DE3138281A1 - Method for producing and fitting the pins of a supporting plate which can be plugged vertically onto a printed-circuit board by means of a plurality of rows of these pins - Google Patents

Abstract

A method for producing and fitting the pins (Pa, Pi) of a supporting plate for VLSI modules, which can be plugged vertically onto a printed-circuit board by means of a plurality of rows of these pins. The connecting spots for the pins (Pi, Pa) are fitted on the supporting plate together with the lines. At least two rows of pins (Pi, Pa) are produced from conductive thick-film material in one piece above a common rail (Sch) connected in the form of a comb to the left and right of the rail (Sch). The pins, which are then bent into their final shape, are soldered to the connecting spots. The rail (Sch) is finally removed, preferably by cutting off or by pulling off by means of an auxiliary tool. <IMAGE>

Description

Method of making and attaching the pins

one by means of several rows of these pins on a circuit board pluggable carrier plate.

The invention was developed in particular for an approx. 18 x 75 mm (approx. 3/4 x 3 inch) carrier plate in miniature design with four rows of 30 each Pins along one 75 mm side edge for use in the central computer of a computer-controlled telephone switching system. The invention but is absolutely suitable for all vertically pluggable carrier plates with especially many pins through which different signals or voltages are routed can be.

The invention is based on the preamble of the claim 1, which for itself at least largely, e.g., by communications technology 18 (1968) H. 3, pages 112 to 115, in particular Bils 2c is known. From this Document, in particular from Sections 2.4 and 3.2, also shows that Minimum spacing, there approx. 2.5 mm, of the connections or

Pins must be adhered to, which indicate the number of connections along the often uncomfortably limit the side edge of the carrier plate carrying the pins. Remarkably it is stated there that, in the opinion of those authors, the one shown in Figure 2c Carrier plate with two rows of pins is not advisable because one is vertical pluggable carrier plate with one-sided meant - is actually "single-edged") several, namely two, rows of pens especially too uneconomical compared to one vertically pluggable printed circuit board with "one-sided" only a single row of pins may be. These In any case, views are correct insofar as the distances between the connection pads and the width of these connection pads certain minimum dimensions should not fall below, in order to have a low-reject production of reliably operable To ensure carrier plates.

E.g. by DE-AS 22 49 730, see in particular the figures there, is already known to have a number of pens for each a number of pens on several side edges having carriers of semiconductor components the conductive ones Make pins from thick-film material so that each comb-shaped series respectively.

a set of pins in one piece over a common rail related by placing the relevant series of pins on one side of the rail is attached, the rail after attaching the pins to the carrier finally is removed again. With this known method you can use the relevant Rail only a single row of pins on the carrier in the intended pitch at the same time in series production.

Next to it are similar carriers, each with several rows of pins known on several side edges of this carrier, mostly horizontally in a PCB are to be plugged. Even with this similar carrier, one each can Row of pins in the intended pitch by means of the ones attached to the rail relevant series or series of pins simultaneously in series production in the intended Pitch are attached, the object of the invention is to offer the possibility of the number of connection pads per unit length of the single side edge in question to increase considerably while maintaining the usual grid dimensions, without without significantly reducing the width of the connection pads and their spacing from one another to have to and without the space required for the connection pads on the carrier plate to have to increase very much, as well as s anyway, if necessary even single-edged four, Rows of pens, each of which can even carry completely different signals, to be able to attach to the relevant side edge according to the principle of the invention and these multiple rows of pins to be attached to a single side edge at the same time also in series production with particularly little effort precisely in the attach the intended grid dimensions quickly and poorly to the support plate to be able to.

This task is achieved by the characterizing part of claim 1 mentioned additional measures.

The invention thus offers the possibility of even several VLSI chips each with a particularly large number of its own supply connections on the series production to be able to accommodate manufacturable relatively small carrier plate in a space-saving manner. Such vertically pluggable carrier plates are also important with regard to cooling or

thermal load capacity, in later operation the one carried by them Building blocks, particularly cheap, which is already for example in DE-OS 30 33 900, 30 33 881, 30 36 196 and 31 21 515 is given.

The measures mentioned in the subclaims allow additional To achieve benefits. This is because the measures according to claim 2 allow the usual bending of the sheet metal foils are used when punching the pins to avoid punched pins and still a quasi-continuous production to enable the pins in a continuous process, 3, the adjustment the row of pins in question when attached to the side edge of the carrier plate, e.g. to facilitate the soldering of these pins with the associated connection pads as well as, especially when wave soldering into the vias of the circuit board inserted pins, a sufficient distance between the circuit board and the actual Ensure support plate 4, the rail after connecting the pins with remove the connection point quickly in series production with a special tool to be able to, and 5, despite the attachment of a particularly large number of pins per unit length of the relevant side edge, a relatively large grid spacing between the pins especially in the area where it is through the through-hole plating of the circuit board can be reached and rejected quickly and easily, especially with avoidance from unintentional bending of the pins, remove the rail in series production to be able to.

The invention is illustrated schematically in the 17 figures Details of exemplary embodiments widely explained, with Figure 1 showing a vertical, moderately enlarged section through the plugged onto a printed circuit board, in this one Case particularly high, namely approx. 38 mm high carrier plate with four rows of pins, 2 shows a greatly enlarged section from FIG. 1, showing the one having the pins Side edge of the carrier plate as well as the vias of the circuit board with shows the pins inserted through it, 3 is a greatly enlarged side view of the detail shown in Fig. 2, 4 is a moderately enlarged plan view of that Holes or

Vias of the circuit board into which the pins of the circuit board shown in Fig. 1 shown in the example are 5 a greatly enlarged Top view of the detail shown in FIGS. 2 and 3, 6 a moderately enlarged oblique view of a larger section of the front of the one shown in FIG Example, 7 and 8 moderately enlarged examples of one each, comb-shaped lengthways a rail x not arranged according to the invention is later removed again, attached row of pre-bent pins before connecting them to the connection pads, 9 to 11 greatly enlarged examples from the left and right in a comb-shaped manner along a rail arranged according to the invention, which is later removed again, attached rows of pre-bent pins before their connection with the connection pads, 12 to 14 moderately enlarged examples of the example shown in Figs. 9 to II shown embodiments before their bending into a final shape, 15 a Top view of the example of pins with rail shown in FIGS. 9 and 14 according to FIG the bending of the pins, and 16 and 17 an example of one consisting of three parts Auxiliary tool for quick removal of the rail from the, already attached to the carrier plate soldered or attached pins show.

Before more details of examples of the actual invention Procedure to be further explained, first more details about examples of process end products, i.e. executions of different, perpendicular by means of several rows of pins pluggable or plugged carrier plates, especially explained with reference to FIGS. 1 to 6. The method according to the invention is mainly 9 to 17 entered on the basis of FIGS Fig. 1 shows a particular Example of a carrier plate T, which has many pins, which is perpendicularly inserted into the Holes of the circuit board LP is inserted. The carrier plate T has here namely both two rows of pens on both the front and back on, with these rows one below the other, in the area where they go into the circuit board PCBs are plugged in, each with a distance of only 2.54 mm. These pens, See Pa and Pi, can also be seen in FIGS.

The carrier plate T consists of insulating material, e.g. glass, epoxy glass hard fabric or ceramic and is used to carry one or more, a large number of lead connections having, in the example shown only later attached building blocks, in particular for carrying VLSI modules.

FIGS. 1 to 3 and 5 and 6 show that these pins are along a side edge of the support plate T are attached in a protruding manner so that their axial directions are mutually parallel and parallel to the carrier plate T, and that their axial directions are oriented perpendicular to the surface of the circuit board LP are. These pins are for the conductive connection of the same with the lead connections of the components 1 attached later via those shown in FIGS. 2, 3, 5 and 6 Connection pads AFi, AFa each conductively connected to an assigned line L, see Fig. 3 and 6. These pads AFi, AFa are together with the lines L mounted on the support plate T, e.g.

printed in a known manner.

The placement of so many rows of closely spaced pegs Pa, Pi was also made possible in these examples by the fact that the pins along the Side edge of the carrier plate T, here on the rear page and on the front of the carrier plate T, two rows close to each other of pads AFi, AFa, see Figs. 2, 3 and 6. Around the pins Attaching at this density became the top row of connection pads AFa so spatially offset against the lower row of connection pads AFi attached, that an upper connection pad AFa in each case in the middle over two adjacent lower ones Connection pad AFi is located. The distances here, amounting to approx. 1.3 mm, were used the upper, approx. 1.2 mm wide connection pads AFa chosen to be so large among each other that 3 and 6 that a line L, here 0.3 mm wide, is between them still has sufficient space for a lower connection point AFi. Figs. 1 to 3 6 and 6 show that the lower pads AFi match the pins Pi of the first row of pins and the upper connection pads AFa with the pins Pa of the second row conductively connected by pins, e.g. by soldering. The distance is the Pins below each other within each row again only 2854 mm, see. Fig. 3 and 5.

In this way it is achieved that, compared with the aforementioned state of technology, the number of connection pads per unit length of the side edge of the vertically pluggable carrier plate while maintaining the usual grid dimensions considerably is enlarged without significantly reducing the width of the connection pads, which is 1.2 mm here and their distances from each other, which are approx. 1.3 mm in comparison to the one for this To have to reduce the dimensions customary up to now and without the space requirement for the connection pads to have to increase very much on the carrier plate. Here are still single-edged even four rows of pens, each with completely different signals can guide, attached to the relevant side edge, where, as later will be further explained, all four ^ if necessary even more - Rows of pens even in series production with a reasonable amount of effort on the Support plate T can be attached. on the structure of such carrier plates T is also used in the simultaneously filed application 81E5924a = ....................

reported.

The invention thus offers the possibility of even several VLSI chips each with a particularly large number of its own supply connections on the relatively small one to be able to accommodate vertically pluggable carrier plate in a space-saving manner. Above all can also be admitted that even all pens of different rows of Pins each conduct different signals or voltages and currents; at a side edge of 75 mm in length, each having four rows of thirty pins E.g. 117 different signals and 3 constant power supply resp. Grounding potentials. The space utilization on the carrier plate T is particularly high and the relevant side edge particularly short despite everything. In particular, the high PCB space requirements and the comparatively poor coolability from the horizontal Two-sided or square-sided plug-in carrier plates or carriers avoided.

This particularly high density of pins and pads becomes particular achieved in that the side edge in question, if necessary, not only two or can have three, but even more rows of pins, as well as will be shown with reference to Figures 9-17, even all rows of pins precisely manufactured with minimal scrap in the desired grid dimensions and even afterwards at the same time on the carrier plate with particularly little effort in the scrap intended grid dimensions can be attached.

The invention is therefore not limited to the attachment of four Rows of pens. Also a carrier plate that, for example, only has two or three rows of Having pins, for example only the two rows of those in Figures 1 and 2 at the front the carrier plate T attached pins, is by the method according to the invention Can be produced with a series of pins attached simultaneously to the left and right of the rail, as will be explained with reference to FIGS. 11 and 13. With the method according to the invention For example, you can also use a carrier plate with only the two inner rows of pins Establish Pi, see FIG. 2, as will be explained with reference to FIGS. In an analogous manner, any number of more than two can be used by means of the invention Rows of pins precisely in the intended pitch at the same time on the relevant Attach the side edge, which is based on the design with four rows of pins will be explained primarily by means of FIGS. 9 and 14-17.

The invention also allows a comparative if necessary large distance between the holes of the circuit board LP and between the pins the first and the second row despite a particularly high number of pins to be observed, see Fig. 2, 4, 5 and 6, that the second, outer rows of pins Pa, which are connected here to the upper connection pads AFa, in the area where they are plugged into the printed circuit board LP, a larger side distance, in any way pre-determinable grid dimension, from that plane of the carrier plate T, which the connected pads AFa have as the first, inner rows of Pins Pi connected to the lower pads AFi.

The invention also allows the density of the vias D on the circuit board LP particularly large, or the space required perpendicular to the Side surfaces of the carrier plate are chosen to be particularly small, e.g. by, see Fig. 4 and 5, the first row of pins Pi so spatially offset from the second row of pins Pa is attached that a pin Pi of the first row in each case In the middle next to two adjacent pins Pa of the second row.

The following is intended to refer to the actual process for production and Attachment of the pins are received.

Above all, it should be pointed out to details that are necessary for the Low-reject, inexpensive series production of such carrier plates are important. It is assumed that in a special production step on the Carrier plate T the pads AFi, AFa and the lines L made, e.g. printed and melted using appropriate pastes, are or will be. Before, at the same time or after this production of the connection pads and lines, one can in each case the Make the rail with the pins.

In itself, one could initially look at the teaching of DE-AS 22 49 730 conductive thick-film material, e.g. made of phosphor bronze spring steel sheet 0.25 mm thick or also made of Cu foil, the pins Pi, Pa shown in FIGS. 1 to 6 - according to FIG. 7 and 8 each in rows, as a row of pins canim-shaped. in one piece Connected via a rail each - ~ for. establish yourself and in your bend final shape. Then you could use the pens Pa and Pi with their from the end remote from the respective rail Sch with the associated connection pads AFa, Connect AFi conductively, e.g. solder.

After all, you could see the individual rails Sch, which by then yes essentially only to facilitate the adjustment of the pins Pa, Pi when connecting with the final spots AFi, AFa were used, e.g. Be by depositing, still remove.

In accordance with the invention, the pitches contemplated are particular between the pins of different rows of pins particularly precisely rejects, With little effort and quickly produced by the fact that instead of each row of pins to attach a separate rail rail, see Fig. 7 and 8, the rails of several Rows of pins are formed by a single rail, on which at their production from the thick-film material on one side or in a comb shape several left rows of pegs hangs and comb-shaped to the opposite side another or more right rows of pins are hanging. You can use these pens - or in advance also the thick-film material - according to the needs also bend and then all these pins in a single step with the connect them assigned rows of pads AFi, AFa simultaneously before you remove the rail.

In this way, e.g. four rows of pens can be used at the same time be attached there in such a way that after removing the rail no additional More bending on the pins is needed to insert them into the vias D. to be able to.

With reference to FIGS. 10 and 12, this is initially a relatively simple one Example explained in which the carrier plate T, see FIG. 2, only the two inner Rows of pins Pi, but not the two outer rows of pins Pa target.

According to the invention, all pins Pi of both rows of pins are then at the same time made of conductive thick-film material, e.g. made of phosphor bronze spring plate or made of Cu foil, connected in one piece over the rail Sch, for itself made so that on the left side of the Rail rail, see Fig. 12, the width of which, by the way, approximates that on the carrier plate T and printed circuit board LP distance to be maintained between the relevant rows of pins, here 2.54 mm according to 21 corresponds, in the shape of a comb, to the left inner row of pins Pi in FIG a left series of pins pi hangs' and on the opposite right side the rail Sch comb-shaped the right inner row of pins Pi as a right Series of pins hangs. In the example shown in FIG. 12, all are then on Pins Pi hanging on the rail Sch by bending or pressing, at least largely, Shaped into their final shape, see Fig. 10.

Only then will all the left and right pins Pi be connected to their from the rail's distal end in a single process step with the associated Connection pads, see AF in Fig. 2, simultaneously conductively connected, e.g. soldered, that the pads AF of the first row of pads, namely on the left side of the side edge of the carrier plate, with the associated pins Pi the left series of pins, and the pads AF of the second row of pads, namely on the right side of the side edge of the carrier plate, with the associated Pins Pi of the right series of pins are connected, e.g. by soldering. All Pins of both rows of pins Pi now have precisely the intended ones Grid spacing from one another; besides, all pens usually now have them too already its final form.

Finally, the rail (Sch) is removed, e.g. by cutting it off, after which the carrier plate T with its pins Pi vertically into the circuit board LP, 1 to 5, can be plugged in and, if necessary, also soldered on there.

A carrier plate is similar according to the method according to the invention Ts see. Fig. 2 and 6, can be produced, which only on the right side of the relevant Side edge, but not on the left side of this side edge, has pins, namely, the two rows of pins Pi, Pa shown in Figure 6. These two rows of pins are each to its own row of connection pads AFi, AFa, cf. Fig. 3 and 6, connected, with both rows of pads close together lie along that side edge and are offset from one another so that a line L there is sufficient space between an underlying lower connection point AFi has the adjacent top pad AFa. So it is recommended to reduce it of the space and area requirement 'a lower connection point AFi each slightly below the center between two adjacent upper pads AFa. in the This example is also assumed that the outside of FIG. 2, removed lying row of pins Pa attached to the upper row of connection pads AFa became; accordingly the inner pins Pi on the lower pads AFi.

According to the method according to the invention, in this example, the Pins are manufactured and attached in that the pins Pi, Pa of both rows 13 of thick film conductive material, e.g.

again made of phosphor bronze spring sheet or made of copper foil, in one piece coherent on the rail rail, are made for itself so that on one Side of the rail, the width of which, here again 2.54 mm, corresponds to that on the carrier plate T or PCB LP corresponds to the spacing of the pins to be maintained, see. Fig. 2, in a comb shape the inner row of pins Pi hangs as a left-hand series of pins Pi and on the opposite side of the rail Sch in the shape of a comb the outer row of pens pa as one right series of pins pa hangs. Here hang the pins offset on the rail, according to the intended Relocation of the vias of the circuit board, see FIGS. 4 to 6. In particular then the pins Pi, Pa hanging on the rail Sch can be bent, for example or pressing, in any case largely shaped into their final shape, cf. Fig. 11.

Then the pins Pa, Pi can be removed with their from the rail Sch End in a single process step with the associated connection pads AFa, AFi are simultaneously connected, e.g. soldered, so that the connection pads AFi of the first, lower row of connection patches with the associated pins Pi of the left series of pins, and the connection pads AFa of the second, upper one Row of pads with the associated pins Pa of the right series of FIG Pins, e.g. by soldering, are connected. Finally, the rail will be e.g. by cutting off or tearing off, whereby a carrier plate T according to Fig. 6 arises.

Even more than two, e.g. three four and even more, rows of pens can, hanging together on a single rail Sch, made of the thick-film material produced and in a single process step simultaneously with each associated pads are conductively connected. But in this case the width of the rail rail no longer uniformly has a single value at the points what the pens hang on. Because then more than two rows or series of pens hang on the rail rail, this rail rail has different widths at the same time, depending on which pin is hanging at the relevant point on the rail. this will now be based on the example shown in FIGS. 1, 2, 4, 5, 9 and 14 of manufacture of the carrier plate T, which carries four rows of pins, is explained in more detail: In In a single process step, all fourth rows of pins are again here at the same time made of conductive thick-film material, e.g. again made of phosphor bronze spring plate # in one piece over the rail rail according to Fig. 14, e.g. by fine etching, for itself so produced that on one side of the rail Sch chimney-shaped two rows of pens as two different left series of pens, see Pi and Pa and on the opposite side of the rail Sch in a comb shape the remaining two Rows of pens are hanging as two right-hand series of pens, see Pi and Pa there The width of the rail depends on whether a pin is to an outer or to belongs to an inner row, each different, namely here 2.54 and 7.62 mm, see Fig. 14. The width of the rail Sch therefore corresponds in each case to that on the carrier plate T distance to be maintained between the pins, see. Fig. 2.

Then or before, you can use the pins hanging on the rail Sch Pi, Pa, or their material by bending or pressing in any case largely into theirs final shape can be formed, see Fig. 9. After that, in this example the pins Pa, Pi with their end remote from the rail Sch with the associated Pads, see Figure 2, conductively connected, e.g.

soldered that the respective connection pads of the two lower Rows of connection pads with the associated pins Pi of the inner series or Rows of pins, and the pads of the top two rows of connectors stain with the pegs assigned to the outer series or rows of pens, e.g.

by soldering. Here, too, the rail finally becomes Sch removed.

It is particularly beneficial to avoid unintentional punching caused by Avoid bending the pins, the pi, pa and the pens Schiene Schiene from the, e.g.

only 0.25 mm thick, thick-film material not by punching, but by fine etching. The shaping of the rail rail and pins Pi, Pa can So you can also do mass production using photolithographic processes and fine etching in an almost continuous process, namely in a continuous process. A stamping process can then be carried out to bend the pins Pi, Pa appropriately which gives the pens their final shape.

A stop tab AL, see FIGS. 2 and 9 to 15, can also be used here 900 must be bent out of the plane of the pins Pi, Pa, which later1 when placing the pins on the pads and soldering for the exact height of the pins that makes it easier to adjust the pins when you put them on, and later also a perfect wave soldering of the circuit board LP, see. Fig. 2, with the necessary Distance between the carrier plate T and the circuit board facilitated. It deals So here is a further training, with the lateral stop tab AL, which is on at least a portion of the pins in making the pins and the rail from the Thick-film material are also attached, bent in such a direction when molding that they are when connecting these pins, see Po 'with the associated connection pads Tap under the relevant side edge of the carrier plate T. Im shown in FIG In the example, it is assumed for the two vias on the left that the Pins Pa, Pi are already soldered in. To facilitate this soldering and Adjustments were made there so the pins Pi of the inner rows - it is often sufficient to equip only some of the pins with stop tabs AL - for the area below the relevant side edge of the carrier plate T each with the stop tab AL fitted. The connection, in particular soldering, of the pins Pa, Pi with the connection pads AFa9 AFi can also be made easier by using a specially prepared auxiliary device9 namely a lay-up device that is connected to the rail Sch presses hanging pins in the correct position on the connection pads.

Those transferred to the pins when the rail was cut or torn off Forces that could completely bend the pins9 are due to the reduction in cross-section Sp at the lower end of the pin reduced9 see FIGS. 39 6 and 9 to 14. This cross-sectional reduction Sp can e.g.

Be V-shaped so that after cutting or tearing off the rail Sch the pins taper off there, which also means that the carrier plate is plugged in into the contouring of the PCB LP.

16 and 17 shows an example of how to use a Special tear-off device tear off the entire rail in one fell swoop can7 without bending the pins. For this it is beneficial if all pins Pi, Pa taper to a point at its rail-side end and thus a predetermined breaking point there exhibit.

The rail Sch can then be torn off9 when all pins Pi, Pa are through Template-shaped brackets 9 e.g. 0 individually held by the pointed cross-sectional reductions Sp up to the connection point, e.g. in grooves or clasps or stops, 9 and if the rail is protected by a longitudinal direction of the rail Rail rail movable, in particular along the underside of the OTI brackets sliding cam rod, see UT with KO, at the predetermined breaking points of the pins Pi, Pa is demolished.

In Figures 16 and 17 it was assumed that the brackets OT1 consists of two individual parts that are symmetrical to the carrier plate T and can be moved like pliers jaws OT1 exist, whereby in these two figures, in order to improve their informative value only one of the two items OTi, namely the item arranged at the top in FIG. 17 OT1, is shown.

In FIGS. 16 and 17, the tear-off is even more specific on one particular seemingly complicated example with four rows of pins on the rail rail shown in accordance with Figures 1, 2, 4, 5, 9, 14 and 15, so for a carrier plate T with four rows of pegs and two close to each other and against each other staggered *) connection pads attached to the front and rear of the carrier plate T AFa, AFi, with one two left and two right series of pins according to FIG. 14 having a rail for the two outer rows of pins Pa with a larger, here 3 times larger, width was made than for the two inner rows of pins Pi. Accordingly, here the rail has Sch at its places with a large width each side wing ST with respect to their places with a smaller width. the The UT cam rod engages the edges lying perpendicular to the longitudinal direction of the rails Side flights ST, see FIGS. 14, 15, 16 and 17, with side cams SG on, with the whole Rail rail with its side wings ST in grooves of the cam rod UT, so clasped lies from the cams KO and SG to when the rail is torn off with the side cams SG via side wing ST on the predetermined breaking points with even greater force suddenly to be able to act.

+) Series of Some points of view are to be summarized again compiled: A support plate is used, e.g. with vias provided single, double or multi-layer carrier, e.g. made of ceramic or epoxy glass hard fabric. On the carrier plate there are e.g. VLSI semiconductor components and / or the other integrated under hydrated components. All to be carried away from the carrier plate Lines end at one of the e.g. on the front and back of the carrier plate located, e.g. in two rows one above the other. Connection pads of the upper row are preferred over connection pads of the lower row around the half a pitch offset The pads are so wide that lines, e.g. 0.3 mm wide, with a sufficient distance, e.g. 0.5 mm, between the connection pads can be carried out.

In a lay-up device, the carrier plate can be positioned correctly with the then still connected to the rail, pins are put together. Source material for rails and pins, e.g. an electrically conductive spring plate, e.g. made of phosphot bronze 0.25 mm thick, which is preferably flat. By e.g. photolithographic processes and fine etching will pre-cut the rail with the pins from one piece Sheet metal or made from a strip in a continuous process. Then can the pins are given their prescribed shape in an embossing process. Included a stop tab can also be attached and bent 90 ° out of the plane, the later when sliding the pins onto the carrier plate for the exact height the pins and which also ensure the perfect wave soldering of the circuit board produces the necessary distance between the carrier plate and the circuit board.

After the embossing process, the preferably resilient pins are preferred bent out of the plane by a little more than 900, see Fig. 9. The rail at the same time serve as a counterpart for the bending tool acting on the outside. These Bending is facilitated by the reduction in cross-section already produced during the etching process the pins at the transition to the rail.

That which is preferably made to the correct length or separated from the tape Piece with rail and pins is now plugged or placed on the carrier plate. The embossing of the pins clasping the carrier plate from two sides is formed here preferably a funnel that opens when the carrier plate is pushed in. These Spring travel creates contact forces between the pads and the pins, with the pins now also preferably in their vertical position, i.e. 900 to the rail, can be made, see Fig. 9.

Now the pins can, for example, be soldered to the connection pads get connected.

Now the rail must be separated from the pins. To this end the carrier plate is e.g. in an auxiliary tool with one e.g. of two template-like Part.

len existing fixed upper part or brackets inserted, which lead the pins. The movable lower part of the auxiliary tool, namely the cam rod, grabs the rail and separates it with a jerky movement in the longitudinal direction of the rails from the pins.

The forces transferred to the pins are taken from the stationary Auxiliary tool upper part or brackets caught and reduced by the cross-section kept relatively small at the pin ends. The transverse cutting reductions at the pin ends can be V-shaped so that after separating the Rail, the pins run out to a point and thus the insertion of the carrier plate into the circuit board facilitate. The circuit board, e.g. with drill holes in a 2.54 mm grid, accordingly the grid of the pins.

5 claims 17 figures Blank page

Claims (5)

Claims. Method of making and attaching the pins (Pa, Pi) a by means of several rows of these pins (Pa, Pi) perpendicular to a printed circuit board (LP) Pluggable carrier plate (T) made of insulating material, e.g. made of glass, epoxy glass hard fabric or ceramic, especially in miniature design (Fig. 1 to 6); where - the carrier plate (T) for carrying one or more, a large number of lead connections having modules, in particular for carrying VLSI modules, is used all Pins (Pi, Pa) along one side edge of the carrier plate (T) in a protruding manner must be attached in such a way that their axial directions are parallel to each other and to the carrier plate (T) are parallel and their axial directions are perpendicular to the surface of the circuit board (LP) are oriented, - the pins (Pi, Pa) are made of conductive material and, for the conductive connection of the pins (Pi, Pa) with the lead connections, via Connection pads (AFi, AFa) each connected to an associated line (L) are (Fig. 3 and 6), - the connection pads (AFi, AFa) together with the lines (L) are attached, e.g. printed, to the carrier plate (T), and - the connection pads (AFa, AFi) in at least two rows along the side edge of the carrier plate (T), see e.g. one row on the front and one row on the back of the carrier plate (T), are attached, indicating that - the pins (Pi, Pa) at least two rows of pins made of thick film conductive material, E.g. made of phosphor bronze spring plate or copper foil, in one piece over a joint Rail (Sch) coherent, are made for itself so that on one side the Rail, the width of which in any case approximates that on the carrier plate (T) or printed circuit board (LP) corresponds to the distance to be maintained between the rows of pins (Fig. 2, 9 and 12 to 14), comb-shaped one or more of the rows of 5 pins hang as one or more left series of pins (Pi) and on the opposite one Side of the slide. At least another row, namely ne (Sch) comb-shaped rest Rows of pegs hanging as one or more right series of pegs (Pa), - afterwards, before or at the same time the material that is still attached to the material of the rail (Sch) hanging pins (Pi, Pa), by bending or pressing, at least largely, in the later spatial position of the pins (Pi, Pa) is formed (Fig. 9 to 11 u. 15), - then the pins (Pa, Pi) with their end remote from the rail (Sch) conductively connected to the associated connection pads (AFa, AFi), e.g. soldered that the connection pads (AFi) of the first row of connection pads with the assigned pins (Pi) of the left series or one of the left series of pins, and the pads (AFa) of the second row of pads with the associated ones Pins (Pa) of the right series or one of the right series of pins, e.g. through Soldering, connected, and - finally the rail (Sch), e.g. by cutting off, is removed (Figs. 16 and 17). 2. The method according to claim 1, d a d u r c h g e k e n n z e i c h n e t that - the pins (Pi, Pa) and the rail (Sch) from the, e.g. only 0.25 mm thick, thick-film material produced by fine etching will. 3. The method according to claim 1 or 2, d a d u r c h g e k e n n z e i h n e t that - lateral stop tabs (AL), which are attached to at least one Part of the pins (pi) are attached when molding in such Direction that they are bent when connecting these pins (Pi) to the connection pads Fasten (AFi) under the side edge. 4. The method according to claim 1 or 2, d a d u r c h g e k e n It is not indicated that the rail (Sch) of all pins (Pi, Pa) attached to their end on the rail side taper to a point and thus have a predetermined breaking point there, is removed almost simultaneously by all pins (Pi, Pa) through a template-shaped Bracket (OT1) are held, and the rail (Sch) by one in its longitudinal direction the rail (Sch) movable cam rod (UT with KO) at the predetermined breaking points of the pins (Pi, Pa) is torn off. 5. The method according to claim 4, d a d u r c h g e k e n n z e i c h n e t that - the, for a carrier plate (T) with four rows of pins (Fig. 1, 2 and 5) and with two each close to each other and offset from one another on the Front and rear of the carrier plate (T) attached connection surfaces (AFa, AFi), two left and two right series of pins (Fig. 14) having rail (Sch) for the two outer rows of pins (Pa) with a larger one, in particular 3 times larger, width is made than for the two inner rows of pins (Pi), - i.e. the rail (Sch) in its places with a large width side wing (ST) with respect to their places of smaller width, and - the cam rod (UT), the edges of the side wings lying perpendicular to the longitudinal direction of the Schiten (ST) attacks with side cams (SG) when removing the rail (Sch) with the side cams (SG) acts on the predetermined breaking points via side wings (ST) (Fig. 16 and 17).