DE3003449C2 - Drucksensor - Google Patents

Drucksensor

Info

Publication number
DE3003449C2
DE3003449C2 DE3003449A DE3003449A DE3003449C2 DE 3003449 C2 DE3003449 C2 DE 3003449C2 DE 3003449 A DE3003449 A DE 3003449A DE 3003449 A DE3003449 A DE 3003449A DE 3003449 C2 DE3003449 C2 DE 3003449C2
Authority
DE
Germany
Prior art keywords
membrane
housing
pressure sensor
carrier plate
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3003449A
Other languages
German (de)
English (en)
Other versions
DE3003449A1 (de
Inventor
Teruyoshi Yokohama Kanagawa Mihara
Takeshi Yokosuka Kanagawa Oguro
Masami Kokubunji Tokio/Tokyo Takeuchi
Tamotsu Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Publication of DE3003449A1 publication Critical patent/DE3003449A1/de
Application granted granted Critical
Publication of DE3003449C2 publication Critical patent/DE3003449C2/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Measuring Fluid Pressure (AREA)
DE3003449A 1979-02-02 1980-01-31 Drucksensor Expired DE3003449C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54010329A JPS5817421B2 (ja) 1979-02-02 1979-02-02 半導体圧力センサ

Publications (2)

Publication Number Publication Date
DE3003449A1 DE3003449A1 (de) 1980-08-07
DE3003449C2 true DE3003449C2 (de) 1985-07-18

Family

ID=11747165

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3003449A Expired DE3003449C2 (de) 1979-02-02 1980-01-31 Drucksensor

Country Status (5)

Country Link
US (1) US4276533A (US06262066-20010717-C00315.png)
JP (1) JPS5817421B2 (US06262066-20010717-C00315.png)
DE (1) DE3003449C2 (US06262066-20010717-C00315.png)
FR (1) FR2448139A1 (US06262066-20010717-C00315.png)
GB (1) GB2047465B (US06262066-20010717-C00315.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3839515A1 (de) * 1987-11-27 1989-06-08 Ngk Insulators Ltd Druckfuehler
DE19605795A1 (de) * 1996-02-16 1997-08-21 Duerrwaechter E Dr Doduco Anordnung aus einer elektrischen Leiterplatte und einem elektrischen Druckaufnehmer

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0049955A1 (en) * 1980-10-09 1982-04-21 General Motors Corporation Dual cavity pressure sensor
US4399707A (en) * 1981-02-04 1983-08-23 Honeywell, Inc. Stress sensitive semiconductor unit and housing means therefor
JPS57192448U (US06262066-20010717-C00315.png) * 1981-05-29 1982-12-06
US4463336A (en) * 1981-12-28 1984-07-31 United Technologies Corporation Ultra-thin microelectronic pressure sensors
DE3447396A1 (de) * 1984-12-24 1986-07-03 Robert Bosch Gmbh, 7000 Stuttgart Elektrischer druckgeber
US4763098A (en) * 1985-04-08 1988-08-09 Honeywell Inc. Flip-chip pressure transducer
US4706493A (en) * 1985-12-13 1987-11-17 General Motors Corporation Semiconductor gas sensor having thermally isolated site
US4773269A (en) * 1986-07-28 1988-09-27 Rosemount Inc. Media isolated differential pressure sensors
JPS63122925A (ja) * 1986-11-13 1988-05-26 Yokogawa Electric Corp 半導体圧力センサ
US5062302A (en) * 1988-04-29 1991-11-05 Schlumberger Industries, Inc. Laminated semiconductor sensor with overpressure protection
JP2643029B2 (ja) * 1990-12-18 1997-08-20 三菱電機株式会社 半導体圧力センサ装置
US5279164A (en) * 1990-12-18 1994-01-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor with improved temperature compensation
JPH05149814A (ja) * 1991-11-29 1993-06-15 Fuji Electric Co Ltd 二重ダイヤフラム式半導体圧力センサ
JP2762807B2 (ja) * 1991-12-09 1998-06-04 株式会社日立製作所 差圧センサ
US5285690A (en) * 1992-01-24 1994-02-15 The Foxboro Company Pressure sensor having a laminated substrate
JPH05200539A (ja) * 1992-01-24 1993-08-10 Honda Motor Co Ltd 半導体基板接合方法
US5583296A (en) * 1993-01-19 1996-12-10 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E. V. Layered diaphragm pressure sensor with connecting channel
US5438876A (en) * 1993-08-05 1995-08-08 The Foxboro Company Modular diaphragm pressure sensor with peripheral mounted electrical terminals
US5483834A (en) * 1993-09-20 1996-01-16 Rosemount Inc. Suspended diaphragm pressure sensor
US5424650A (en) * 1993-09-24 1995-06-13 Rosemont Inc. Capacitive pressure sensor having circuitry for eliminating stray capacitance
CA2169824A1 (en) * 1993-09-24 1995-03-30 Roger L. Frick Pressure transmitter isolation diaphragm
JPH07125221A (ja) * 1993-10-29 1995-05-16 Sony Corp プリントヘッドおよびその製造方法
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US5731522A (en) * 1997-03-14 1998-03-24 Rosemount Inc. Transmitter with isolation assembly for pressure sensor
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
US5587601A (en) * 1995-06-05 1996-12-24 Kulite Semiconductor Products, Inc. Support structure for a semiconductor pressure transducer
US6323550B1 (en) * 1995-06-06 2001-11-27 Analog Devices, Inc. Package for sealing an integrated circuit die
US6911727B1 (en) 1995-06-06 2005-06-28 Analog Devices, Inc. Package for sealing an integrated circuit die
US20020003274A1 (en) * 1998-08-27 2002-01-10 Janusz Bryzek Piezoresistive sensor with epi-pocket isolation
US6006607A (en) * 1998-08-31 1999-12-28 Maxim Integrated Products, Inc. Piezoresistive pressure sensor with sculpted diaphragm
US6346742B1 (en) 1998-11-12 2002-02-12 Maxim Integrated Products, Inc. Chip-scale packaged pressure sensor
US6351996B1 (en) 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors
US6229190B1 (en) 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
US6255728B1 (en) 1999-01-15 2001-07-03 Maxim Integrated Products, Inc. Rigid encapsulation package for semiconductor devices
IT1311270B1 (it) * 1999-12-22 2002-03-12 Bitron Spa Dispositivo rilevatore di pressione, particolarmente per un impiantodi climatizzazione.
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
AU2629901A (en) 2000-01-06 2001-07-16 Rosemount Inc. Grain growth of electrical interconnection for microelectromechanical systems (mems)
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
DE10022124B4 (de) * 2000-05-06 2010-01-14 Wabco Gmbh Elektronisches Steuergerät
US6626044B1 (en) * 2000-10-03 2003-09-30 Honeywell International Inc. Freeze resistant sensor
US6848177B2 (en) * 2002-03-28 2005-02-01 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US20030183943A1 (en) * 2002-03-28 2003-10-02 Swan Johanna M. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6908845B2 (en) * 2002-03-28 2005-06-21 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6848316B2 (en) * 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
EP1707931B1 (en) * 2005-03-31 2013-03-27 STMicroelectronics Srl Analog data-input device provided with a microelectromechanical pressure sensor
EP1762925B1 (en) * 2005-09-09 2016-12-21 STMicroelectronics Srl Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device.
US7600433B2 (en) * 2007-02-23 2009-10-13 Silicon Micro Sensors Gmbh Pressure sensor with roughened and treated surface for improving adhesive strength and method of manufacturing the sensor
DE102009055717A1 (de) * 2009-11-26 2011-06-01 Continental Automotive Gmbh Sensormodul und Herstellungsverfahren eines Sensormoduls
US8671766B2 (en) * 2011-05-19 2014-03-18 Infineon Technologies Ag Integrated pressure sensor seal
US8413494B1 (en) * 2012-01-19 2013-04-09 Hamilton Sundstrand Corporation Burner pressure transducer
JP2015143635A (ja) * 2014-01-31 2015-08-06 セイコーエプソン株式会社 物理量センサー、高度計、電子機器および移動体
JP2015175833A (ja) * 2014-03-18 2015-10-05 セイコーエプソン株式会社 物理量センサー、高度計、電子機器および移動体
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
US10549982B2 (en) 2016-02-15 2020-02-04 Stmicroelectronics S.R.L. Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor
CN110494724B (zh) 2017-02-09 2023-08-01 触控解决方案股份有限公司 集成数字力传感器和相关制造方法
WO2018148510A1 (en) 2017-02-09 2018-08-16 Nextinput, Inc. Integrated piezoresistive and piezoelectric fusion force sensor
US11243126B2 (en) 2017-07-27 2022-02-08 Nextinput, Inc. Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
US11579028B2 (en) 2017-10-17 2023-02-14 Nextinput, Inc. Temperature coefficient of offset compensation for force sensor and strain gauge
WO2019099821A1 (en) * 2017-11-16 2019-05-23 Nextinput, Inc. Force attenuator for force sensor
DE102020132687A1 (de) * 2020-12-08 2022-06-09 Endress+Hauser SE+Co. KG Druckmessaufnehmer

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
GB1248087A (en) * 1969-02-28 1971-09-29 Ferranti Ltd Improvements relating to pressure gauges
US3886799A (en) * 1973-09-24 1975-06-03 Nat Semiconductor Corp Semiconductor pressure transducer employing temperature compensation circuits and novel heater circuitry
NL7415668A (nl) * 1974-12-02 1976-06-04 Philips Nv Drukopnemer.
CH592300A5 (US06262066-20010717-C00315.png) * 1975-07-08 1977-10-31 Keller Hans W
US4021766A (en) * 1975-07-28 1977-05-03 Aine Harry E Solid state pressure transducer of the leaf spring type and batch method of making same
DE2712846A1 (de) * 1976-03-24 1977-11-24 Ict Instr Inc Messumformer zum messen von druckunterschieden
JPS5365089A (en) * 1976-11-24 1978-06-10 Toshiba Corp Semiconductor pressure transducer
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
JPS54131892A (en) * 1978-04-05 1979-10-13 Hitachi Ltd Semiconductor pressure converter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3839515A1 (de) * 1987-11-27 1989-06-08 Ngk Insulators Ltd Druckfuehler
DE19605795A1 (de) * 1996-02-16 1997-08-21 Duerrwaechter E Dr Doduco Anordnung aus einer elektrischen Leiterplatte und einem elektrischen Druckaufnehmer

Also Published As

Publication number Publication date
JPS5817421B2 (ja) 1983-04-07
JPS55103439A (en) 1980-08-07
FR2448139A1 (fr) 1980-08-29
GB2047465B (en) 1983-05-25
FR2448139B1 (US06262066-20010717-C00315.png) 1982-12-10
GB2047465A (en) 1980-11-26
DE3003449A1 (de) 1980-08-07
US4276533A (en) 1981-06-30

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee