkali

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0115694A2 (en) * 1983-01-12 1984-08-15 Imperial Chemical Industries Plc Compositions for producing on a substrate a temporary protective coating subsequently removable with aqueous alkali

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19652728A1 (en) * 1995-12-23 1997-06-26 Volkswagen Ag Application of peelable protective film to lacquered vehicle bodywork
WO2004021436A1 (en) * 2002-08-29 2004-03-11 Freescale Semiconductor, Inc. A packaged semiconductor with coated leads and method therefore
US7105383B2 (en) 2002-08-29 2006-09-12 Freescale Semiconductor, Inc. Packaged semiconductor with coated leads and method therefore
US8344062B2 (en) 2004-01-23 2013-01-01 Ormecon Gmbh Dispersions of intrinsically conductive polymers
EP1615484A1 (en) * 2004-06-23 2006-01-11 Ormecon GmbH Article with a coating of an electrically conductive polymer and process for making it
US7547479B2 (en) 2004-06-25 2009-06-16 Ormecon Gmbh Tin-coated printed circuit boards with low tendency to whisker formation
US7989533B2 (en) 2005-08-19 2011-08-02 Ormecon Gmbh Chemical compound comprising an indium-containing intrinsically conductive polymer
US8153271B2 (en) 2006-09-13 2012-04-10 Ormecon Gmbh Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof

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