DE3070263D1 - Thermo-compression bonding a semiconductor to strain buffer - Google Patents

Thermo-compression bonding a semiconductor to strain buffer

Info

Publication number
DE3070263D1
DE3070263D1 DE8080900618T DE3070263T DE3070263D1 DE 3070263 D1 DE3070263 D1 DE 3070263D1 DE 8080900618 T DE8080900618 T DE 8080900618T DE 3070263 T DE3070263 T DE 3070263T DE 3070263 D1 DE3070263 D1 DE 3070263D1
Authority
DE
Germany
Prior art keywords
thermo
semiconductor
compression bonding
strain buffer
strain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080900618T
Other languages
German (de)
English (en)
Inventor
Douglas Eugene Houston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/019,294 external-priority patent/US4257156A/en
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE3070263D1 publication Critical patent/DE3070263D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/22—Conductive package substrates serving as an interconnection, e.g. metal plates having an heterogeneous or anisotropic structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
DE8080900618T 1979-03-08 1980-03-05 Thermo-compression bonding a semiconductor to strain buffer Expired DE3070263D1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US1865379A 1979-03-08 1979-03-08
US1922479A 1979-03-09 1979-03-09
US06/019,294 US4257156A (en) 1979-03-09 1979-03-09 Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers
PCT/US1980/000220 WO1980001967A1 (en) 1979-03-08 1980-03-05 Thermo-compression bonding a semiconductor to strain buffer

Publications (1)

Publication Number Publication Date
DE3070263D1 true DE3070263D1 (en) 1985-04-18

Family

ID=27361063

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080900618T Expired DE3070263D1 (en) 1979-03-08 1980-03-05 Thermo-compression bonding a semiconductor to strain buffer

Country Status (4)

Country Link
EP (1) EP0025057B1 (https=)
JP (1) JPS6142430B2 (https=)
DE (1) DE3070263D1 (https=)
WO (1) WO1980001967A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19843309A1 (de) * 1998-09-22 2000-03-23 Asea Brown Boveri Kurzschlussfestes IGBT Modul
EP1246242A1 (de) * 2001-03-26 2002-10-02 Abb Research Ltd. Kurzschlussfestes IGBT Modul
CN107671412A (zh) * 2012-03-19 2018-02-09 Ev 集团 E·索尔纳有限责任公司 用于对接合压力进行压力传递的压力传递板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1153461B (de) * 1960-06-23 1963-08-29 Siemens Ag Halbleiteranordnung
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3256598A (en) * 1963-07-25 1966-06-21 Martin Marietta Corp Diffusion bonding
US3273029A (en) * 1963-08-23 1966-09-13 Hoffman Electronics Corp Method of attaching leads to a semiconductor body and the article formed thereby
US3295089A (en) * 1963-10-11 1966-12-27 American Mach & Foundry Semiconductor device
US3237272A (en) * 1965-07-06 1966-03-01 Motorola Inc Method of making semiconductor device
GB1297046A (https=) * 1969-08-25 1972-11-22
US3726466A (en) * 1971-05-28 1973-04-10 Alco Standard Corp Brazing fixture
US3761783A (en) * 1972-02-02 1973-09-25 Sperry Rand Corp Duel-mesa ring-shaped high frequency diode
US4071397A (en) * 1973-07-02 1978-01-31 Motorola, Inc. Silicon metallographic etch
GB1457806A (en) * 1974-03-04 1976-12-08 Mullard Ltd Semiconductor device manufacture
GB1532628A (en) * 1974-11-15 1978-11-15 Ass Eng Ltd Metal bonding method
DE2514922C2 (de) * 1975-04-05 1983-01-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Gegen thermische Wechselbelastung beständiges Halbleiterbauelement
SU622603A1 (ru) * 1977-04-04 1978-09-05 Предприятие П/Я В-2058 Способ диффузионной сварки
US4089456A (en) * 1977-06-28 1978-05-16 United Technologies Corporation Controlled-pressure diffusion bonding and fixture therefor
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces

Also Published As

Publication number Publication date
JPS6142430B2 (https=) 1986-09-20
JPS56500112A (https=) 1981-02-05
WO1980001967A1 (en) 1980-09-18
EP0025057A1 (en) 1981-03-18
EP0025057A4 (en) 1981-10-27
EP0025057B1 (en) 1985-03-13

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee