DE3069863D1 - High capacity etching apparatus - Google Patents

High capacity etching apparatus

Info

Publication number
DE3069863D1
DE3069863D1 DE8080901736T DE3069863T DE3069863D1 DE 3069863 D1 DE3069863 D1 DE 3069863D1 DE 8080901736 T DE8080901736 T DE 8080901736T DE 3069863 T DE3069863 T DE 3069863T DE 3069863 D1 DE3069863 D1 DE 3069863D1
Authority
DE
Germany
Prior art keywords
high capacity
etching apparatus
capacity etching
etching
capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080901736T
Other languages
English (en)
Inventor
Martin Paul Lepselter
Dan Maydan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/065,185 external-priority patent/US4268374A/en
Priority claimed from US06/105,620 external-priority patent/US4298443A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of DE3069863D1 publication Critical patent/DE3069863D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
DE8080901736T 1979-08-09 1980-07-25 High capacity etching apparatus Expired DE3069863D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/065,185 US4268374A (en) 1979-08-09 1979-08-09 High capacity sputter-etching apparatus
US06/105,620 US4298443A (en) 1979-08-09 1979-12-20 High capacity etching apparatus and method
PCT/US1980/000927 WO1981000420A1 (en) 1979-08-09 1980-07-25 High capacity etching apparatus

Publications (1)

Publication Number Publication Date
DE3069863D1 true DE3069863D1 (en) 1985-02-07

Family

ID=26745322

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080901736T Expired DE3069863D1 (en) 1979-08-09 1980-07-25 High capacity etching apparatus

Country Status (4)

Country Link
EP (1) EP0033345B1 (de)
JP (1) JPS6151633B2 (de)
DE (1) DE3069863D1 (de)
WO (1) WO1981000420A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD150318A3 (de) * 1980-02-08 1981-08-26 Rainer Moeller Verfahren und rohrreaktor zur plasmachemischen dampfphasenabscheidung und zum plasmaaetzen
JPS6037188B2 (ja) * 1981-08-27 1985-08-24 三菱マテリアル株式会社 スパツタリング装置
DE69130348T2 (de) * 1990-07-31 1999-06-17 Applied Materials, Inc., Santa Clara, Calif. Plasmabearbeitungsreaktor
JP2014003147A (ja) * 2012-06-18 2014-01-09 Ulvac Japan Ltd ドライエッチング装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844924A (en) * 1970-08-03 1974-10-29 Texas Instruments Inc Sputtering apparatus for forming ohmic contacts for semiconductor devices
US3897325A (en) * 1972-10-20 1975-07-29 Nippon Electric Varian Ltd Low temperature sputtering device
US3855110A (en) * 1973-11-15 1974-12-17 United Aircraft Corp Cylindrical rf sputtering apparatus
US3879597A (en) * 1974-08-16 1975-04-22 Int Plasma Corp Plasma etching device and process
FR2308200A1 (fr) * 1975-04-18 1976-11-12 Burroughs Corp Installation de fabrication de semi-conducteurs et procede pour une telle fabrication
US3998718A (en) * 1976-02-18 1976-12-21 Bell Telephone Laboratories, Incorporated Ion milling apparatus
US4126530A (en) * 1977-08-04 1978-11-21 Telic Corporation Method and apparatus for sputter cleaning and bias sputtering
US4222839A (en) * 1978-09-21 1980-09-16 Motorola, Inc. Workpiece holder and method for plasma reactor apparatus

Also Published As

Publication number Publication date
EP0033345A1 (de) 1981-08-12
WO1981000420A1 (en) 1981-02-19
EP0033345A4 (de) 1981-10-13
JPS56501165A (de) 1981-08-20
JPS6151633B2 (de) 1986-11-10
EP0033345B1 (de) 1984-12-27

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN