DE3045548A1 - Elektronisches bauteilepaket und verfahren zu dessen herstellung - Google Patents

Elektronisches bauteilepaket und verfahren zu dessen herstellung

Info

Publication number
DE3045548A1
DE3045548A1 DE19803045548 DE3045548A DE3045548A1 DE 3045548 A1 DE3045548 A1 DE 3045548A1 DE 19803045548 DE19803045548 DE 19803045548 DE 3045548 A DE3045548 A DE 3045548A DE 3045548 A1 DE3045548 A1 DE 3045548A1
Authority
DE
Germany
Prior art keywords
electronic component
component package
dielectric material
conductor
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19803045548
Other languages
German (de)
English (en)
Inventor
Erfinder Wird Nachtraeglich Benannt Der
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Inc
AT&T Corp
Original Assignee
Plessey Inc
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Inc, Western Electric Co Inc filed Critical Plessey Inc
Publication of DE3045548A1 publication Critical patent/DE3045548A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10022Non-printed resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1003Non-printed inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/1053Mounted components directly electrically connected to each other, i.e. not via the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Coils Or Transformers For Communication (AREA)
DE19803045548 1979-12-06 1980-12-03 Elektronisches bauteilepaket und verfahren zu dessen herstellung Withdrawn DE3045548A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10092379A 1979-12-06 1979-12-06

Publications (1)

Publication Number Publication Date
DE3045548A1 true DE3045548A1 (de) 1981-06-11

Family

ID=22282227

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803045548 Withdrawn DE3045548A1 (de) 1979-12-06 1980-12-03 Elektronisches bauteilepaket und verfahren zu dessen herstellung

Country Status (8)

Country Link
JP (1) JPS5698844A (sv)
BE (1) BE886492A (sv)
DE (1) DE3045548A1 (sv)
FR (1) FR2471724A1 (sv)
GB (1) GB2067018A (sv)
IT (1) IT1134593B (sv)
NL (1) NL8006647A (sv)
SE (1) SE8008485L (sv)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654829A (en) * 1984-12-17 1987-03-31 Dallas Semiconductor Corporation Portable, non-volatile read/write memory module
US4992987A (en) * 1989-03-29 1991-02-12 Sgs-Thomson Microelectronics, Inc. Battery package for integrated circuits

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2076686A5 (sv) * 1970-01-23 1971-10-15 Sovcor Electronique
JPS5471962U (sv) * 1977-10-29 1979-05-22

Also Published As

Publication number Publication date
NL8006647A (nl) 1981-07-01
SE8008485L (sv) 1981-06-07
GB2067018A (en) 1981-07-15
FR2471724A1 (fr) 1981-06-19
JPS5698844A (en) 1981-08-08
IT1134593B (it) 1986-08-13
IT8026445A0 (it) 1980-12-04
BE886492A (fr) 1981-04-01

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Legal Events

Date Code Title Description
8130 Withdrawal