DE3045548A1 - Elektronisches bauteilepaket und verfahren zu dessen herstellung - Google Patents
Elektronisches bauteilepaket und verfahren zu dessen herstellungInfo
- Publication number
- DE3045548A1 DE3045548A1 DE19803045548 DE3045548A DE3045548A1 DE 3045548 A1 DE3045548 A1 DE 3045548A1 DE 19803045548 DE19803045548 DE 19803045548 DE 3045548 A DE3045548 A DE 3045548A DE 3045548 A1 DE3045548 A1 DE 3045548A1
- Authority
- DE
- Germany
- Prior art keywords
- electronic component
- component package
- dielectric material
- conductor
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 13
- 239000004020 conductor Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 26
- 239000003989 dielectric material Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims description 2
- 239000002241 glass-ceramic Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 28
- 241001233037 catfish Species 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10092379A | 1979-12-06 | 1979-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3045548A1 true DE3045548A1 (de) | 1981-06-11 |
Family
ID=22282227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803045548 Withdrawn DE3045548A1 (de) | 1979-12-06 | 1980-12-03 | Elektronisches bauteilepaket und verfahren zu dessen herstellung |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5698844A (sv) |
BE (1) | BE886492A (sv) |
DE (1) | DE3045548A1 (sv) |
FR (1) | FR2471724A1 (sv) |
GB (1) | GB2067018A (sv) |
IT (1) | IT1134593B (sv) |
NL (1) | NL8006647A (sv) |
SE (1) | SE8008485L (sv) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4654829A (en) * | 1984-12-17 | 1987-03-31 | Dallas Semiconductor Corporation | Portable, non-volatile read/write memory module |
US4992987A (en) * | 1989-03-29 | 1991-02-12 | Sgs-Thomson Microelectronics, Inc. | Battery package for integrated circuits |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2076686A5 (sv) * | 1970-01-23 | 1971-10-15 | Sovcor Electronique | |
JPS5471962U (sv) * | 1977-10-29 | 1979-05-22 |
-
1980
- 1980-11-26 GB GB8037957A patent/GB2067018A/en not_active Withdrawn
- 1980-12-01 FR FR8025459A patent/FR2471724A1/fr not_active Withdrawn
- 1980-12-03 DE DE19803045548 patent/DE3045548A1/de not_active Withdrawn
- 1980-12-03 SE SE8008485A patent/SE8008485L/sv not_active Application Discontinuation
- 1980-12-04 IT IT26445/80A patent/IT1134593B/it active
- 1980-12-04 BE BE0/203040A patent/BE886492A/fr unknown
- 1980-12-05 NL NL8006647A patent/NL8006647A/nl not_active Application Discontinuation
- 1980-12-05 JP JP17110380A patent/JPS5698844A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
NL8006647A (nl) | 1981-07-01 |
SE8008485L (sv) | 1981-06-07 |
GB2067018A (en) | 1981-07-15 |
FR2471724A1 (fr) | 1981-06-19 |
JPS5698844A (en) | 1981-08-08 |
IT1134593B (it) | 1986-08-13 |
IT8026445A0 (it) | 1980-12-04 |
BE886492A (fr) | 1981-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8130 | Withdrawal |